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China factory - Chengdu Cesgate Technology Co., Ltd

Chengdu Cesgate Technology Co., Ltd

  • China,Chengdu ,Sichuan
  • Active Member

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Turnkey PCB Assembly

Manufacturer of a wide range of products which include PTFE TU872 High Frequency PCB HDI Fr4 Printed Circuit Board Matte Green,OEM ODM 2.54mm Pitch High Frequency PCB Electronic Circuit Board,14 SMT Automated Turnkey PCB Assembly ...

Quality PTFE TU872 High Frequency PCB HDI Fr4 Printed Circuit Board Matte Green for sale

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PTFE TU872 High Frequency PCB HDI Fr4 Printed Circuit Board Matte Green

  1. MOQ: 1PCS( NO MOQ)

  2. Price: Negotiable (Depends on your GERBER and BOM)

  3. Get Best Quote
Payment Terms T/T, L/C
Supply Ability 30,000pcs/month
Delivery Time 1-30 working days
Packaging Details PCB: Vacuum Packing / PCBA: ESD Packing
Product name OEM Electronic Prototype HDI Aluminum FR4 High Frequency PCB Soldering Machine
Feature HDI Aluminum
Min. line width 0.2mm, 3mi, 0.075mm, 0.075mm/0.075mm(3mil/3mil), 0.1 0mm
Min. hole size 0.20mm, 0.1mm, 8 mil, 0.254-0.40mm, 0.1mm-1mm
Surface finishing HASL, OSP, ENIG, Immersion Gold, HASL Lead Free/OSP/Soft Gold/Hard Gold
Solder mask white, blue, Green. Red. Blue. White. Black.Yellow, green, black
Copper thickness 1oz, 1/2OZ 1OZ 2OZ 3OZ, as your request, 0.5-3.0 oz, 1 Oz
Base material RO3003, RO4350, PTFE, TU872, M4, M6
Brand Name CESGATE
Model Number NA
Certification ISO9001/ ISO14001
Place of Origin China

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Quality OEM ODM 2.54mm Pitch High Frequency PCB Electronic Circuit Board for sale

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OEM ODM 2.54mm Pitch High Frequency PCB Electronic Circuit Board

  1. MOQ: 1PCS( NO MOQ)

  2. Price: Negotiable (Depends on your GERBER and BOM)

  3. Get Best Quote
Payment Terms T/T, L/C
Supply Ability 30,000pcs/month
Delivery Time 1-30 working days
Packaging Details PCB: Vacuum Packing / PCBA: ESD Packing
Product name OEM ODM Electronics Multilayer 2.54mm Pitch High Frequency PCB Assembly Service
Feature OEM And ODM
Board Thickness Single/Double:0.008±0.004”
Outer Cu Weight 0.5-4 0z
Sub-assembly Plastic,metal,screen
Min Trace/gap 0.075mm Or 3mil
Copper thickness 1oz, 1/2OZ 1OZ 2OZ 3OZ, as your request, 0.5-3.0 oz, 1 Oz
Base material FR4, Aluminum, Rogers, CEM-1, TG
Brand Name CESGATE
Model Number NA
Certification ISO9001/ ISO14001
Place of Origin China

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Quality 14 SMT Automated Turnkey PCB Assembly Surface Mount ISO9001 for sale

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14 SMT Automated Turnkey PCB Assembly Surface Mount ISO9001

  1. MOQ: 1PCS( NO MOQ)

  2. Price: Negotiable (Depends on your GERBER and BOM)

  3. Get Best Quote
Payment Terms T/T, L/C
Supply Ability 13kk solding spot/day
Delivery Time 3-7 working days
Packaging Details 1.Inner: PCB: Vacuum Packing PCBA: ESD Packing 2.Outer: Standard export carton 3.Customized package.
Product name Prototype SMT Services Quick Turn Automated Turnkey PCB Assembly Surface Mount​
Feature Quick Turn
SMT production line 14
High-end equipment FUJI NXT3/XPF laminator
Material FR4/M4/M6/Rogers/TU872/IT968
Lead time 3-7 working days
Test AOI/SPI/XRAY/First Article Inspection
Brand Name CESGATE
Model Number NA
Certification UL、IATF16949、ISO9001
Place of Origin China

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Quality IATF16949 Turnkey PCBA Circuit Board Assembly Wave Soldering for sale

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IATF16949 Turnkey PCBA Circuit Board Assembly Wave Soldering

  1. MOQ: 1PCS( NO MOQ)

  2. Price: Negotiable (Depends on your GERBER and BOM)

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Payment Terms T/T, L/C
Supply Ability 13kk solding spot/day
Delivery Time 3-7 working days
Packaging Details PCB: Vacuum Packing / PCBA: ESD Packing
Product name SMT Service PCBA Fast Delivery Turnkey PCB Assembly Wave Soldering
SMT production line 14
High-end equipment FUJI NXT3/XPF laminator
Material FR4/M4/M6/Rogers/TU872/IT968
Lead time 3-7 working days
Test AOI/SPI/XRAY/First Article Inspection
Warranty 3 months
MOQ No MOQ
Brand Name CESGATE
Model Number NA
Certification UL、IATF16949、ISO9001
Place of Origin China

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Quality AOI SPI Electronic Components Turnkey PCB Assembly DIP Plug In for sale

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AOI SPI Electronic Components Turnkey PCB Assembly DIP Plug In

  1. MOQ: 1PCS( NO MOQ)

  2. Price: Negotiable (Depends on your GERBER and BOM)

  3. Get Best Quote
Payment Terms T/T, L/C
Supply Ability 13kk solding spot/day
Delivery Time 3-7 working days
Packaging Details PCB: Vacuum Packing / PCBA: ESD Packing
Product name Reliable Authorized Traceable Components Turnkey PCB Assembly Box Build
Feature Reliable Authorized Traceable Components
SMT production line 14
High-end equipment FUJI NXT3/XPF laminator
Material FR4/M4/M6/Rogers/TU872/IT968
Max Size Of Finish Board 700*460mm
Test AOI/SPI/XRAY/First Article Inspection
ROHS CANEC1308721101
Brand Name CESGATE
Model Number NA
Certification UL、IATF16949、ISO9001
Place of Origin China

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Quality Combination Through Hole SMT Prototype Board Assembly Fast Turn for sale

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Combination Through Hole SMT Prototype Board Assembly Fast Turn

  1. MOQ: 1PCS( NO MOQ)

  2. Price: Negotiable (Depends on your GERBER and BOM)

  3. Get Best Quote
Payment Terms T/T, L/C
Supply Ability 13kk solding spot/day
Delivery Time 3-7 working days
Packaging Details PCB: Vacuum Packing / PCBA: ESD Packing
Product name Combination Through Hole Volume Production Turnkey PCB Assembly SMT Fast Turn
Feature Combination Through Hole
SMT production line 14
High-end equipment FUJI NXT3/XPF laminator
Material FR4/M4/M6/Rogers/TU872/IT968
Max Size Of Finish Board 700*460mm
Test AOI/SPI/XRAY/First Article Inspection
Inspection standard IPC Class II/ IPC Class III
Brand Name CESGATE
Model Number NA
Certification UL、IATF16949、ISO9001
Place of Origin China

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Quality Thermal Profiles BGA Rework PCB Fabrication Assembly CE FCC Rohs for sale

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Thermal Profiles BGA Rework PCB Fabrication Assembly CE FCC Rohs

  1. MOQ: 1PCS( NO MOQ)

  2. Price: Negotiable (Depends on your GERBER and BOM)

  3. Get Best Quote
Payment Terms T/T, L/C
Supply Ability 13kk solding spot/day
Delivery Time 3-7 working days
Packaging Details PCB: Vacuum Packing / PCBA: ESD Packing
Product name Thermal Profiles BGA Rework X-ray Inspection Turnkey PCB Assembly Box Build
Feature BGA Rework
SMT production line 14
High-end equipment FUJI NXT3/XPF laminator
Material FR4/M4/M6/Rogers/TU872/IT968
Max Size Of Finish Board 700*460mm
Test AOI/SPI/XRAY/First Article Inspection
Process Characteristics HDI Blind Buried Hole Process, High BGA Density, Small Hole-To-Line Spacing
Brand Name CESGATE
Model Number NA
Certification UL、IATF16949、ISO9001
Place of Origin China

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Quality Soldering Turnkey PCB Assembly And Fabrication 0.003'' Inner Layers for sale

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Soldering Turnkey PCB Assembly And Fabrication 0.003'' Inner Layers

  1. MOQ: 1PCS( NO MOQ)

  2. Price: Negotiable (Depends on your GERBER and BOM)

  3. Get Best Quote
Payment Terms T/T, L/C
Supply Ability 13kk solding spot/day
Delivery Time 3-7 working days
Packaging Details PCB: Vacuum Packing / PCBA: ESD Packing
Product name SMT DIP Soldering ROHS HASL ENIG Lead Free Turnkey PCB Assembly Fabrication
Feature SMT DIP Soldering
SMT production line 14
High-end equipment FUJI NXT3/XPF laminator
Material FR4/M4/M6/Rogers/TU872/IT968
Item Keyboard Pcb Assembly, PCBA for electronic project, Cheap turnkey prototype pcb circuit board assembly provider, Custom Circuit Board, 2 Layer Pcb
Test AOI/SPI/XRAY/First Article Inspection
QTY Support prototype and batch production
Brand Name CESGATE
Model Number NA
Certification UL、IATF16949、ISO9001
Place of Origin China

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Quality 0.07mm Turnkey PCB Fab And Assembly Manufacturers AOI SPI for sale

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0.07mm Turnkey PCB Fab And Assembly Manufacturers AOI SPI

  1. MOQ: 1PCS( NO MOQ)

  2. Price: Negotiable (Depends on your GERBER and BOM)

  3. Get Best Quote
Payment Terms T/T, L/C
Supply Ability 13kk solding spot/day
Delivery Time 3-7 working days
Packaging Details 1.Inner: PCB: Vacuum Packing PCBA: ESD Packing 2.Outer: Standard export carton 3.Customized package.
Product name PCB Fab And Assembly Custom Electronic Turnkey PCB Assembly Components Sourcin
Feature PCB Fab And Assembly
SMT production line 14
High-end equipment FUJI NXT3/XPF laminator
Material FR4/M4/M6/Rogers/TU872/IT968
Item Keyboard Pcb Assembly, PCBA for electronic project, Cheap turnkey prototype pcb circuit board assembly provider, Custom Circuit Board, 2 Layer Pcb
Test AOI/SPI/XRAY/First Article Inspection
Brand Name CESGATE
Model Number NA
Certification UL、IATF16949、ISO9001
Place of Origin China

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Quality BGA Package Solder Paste DIP Turnkey PCB Assembly 700*460mm for sale

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BGA Package Solder Paste DIP Turnkey PCB Assembly 700*460mm

  1. MOQ: 1PCS( NO MOQ)

  2. Price: Negotiable (Depends on your GERBER and BOM)

  3. Get Best Quote
Payment Terms T/T, L/C
Supply Ability 13kk solding spot/day
Delivery Time 3-7 working days
Packaging Details PCB: Vacuum Packing / PCBA: ESD Packing
Product name BGA Package Solder Paste One Stop Service SMT DIP Turnkey PCB Assembly Box Build
Feature Solder Paste
SMT production line 14
High-end equipment FUJI NXT3/XPF laminator
Material FR4/M4/M6/Rogers/TU872/IT968
Max Size Of Finish Board 700*460mm
Test AOI/SPI/XRAY/First Article Inspection
Min Space 0.075mm
Brand Name CESGATE
Model Number NA
Certification UL、IATF16949、ISO9001
Place of Origin China

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Get in touch with us

  • Reach Us
  • Chengdu Cesgate Technology Co., Ltd
  • 3602, Unit 1, Building 2, Phase 3, Longhu Zichen Xiangsong, Huazhaobi Xiaheng Street, Jinniu District, Chengdu, China
  • https://pcbprototypeservice.ecer.com/

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