Shenzhen Chaosheng Electronic Technology Co.,Ltd

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Half Hole Pcb Rapid Prototyping Service Metal Edging Gold Finger 24 Layers

China Half Hole Pcb Rapid Prototyping Service Metal Edging Gold Finger 24 Layers

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Half Hole Pcb Rapid Prototyping Service Metal Edging Gold Finger 24 Layers

MOQ： 1PCS
Price： Usd6.90/pcs
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Payment Terms	T/T, Western Union
Supply Ability	2000000pcs/per month
Delivery Time	25-28day
Packaging Details	Anti-static bag + Anti-static bubble wrap + Good quality carton box
Product Areas	Aviation Products，5G
Material	FR-4, TG170, Halogen-free
Size Mm	250*362mm
Minimum Hole	0.10mm
Aspect Ratio	16:1
Product Structure	24-layer High-frequency Mixed Pressure HDI
Board Thickness	2.50mm
2.50mm	± 10%
Minimum Line Width And Space	3/3mil
Copper Thickness	1/0.5/0.5/0.5/0.5/0.5/0.5/0.5/1OZ
Surface Treatment	Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin
Provide PCB Information	Gberber, Production Requirements, MOQ Quantity
PCBA Information	BOM Report, X, Y Left Plot
TEST	100% Electrical Test Prior Shipment
Surface Finishing	ENIG
Brand Name	China chao sheng
Model Number	CSPCB1329
Certification	ISO/UL/RoHS/TS
Place of Origin	Shenzhen, Guangdong, China

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Product Details
Company Details

Product Specification


Payment Terms	T/T, Western Union	Supply Ability	2000000pcs/per month
Delivery Time	25-28day	Packaging Details	Anti-static bag + Anti-static bubble wrap + Good quality carton box
Product Areas	Aviation Products，5G	Material	FR-4, TG170, Halogen-free
Size Mm	250*362mm	Minimum Hole	0.10mm
Aspect Ratio	16:1	Product Structure	24-layer High-frequency Mixed Pressure HDI
Board Thickness	2.50mm	2.50mm	± 10%
Minimum Line Width And Space	3/3mil	Copper Thickness	1/0.5/0.5/0.5/0.5/0.5/0.5/0.5/1OZ
Surface Treatment	Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin	Provide PCB Information	Gberber, Production Requirements, MOQ Quantity
PCBA Information	BOM Report, X, Y Left Plot	TEST	100% Electrical Test Prior Shipment
Surface Finishing	ENIG	Brand Name	China chao sheng
Model Number	CSPCB1329	Certification	ISO/UL/RoHS/TS
Place of Origin	Shenzhen, Guangdong, China
High Light	smt pcb assembly ， pcb printed circuit board

24layers HDI third-order, half-hole + metal edging + gold finger pcb rapid prototyping prototype pcb service pcb service

1: Medical Bluetooth module motherboard
2: FR-4, TG170, inner and outer copper thickness 35um, minimum line width line spacing 4/4mil, hole ratio 16:1, minimum hole 0.10mm, blind hole buried hole, immersion gold, red solder resist, white
3: The board thickness is 1.80mm,
4: blind hole, resin plug hole + plating hole
Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB
Standard.
Quantities range from prototype to volume production.
100% E-Test

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

PCB, FPC process production capability

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

PCB, FPC process production capability

Technical ltem		MassProduct	Advanced Technology
		2016	2017	2018
Max.Layer Count		26L	36L	80L
Through-hole plate		2～45L	2～60L	2～80L
Max.PCBSize(in)		24*52"	25*62"	25*78.75"
The layer number of FPC		1～36L	1～50L	1～60L
Max.PCBSize(in)		9.8"*196"	9.8"*196"	10"*196"Reel to reel
Layeredplatelayer		2～12L	2～18L	2～26L
Max.PCBSize(in)		9"*48"	9"*52"	9"*62"
Combination of hard and soft layers		3～26L	3～30L	3～50L
Interconnect HDI		5+X+5Interconnect HDI	7+X+7Interconnect HDI	8+X+8,Interconnect HDI
HDI PCB		4～45L	4～60L	4～80L
Interconnect HDI		3+20+3	4+X+4Interconnect HDI	4+X+4,Interconnect HDI
Max.PCBSize(in)		24"*43"	24"*49"	25"*52"
Material		FR-4 Rogers	FR-4 Rogers	FR-4 Rogers
Base material		Halogenfree,LowDK	Halogenfree,LowDK	Halogenfree,LowDK
Build-up Material		FR-4	FR-4	FR-4
BOard,Thickness(mm)	Min.12L(mm)	0.43	0.42～8.0mm	0.38～10.0mm
	Min.16L(mm)	0.53	1.60～8.0mm	0.45～10.0mm
	Min.18L(mm)	0.63	2.0～8.0	0.51～10.0mm
	Min.52L(mm)	0.8	2.50～8.0mm	0.65～10.0mm
	MAX(mm)	3.5	10.0mm	10.0mm
Min.CoreThickness um(mil)		254"(10.0)	254"(10.0)	0.10～254(10.0mm)
Min.Build up Dielectric		38(1.5)	32(1.3)	25(1.0)
BaseCopperWeight	Inner Layer	4/1-8 OZ	4/1-15 OZ	4/1-0.30mm
	Out Layer	4/1-10 OZ	4/1-15 OZ	4/1-30 OZ
Gold thick		1～40u"	1～60u"	1～120u"
Nithick		76～127u"	76～200u"	1～250u"
Min.HOle/Land um(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

Min.Laser via/landum(mil)		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)

Min. IVH,Hole size/landum(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

DieletricThickness		38(1.5)	32(1.3)	32(1.3)
		125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes

viaoNhie(laserviaon BuriedPTH)		Yes	Yes	Yes

Laser Hole Filling		Yes	Yes	Yes

Technicalltem			Mass Product	Advanced Technolgy
			2017year	2018year	2019year
Drill hole depth ratio		ThroughHole	2017year	.40:1	.40:1
Aspet Ratio		Micro Via	.35:1	1.2:1	1.2:1
Copper Filling Dimple Size um(Mil)			10(0.4)	10(0.4)	10(0.4)
Min.LineWidth＆space		lnner Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
		Plated Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
BGAPitch mm(Mil)			0.3	0.3	0.3
Min.PTH Hole ring um(mil)			75(3mil)	62.5(2.5mil)	62.5(2.5mil)
Line Width Control		∠2.5MIL	±0.50	±0.50	±0.50
		2.5Mil≤L/W∠4mil	±0.50	±0.50	±0.50
		≦3mil	±0.60	±0.60	±0.60
Laminated structure		Layer by layer	3+N+3	4+N+4	5+N+5
		Sequential Build-up	20L Any Layer	36L Any Layer	52L Any Layer
		Multi-layer overlay	N+N	N+N	N+N
			N+X+N	N+X+N	N+X+N
		sequential Lamination	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
		Soft and hard bonding	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
PTH filling process			PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole

Company Details

Bronze Gleitlager

Bronze Sleeve Bushings

and

Graphite Plugged Bushings

from Quality China Factory

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Business Type:

Manufacturer,Importer,Exporter,Seller 


Year Established:

1997 


Total Annual:

716277898-736287698


Employee Number:

2500~2768 


Ecer Certification：

Active Member 

Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir... Chaosheng Company specializes in producing any order of HDI, high frequency mixed pressure HDI, soft and hard combined HDI, multi-layer ceramic, special size, mixed copper base, metal cladding, high and low copper, buried, buried resistance, special process, special materials High-end (PCB, FPC) cir...

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Reach Us
Shenzhen Chaosheng Electronic Technology Co.,Ltd
Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong
http://www.pcbboardservice.com/

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