DQS Electronic Co., Limited
| Payment Terms | T/T |
| Base material | FR-4,CEM-3,Aluminum,CEM-1 OR FR-4,Alum |
| Copper thickness | 0.5-15OZ |
| Min. line spacing | 2-3mil |
| Board thickness | 0.2-10mm |
| Min. line width | 2-3mil |
| Min. hole size | 0.1mm |
| Surface finishing | HASL,OSP,ENIG,HASL Lead Free,Immersion Gold |
| Solder mask color | Green Black Red,Blue.green.red.black.white.etc |
| PCB test | Flying probe and AOI (Default)/Fixture Test,Flying-Probe PCB test |
| Pcb assembly method | Mixed,BGA,SMT,Through-hole |
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Product Specification
| Payment Terms | T/T | Base material | FR-4,CEM-3,Aluminum,CEM-1 OR FR-4,Alum |
| Copper thickness | 0.5-15OZ | Min. line spacing | 2-3mil |
| Board thickness | 0.2-10mm | Min. line width | 2-3mil |
| Min. hole size | 0.1mm | Surface finishing | HASL,OSP,ENIG,HASL Lead Free,Immersion Gold |
| Solder mask color | Green Black Red,Blue.green.red.black.white.etc | PCB test | Flying probe and AOI (Default)/Fixture Test,Flying-Probe PCB test |
| Pcb assembly method | Mixed,BGA,SMT,Through-hole | ||
| High Light | 0.5oz wireless charger pcba ，OSP wireless charger pcba ，OSP soldering pcb board | ||
Intelligent Electronic Large Size Components Through-hole Assembly
♦ What is Through-Hole Assembly?
Through-Hole Assembly is the traditional way of installing electronic components: the component pins are inserted into the pre-drilled holes in the PCB and then fixed by soldering to achieve electrical connection.
♦ Features of Through-Hole Assembly?
♦ Technical Parameters
| PCB Assembly Capability | |||||
|
Item |
Normal |
Special | |||
|
SMT Assembly |
PCB(used for SMT) specification | Length and Width( L* W) | Minimum | L≥3mm, W≥3mm | L＜2mm |
| Maximum | L≤800mm, W≤460mm | L ＞ 1200mm, W＞500mm | |||
| Thickness( T) | Thinnest | 0.2mm | T＜0.1mm | ||
| Thickest | 4 mm | T＞4.5mm | |||
|
SMT components specification | Outline Dimension | Min size | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) | |
| Max size | 200 * 125 | 200 * 125 | |||
| component thickness | T≤15mm | 6.5mm＜T≤15mm | |||
| QFP,SOP,SOJ (multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch＜0.4mm | ||
| CSP/ BGA | Min ball space | 0.5mm | 0.3mm≤Pitch＜0.5mm | ||
|
DIP Assembly |
PCB specification |
Length and Width( L* W) | Minimum | L≥50mm, W≥30mm | L＜50mm |
| Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm | |||
| Thickness( T) | Thinnest | 0.8mm | T＜0.8mm | ||
| Thickest | 3.5mm | T＞2mm | |||
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2. Quality Guaranteed:
3. Premium Service:
Company Details
Business Type:
Manufacturer
Employee Number:
>800
Ecer Certification：
Verified Supplier
DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ... DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ...
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