Shenzhen Hansome Technology Co., Ltd.
| Packaging Details | Wooden |
| Temperature Accuracy | ±1℃ |
| Supply Ability | 50 PC/Month |
| Overall Dimension | L450mm × W470mm × H670mm |
| Total Power | 2600W |
| Delivery Time | 7-10 work days |
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Mounting Accuracy | ±0.01mm |
| Payment Terms | T/T |
| Heater Power | Top heater 1200W(Max), bottom heater 1200W(Max) |
| Model Number | HS-700 |
| Certification | CE,ISO |
| Place of Origin | China |
| Brand Name | HSTECH |
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Product Specification
| Packaging Details | Wooden | Temperature Accuracy | ±1℃ |
| Supply Ability | 50 PC/Month | Overall Dimension | L450mm × W470mm × H670mm |
| Total Power | 2600W | Delivery Time | 7-10 work days |
| Power Supply | AC 100V / 220V±10% 50/60Hz | Mounting Accuracy | ±0.01mm |
| Payment Terms | T/T | Heater Power | Top heater 1200W(Max), bottom heater 1200W(Max) |
| Model Number | HS-700 | Certification | CE,ISO |
| Place of Origin | China | Brand Name | HSTECH |
The Mobile Phone BGA (Ball Grid Array) Rework Station is a high-performance, professional-grade repair solution designed specifically for advanced smartphone maintenance and PCB rework. Engineered to meet the rigorous demands of modern electronics repair, this station combines intelligent temperature control, high-definition optical alignment, and automated precision mechanics. Whether handling micro-BGA chips, CPU replacements, or complex motherboard repairs, this equipment ensures exceptional reliability, minimal thermal damage, and maximum operational efficiency.
| Mobile Phone BGA Rework Station | Model: HS-700 |
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Total Power | 2600W |
| Heater Power | Top heater 1200W(Max), bottom heater 1200W(Max) |
| Electric Material | Driving motor + smart temperature controller + color touch screen |
| Temperature Control | High precision K-sensor + closed loop control + independent temperature controller (precision can reach ±1℃) |
| Sensor | 1 piece |
| Locating Method | V shape PCB support + external universal fixture + laser light for centering and positioning |
| Overall Dimension | L450mm * W470mm * H670mm |
| PCB Size | Max 140mm * 160mm, Min 5mm * 5mm |
| BGA Size | Max 50mm * 50mm, Min 1mm * 1mm |
| Applicable PCB Thickness | 0.3 - 5mm |
| Mounting Accuracy | ±0.01mm |
| Machine Weight | 30KG |
| Mount Chip Weight | 150g |
| Working Modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
| Usage | Repair chips / phone motherboard etc. |
High definition and adjustable CCD color optical alignment system with beam split, amplification, lessening, fine adjustment and auto focus capabilities. Features automatic color aberration resolution and brightness adjustment, adjustable image contrast. Equipped with 15" high definition LCD monitor for optical alignment system BGA rework station.
Adopting HD touch human-machine interface with upper heating head and mounting head designed as 2-in-1 unit. Provides multiple titanium alloy BGA tuyere options that rotate 360 degrees for easy installation and replacement. X, Y and R angle adopted micrometer fine-tuning for accuracy locating with precision reaching ±0.01mm.
Includes alarm function that automatically signals after BGA welding completion. Features double over-temperature protection with automatic circuit power-off in case of temperature abuse. Temperature parameters include password protection to prevent unauthorized modifications.
This Mobile Phone BGA Rework Station is widely applicable to all kinds of mobile phone motherboard chip maintenance, including CPU, flash memory, power chip and other precision BGA chip disassembly, welding and reballing. It is also suitable for precision rework of small and medium sized electronic components, and can meet the processing needs of electronic repair stores, factory after sales maintenance, laboratory precision research and development and other scenarios.
By integrating cutting-edge optical vision systems with robust thermal management, our Mobile Phone BGA Rework Station significantly reduces manual error and boosts repair success rates. Its user-friendly smart interface allows both novice technicians and seasoned professionals to achieve factory-level precision. Backed by strict ISO quality certifications and comprehensive after-sales support, this equipment represents a reliable, long-term investment for any electronics maintenance operation.
Company Details
Business Type:
Manufacturer
Year Established:
2012
Total Annual:
2,000,000.00-3,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional ... Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional ...
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