DQS Electronic Co., Limited
| Payment Terms | T/T |
| Base material | FR-4 |
| Copper thickness | 2OZ |
| Min. line spacing | 3mil |
| Board thickness | 2.0mm |
| Min. line width | 0.2mm |
| Min. hole size | 0.1mm |
| Surface finishing | Immersion Gold |
| Application | Consumer Electronics,Industry/Medical/Consumer electronic |
| Solder mask color | Green Black Red,Blue.green.red.black.white.etc |
| Pcb test | Flying probe and AOI Test,Flying-Probe PCB test |
| Pcb assembly method | Mixed,BGA,SMT,Through-hole |
| Certification | ISO,UL,IATF16949,RoHs |
View Detail Information
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Product Specification
| Payment Terms | T/T | Base material | FR-4 |
| Copper thickness | 2OZ | Min. line spacing | 3mil |
| Board thickness | 2.0mm | Min. line width | 0.2mm |
| Min. hole size | 0.1mm | Surface finishing | Immersion Gold |
| Application | Consumer Electronics,Industry/Medical/Consumer electronic | Solder mask color | Green Black Red,Blue.green.red.black.white.etc |
| Pcb test | Flying probe and AOI Test,Flying-Probe PCB test | Pcb assembly method | Mixed,BGA,SMT,Through-hole |
| Certification | ISO,UL,IATF16949,RoHs | ||
| High Light | PCB micro bga package ，Integrated micro bga package ，Integrated pcb assembly bga | ||
High-Density BGA Assembly Service - Integrated Solution for Precision Welding and X-ray Inspection
♦ What is BGA Assembly?
BGA Assembly (Ball Grid Array Assembly) is a high-density packaging technology in which the chip is soldered directly to the PCB by means of an "array of miniature solder balls", like "planting" tiny solder balls on the bottom of the chip to achieve ultra-fine electrical connections.BGA Assembly is a high-density packaging technology in which the chip is soldered directly to the PCB through an array of "micro solder balls," which is like "planting" tiny solder balls on the bottom of the chip to achieve ultra-fine electrical connections.
♦ Features of BGA Assembly?
♦ Technical Parameters
| PCB Assembly Capability | |||||
|
Item |
Normal |
Special | |||
|
SMT Assembly |
PCB(used for SMT) specification | Length and Width( L* W) | Minimum | L≥3mm, W≥3mm | L＜2mm |
| Maximum | L≤800mm, W≤460mm | L ＞ 1200mm, W＞500mm | |||
| Thickness( T) | Thinnest | 0.2mm | T＜0.1mm | ||
| Thickest | 4 mm | T＞4.5mm | |||
|
SMT components specification | Outline Dimension | Min size | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) | |
| Max size | 200 * 125 | 200 * 125 | |||
| component thickness | T≤15mm | 6.5mm＜T≤15mm | |||
| QFP,SOP,SOJ (multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch＜0.4mm | ||
| CSP/ BGA | Min ball space | 0.5mm | 0.3mm≤Pitch＜0.5mm | ||
|
DIP Assembly |
PCB specification |
Length and Width( L* W) | Minimum | L≥50mm, W≥30mm | L＜50mm |
| Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm | |||
| Thickness( T) | Thinnest | 0.8mm | T＜0.8mm | ||
| Thickest | 3.5mm | T＞2mm | |||
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2. Quality Guaranteed:
3. Premium Service:
Company Details
Business Type:
Manufacturer
Employee Number:
>800
Ecer Certification：
Verified Supplier
DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ... DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ...
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