Touch Screen USB RF TCK Series Thermal Profiler for Electronic Assembly PCB

Touch Screen USB RF TCK Series Thermal Profiler for Reflow Soldering Oven Temperature Profile Testing PCB Electronic Assembly Production

Product Introduction

The TCK Series Thermal Profiler is professional temperature profiling equipment built for SMT and electronic assembly production. Equipped with touch screen operation it supports both USB and RF wireless data transmission. This thermal profiler accurately records real‑time temperature curve when products pass through reflow oven. It captures complete thermal profile data for reflow soldering process. Operators can check temperature parameters directly on touch screen or export testing data for further analysis. It helps engineers verify reflow oven performance optimize soldering profile and avoid defective solder joints during PCB assembly production.

Standard Composition

1. Thermal profiler
2. Insulation box
3. Temperature test line
4. Data download line
5. Charger
6. Hi-temp adhesive tape
7. Software CD
8. “+” screwdriver
9. Tweezers
10. Insulated gloves
11. Solder wire
12. Scissors
13. Instrument box
14. User Manual
15. Acceptance Certificate
16. RF Transceiver (Choose Composition)
17. Wave Test System (Choose Composition)

Main Technical Specifications

1. Thermocouple: K-type thermocouple
2. Sampling interval:0.05sec---600sec Set with software
3. Record data:80000 point/channel, Can record 20 sets profile
4. Resolution: 0.1℃
5. Temperature measuring range: 0—1000℃
6. Temperature measuring accuracy: ±1.0℃
7. Total power: ≤120mW
8. Operating voltage:3.6VDC, rechargeable battery
9. Dimensions: 195(L)×82(W)×21(H)mm 195(L)×103(W)×21(H)mm
10. Insulation box:245(L)×100(W)×30(H)mm
11. Start Mode : Manual, specified time or specified temperature
12. Record mode: Monitor/Record
13. Connection mode:USB/RF
14. Software version:Profilermanager 2.0

Product Library Manager

Machine Library Manager

Solder Library Manager

Recipe Library Manager

Data analysis

PWI

Peak Temp,Times of overtop the Temp

Times of between Temp(Reflow)

Slope of between Temp(Reflow)

Slope of between Times(Wave)

Versatile Application Scenarios

The TCK Series Thermal Profiler is highly adaptable, serving critical roles across a wide spectrum of manufacturing industries:

• SMT/DIP Electronics Assembly: Essential for optimizing reflow oven and wave soldering temperature curves to prevent defects like cold solder joints or component thermal shock.
• Automotive & Appliance Coating: Precision temperature tracking for powder coating, non-stick paint, and automotive paint curing processes.
• Solar & Glass Manufacturing: Monitoring thermal profiles for solar panel lamination, glass tempering, and annealing processes.
• Industrial Curing & Heat Treatment: Accurate profiling for epoxy resin curing, UV paint baking, enamel sintering, and aluminum alloy heat treatment.

Why Choose Our TCK Series Thermal Profiler?

We understand that thermal profiling is the backbone of process quality control. The TCK Series stands out by combining industrial-grade durability with cutting-edge software analytics. Unlike basic data loggers, our profiler actively helps you optimize your process by providing actionable insights through PWI metrics and simulated curve adjustments. With a low power consumption design, long-lasting rechargeable battery, and comprehensive accessory kit (including high-temperature tape, tweezers, and insulated gloves), the TCK Series is engineered to maximize your operational efficiency and minimize process variability.

Ready to Perfect Your Thermal Process?

Don't let temperature variations compromise your product quality or yield. Upgrade to the precision and intelligence of the TCK Series Thermal Profiler. Contact us today for a customized quotation, software demonstrations, or to discuss your specific profiling requirements. Let our engineering team help you achieve the perfect thermal curve for your production line.