DQS Electronic Co., Limited
| Payment Terms | T/T |
| Layer | 12 Layer |
| Material | PTEF/PPO/Rogers |
| Thickness | 1.0mm |
| Min. Line Width/Space | 0.1/0.1mm |
| Copper Thickness | 1.0OZ |
| Surface treatment | Immersion Gold |
| Application | Radar |
| Certificate | UL & IPC Standard & ISO |
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Product Specification
| Payment Terms | T/T | Layer | 12 Layer |
| Material | PTEF/PPO/Rogers | Thickness | 1.0mm |
| Min. Line Width/Space | 0.1/0.1mm | Copper Thickness | 1.0OZ |
| Surface treatment | Immersion Gold | Application | Radar |
| Certificate | UL & IPC Standard & ISO | ||
| High Light | fr4 circuit board PCB ，Prototype fr4 circuit board ，9Ghz rf prototype board | ||
9Ghz High Frequency Signal PCB for Millimeter Wave Radar
♦ What's High-Frequency PCB?
High-frequency PCB is a special circuit board designed for high-frequency electromagnetic scenes, suitable for high-frequency (frequency>300MHz, corresponding to wavelength <1 meter) and microwave (frequency>3GHz, corresponding to wavelength <0.1 meter) fields. It is based on microwave substrate copper clad laminate, combined with some processes of ordinary rigid circuit board manufacturing, or made through special processing.
♦ Features of High-Frequency PCB
Special materials: use low Dk/Df substrates such as PTFE, ceramic filling materials, LCP, etc. to reduce signal attenuation (PTFE is the first choice for 5G).
Precise transmission: impedance control of ±5%, micron-level line accuracy, 30%+ loss reduction in millimeter wave band, and excellent phase stability.
Complex process: laser drilling accuracy of ±3μm, plasma etching instead of pickling, multi-layer board integrated passive devices, and high-yield production in dust-free workshops.
♦ High-frequency PCB Design Principles
Impedance control: strictly match the design value (within ±10%).
Via design: use less through holes, give priority to blind and buried holes, and complete plating.
Shielding protection: key signals are grounded, and metal shielding covers are added when necessary.
Thermal management: thermal expansion coefficient matching, and heat dissipation layers are added to key areas.
♦ Technical Parameters
| Item | Specification |
| Laers | 1~32 |
| Board thickness | 0.1mm-7.0mm |
| Material | FR-4,CEM-1/CEM-3,PI,High Tg,Rogers |
| Max panel size | 32"×48"(800mm×1200mm) |
| Min hole size | 0.075mm |
| Min line width | 3mil(0.075mm) |
| Surface finish | OSP,HASL,Imm Gold/Nickel/Ag, Electric gold |
| Copper thickness | 0.5-7.0OZ |
| Soldermask | Green/Yellow/Black/White/Red/Blue |
| Silkscreen | Red/Yellow/Black/White |
| Min PAD | 5mil(0.13mm) |
| Inter package | Vacuum |
| Outer package | Carton |
| Outline tolerance | ±0.75mm |
| Hole tolerance | PTH:±0.05 NPTH:±0.025 |
| Certificate | UL,ISO 9001,ISO14001,IATF16949 |
| Special request | Blind hole+Gold finger + BGA |
| Material Suppilers | Shengyi, KB, Nanya, ITEQ,etc. |
Company Details
Business Type:
Manufacturer
Employee Number:
>800
Ecer Certification：
Verified Supplier
DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ... DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ...
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