Shenzhen Hansome Technology Co., Ltd.
| Payment Terms | T/T, Western Union, MoneyGram |
| Supply Ability | 100 sets per week |
| Delivery Time | 3-5 work days |
| Packaging Details | Packaging Box |
| Product Name | PUR Jetting Valve HS-PF-PUR30CC |
| Application | SMT/FPC/PCB,Assembly |
| Quality | 100% Tested |
| Warranty | 1 Year |
| Material of heat insulation block | PEEK |
| Temperature measuring method | PT100 |
| Syringe air pressure | 0~2.0Kpa |
| Brand Name | HSTECH |
| Model Number | HS-PF-PUR30CC |
| Certification | CE |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T, Western Union, MoneyGram | Supply Ability | 100 sets per week |
| Delivery Time | 3-5 work days | Packaging Details | Packaging Box |
| Product Name | PUR Jetting Valve HS-PF-PUR30CC | Application | SMT/FPC/PCB,Assembly |
| Quality | 100% Tested | Warranty | 1 Year |
| Material of heat insulation block | PEEK | Temperature measuring method | PT100 |
| Syringe air pressure | 0~2.0Kpa | Brand Name | HSTECH |
| Model Number | HS-PF-PUR30CC | Certification | CE |
| Place of Origin | CHINA |
Principle & Control
30CC PUR Jetting Valve
1.The PUR injection valve consists of a drum heating module, a pressurized cap module, a nozzle heating module, a flow path module, a valve body module and a heat dissipation module.
2.The barrel heating module carries the barrel as well as the one-stage heating with controllable temperature. The initial heating of the gel is completed.
3.The pressurized cap module seals and pressurizes the drum and controls the output pressure through the controller.
4.The heat dissipation module dissipates heat and reduces noise from the valve body.
5.The piezoelectric injection valve adopts a modular design, the part in contact with the gel is designed as the runner module, and the part not in contact with the gel is designed as the valve body module.
6. The flow path module can be changed to meet the dispensing requirements in different applications.
7.Nozzle diameters in series (from 40µm to 500µm).
8.The nozzles are categorized into flat jet type, needle type, and extension type.
9.Runner modules need to be cleaned regularly in an ultrasonic cleaner. Seals must not be immersed in organic solvents. Special tools are required to clean the nozzles to prevent damage to the nozzles.
Nozzle and barrel heating
1.The nozzle is required to be heated to a suitable temperature before dispensing. The heating device adopts two-stage heating mode.
2.Heating at the nozzle maintains the constant temperature of the gel to meet the best performance of the gel. The best performance of the colloid.
Specification
| Model | HS-PF-PUR30CC | HS-PF-PUR300CC-A/B |
| Size (L*W*H) | 116MM*96MM*218MM | 116MM*96MM*218MM |
| Weight | About 1.2kg | About 1.5kg |
| Material of heat insulation block | PEEK | PEEK |
| Temperature measuring method | PT100 | PT100 |
| Barrel Heating temperature | ≤150℃ | ≤160℃ |
| Syringe air pressure | 0~2.0Kpa | 0~2.0Kpa |
| Glue dispensing precision | ＞98% | ＞98% |
| Minimum glue line width | 0.35MM | 0.5MM |
| Viscosity range | 1~100000Cps | 1~100000Cps |
| Jet speed | 200 points/sec | 200 points/sec |
| Valve material | Super Hard Stainless Steel | Super Hard Stainless Steel |
| Nozzle material | Tungsten Steel | Tungsten Steel |
| Heating voltage | 220V | 220V |
| Seat heating temperature | ≤250℃ | ≤250℃ |
| Valve air pressure | 6.5~7.0Kpa | 6.0~7.0Kpa |
| Glue Dispensing Volume | 0.3nl | 0.3nl |
| Diameter of the most glue dispensing | 0.3MM | 0.4MM |
| Power source | Dry compressed gas | Dry compressed gas |
| Applicable liquid | PUR hot melt adhesive, silicone products, epoxy resin, etc. | Most hot melt adhesives, silicone, red glue, epoxy resin, black glue, etc. |
Advantages
1.The barrel heating is suitable for 30cc, 100cc, 300cc hot melt adhesive with different volume.
2. Modularized design, easy to replace parts, simple debugging, wide range of process applications.
3. Spray volume can be accurate to 0.3nL, spray adhesive spot consistency accuracy of up to 98%.
4. Minimum 0.17mm line width, minimum 0.15mm spot diameters of hot melt glue spraying process can be realized.
5. Can match any motion platform on the market.
Application Field
SMT/FPC/PCB,Assembly, flat panel display assembly, semiconductor packaging, LED industry, medical equipment industry,Non-marking lingerie industry.
Shenzhen Hansome Technology Co.,Ltd(HSTECH)is a professional professional SMT board handlingequipment(Loader,Unloader, Buffer, Conveyor,etc)manufacturer. We are a high-tech enterprise with independent intellectual propertyrights,the company is mainly engaged in the research and development, productionand sales of SMT/THT production line board handling equipment.
We have professional technicians & sales,relies on high-tech and tries our best tosupply high efficient and reliable board handling to our customers. At the same timeour experienced engineering team always grasps smart factory's developing direction,updates the products and technical according to the market demand, pursuit to makemore automation and cost-effective product all the time, we also do the OEM basedon different needs of our customer.
Company Details
Business Type:
Manufacturer
Year Established:
2012
Total Annual:
2,000,000.00-3,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional ... Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional ...
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