| Payment Terms | T/T |
| Layer | 12 Layer |
| Material | Rogers RT5880 |
| Thickness | 1.8 mm |
| Min. Line Width/Space | 0.1/0.1mm |
| Copper Thickness | 1OZ |
| Surface Finishing | ENIG |
| Color | Blue |
| Application | Communication System |
| Certificate | UL & IPC Standard & ISO |
| Service | One Stop Turnkey Service |
View Detail Information
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Product Specification
| Payment Terms | T/T | Layer | 12 Layer |
| Material | Rogers RT5880 | Thickness | 1.8 mm |
| Min. Line Width/Space | 0.1/0.1mm | Copper Thickness | 1OZ |
| Surface Finishing | ENIG | Color | Blue |
| Application | Communication System | Certificate | UL & IPC Standard & ISO |
| Service | One Stop Turnkey Service | ||
| High Light | Rogers rf printed circuit board ,RT5880 rf printed circuit board ,RT5880 rf prototype board | ||
Rogers RT5880 High Frequency PCB Satellite Communication System Application
♦ What's High-Frequency PCB?
High-frequency PCB is a special circuit board designed for high-frequency electromagnetic scenes, suitable for high-frequency (frequency>300MHz, corresponding to wavelength <1 meter) and microwave (frequency>3GHz, corresponding to wavelength <0.1 meter) fields. It is based on microwave substrate copper clad laminate, combined with some processes of ordinary rigid circuit board manufacturing, or made through special processing.
♦ Features of High-Frequency PCB
Special materials: use low Dk/Df substrates such as PTFE, ceramic filling materials, LCP, etc. to reduce signal attenuation (PTFE is the first choice for 5G).
Precise transmission: impedance control of ±5%, micron-level line accuracy, 30%+ loss reduction in millimeter wave band, and excellent phase stability.
Complex process: laser drilling accuracy of ±3μm, plasma etching instead of pickling, multi-layer board integrated passive devices, and high-yield production in dust-free workshops.
♦ Difficulties in High-frequency PCB Manufacturing Process
Material processing is difficult: PTFE drilling is prone to burrs, and tungsten carbide drill bits + plasma cleaning are required.
High micropore precision: small holes are prone to offset, laser drilling + electroplating filling holes.
Difficult graphic transfer: small line width is prone to deviation, LDI lithography + fine etching.
Difficult inter-layer alignment: lamination is prone to misalignment, CCD alignment control offset ≤±50μm.
Difficult surface treatment: uneven coating affects performance, and the coating thickness is strictly controlled.
♦ Technical Parameters
| Item | Specification |
| Laers | 1~32 |
| Board thickness | 0.1mm-7.0mm |
| Material | FR-4,CEM-1/CEM-3,PI,High Tg,Rogers |
| Max panel size | 32"×48"(800mm×1200mm) |
| Min hole size | 0.075mm |
| Min line width | 3mil(0.075mm) |
| Surface finish | OSP,HASL,Imm Gold/Nickel/Ag, Electric gold |
| Copper thickness | 0.5-7.0OZ |
| Soldermask | Green/Yellow/Black/White/Red/Blue |
| Silkscreen | Red/Yellow/Black/White |
| Min PAD | 5mil(0.13mm) |
| Inter package | Vacuum |
| Outer package | Carton |
| Outline tolerance | ±0.75mm |
| Hole tolerance | PTH:±0.05 NPTH:±0.025 |
| Certificate | UL,ISO 9001,ISO14001,IATF16949 |
| Special request | Blind hole+Gold finger + BGA |
| Material Suppilers | Shengyi, KB, Nanya, ITEQ,etc. |
Company Details
Business Type:
Manufacturer
Employee Number:
>800
Ecer Certification:
Verified Supplier
DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ... DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ...
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