Shenzhen Hansome Technology Co., Ltd.
| Payment Terms | T/T,Western Union,MoneyGram |
| Supply Ability | 100 sets per month |
| Delivery Time | 7~9 work days |
| Packaging Details | Wooden package |
| Product Name | Mobile Phone BGA Rework Station |
| Warranty | 1 Year |
| Control | Touch Screen |
| Material | Aluminum Alloy |
| Signal | SMEMA |
| Total Power | 2600W |
| Power Supply | AC220V |
| Weight | 30KG |
| Brand Name | HSTECH |
| Model Number | HS-700 |
| Certification | CE |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T,Western Union,MoneyGram | Supply Ability | 100 sets per month |
| Delivery Time | 7~9 work days | Packaging Details | Wooden package |
| Product Name | Mobile Phone BGA Rework Station | Warranty | 1 Year |
| Control | Touch Screen | Material | Aluminum Alloy |
| Signal | SMEMA | Total Power | 2600W |
| Power Supply | AC220V | Weight | 30KG |
| Brand Name | HSTECH | Model Number | HS-700 |
| Certification | CE | Place of Origin | China |
High Speed Touch Screen BGA Rework Station With 5 Modes Stepping Motor CCD Color
BGA Rework Station:
BGA rework stations are specialized equipment used to remove and replace BGA components on printed circuit boards (PCBs).
BGA components are surface-mount integrated circuits (ICs) that have a grid of solder balls on the underside, which pose unique challenges during repair and rework.
Key Components:
Precision Heating System: Typically uses infrared (IR) or hot air to selectively heat the BGA component for safe removal and installation.
Component Removal and Placement Tools: Utilize vacuum nozzles or other specialized tools to gently lift and position the BGA component.
Alignment and Vision Systems: Ensure precise alignment of the BGA component during placement, often with the help of cameras and software.
Rework Platforms: Provide a secure and temperature-controlled environment for the rework process.
Rework Process:
Preparation: The PCB is secured on the rework platform, and the area around the target BGA component is prepared for rework.
Heating: The heating system is used to gradually heat the BGA component, melting the solder balls and allowing the component to be removed.
Removal: The component is carefully lifted off the PCB using specialized tools, without damaging the underlying pads or traces.
Cleaning: The PCB pads are cleaned to remove any residual solder or flux, ensuring a clean surface for the new component.
New Component Placement: The replacement BGA component is precisely aligned and placed on the PCB, then reflowed using the heating system.
Applications:
Electronics Repair and Rework: Replacing faulty or damaged BGA components on PCBs, such as those found in consumer electronics, industrial equipment, and aerospace/defense systems.
Prototype Modifications: Allowing engineers to quickly and accurately rework BGA components during the product development phase.
Production Support: Enabling the rework of BGA components during small-scale or batch production runs.
Features:
1. 5 work modes
2. 15''HD LCD monitor
3. 7''HD color touch screen
4. Stepping motor
5. CCD color optical alignment system
6.Temperature accuracy within ±1℃
7.Mounting precision within ±0.01mm
8.Repair success rate: 99% +
9. Independent research and development of single-chip control
Specification:
| Mobile Phone BGA Rework Station | Model:HS-700 |
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Total power | 2600W |
| Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
| Electric material | Driving motor + smart temp. controller + color touch screen |
| Temperature control | high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃) |
| Sensor | 1pcs |
| Locating way | V shape PCB support + external universal fixture + laser light for centering and positioning |
| Overall dimension | L450mm*W470mm*H670mm |
| PCB size | Max 140mm*160mm Min 5mm*5mm |
| BGA size | Max 50mm*50mm Min 1mm*1mm |
| Applicable PCB thickness | 0.3 - 5mm |
| Mounting accuracy | ±0.01mm |
| Weight of machine | 30KG |
| Mount chip weight | 150g |
| Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
| Usage Repair | chips / phone motherboard etc |
| BGA Rework Station | |||
Company Details
Business Type:
Manufacturer
Year Established:
2012
Total Annual:
2,000,000.00-3,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional ... Shenzhen HanSome Technology Co.,Ltd(HSTECH)was estabilished in 2012 by prefessional and experienced engineer who wroked many years in EMS company,we specilized in PCB handling equipments at first, then we develop the PCB depaneling machine and SMT cleaning machine. HSTECH not only have professional ...
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