| Payment Terms | T/T |
| Layer | 18 Layer |
| Material | PTEF+FR4 |
| Thickness | 2.0 mm |
| Min. Line Width/Space | 0.1/0.1mm |
| Copper Thickness | 1.2OZ |
| Surface treatment | Immersion Gold |
| Application | Power Detection System |
| Certificate | UL & IPC Standard & ISO |
View Detail Information
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Product Specification
| Payment Terms | T/T | Layer | 18 Layer |
| Material | PTEF+FR4 | Thickness | 2.0 mm |
| Min. Line Width/Space | 0.1/0.1mm | Copper Thickness | 1.2OZ |
| Surface treatment | Immersion Gold | Application | Power Detection System |
| Certificate | UL & IPC Standard & ISO | ||
| High Light | 2mm High Frequency PCB ,PTEF FR4 High Frequency PCB ,PTEF FR4 copper circuit board | ||
Strong Impedance Control High Frequency PCB Power Detection System
♦ What's High-Frequency PCB?
High-frequency PCB is a special circuit board designed for high-frequency electromagnetic scenes, suitable for high-frequency (frequency>300MHz, corresponding to wavelength <1 meter) and microwave (frequency>3GHz, corresponding to wavelength <0.1 meter) fields. It is based on microwave substrate copper clad laminate, combined with some processes of ordinary rigid circuit board manufacturing, or made through special processing.
♦ Features of High-Frequency PCB
Special materials: use low Dk/Df substrates such as PTFE, ceramic filling materials, LCP, etc. to reduce signal attenuation (PTFE is the first choice for 5G).
Precise transmission: impedance control of ±5%, micron-level line accuracy, 30%+ loss reduction in millimeter wave band, and excellent phase stability.
Complex process: laser drilling accuracy of ±3μm, plasma etching instead of pickling, multi-layer board integrated passive devices, and high-yield production in dust-free workshops.
♦ High-frequency PCB design principles
Material selection: low Dk (such as PTFE), low Df materials, matching frequency requirements, taking into account thermal stability and copper foil bonding.
Wiring rules: 45° routing, equal-length differential pairs, short and straight paths, control line width/spacing, reduce crosstalk and reflection.
Power ground design: multi-layer board power/ground layers are adjacent, decoupling capacitors are added nearby, and analog/digital ground is isolated by partition.
Stacking structure: 4 layers or more are preferred, and the middle layer is used as the power/ground plane to reduce parasitic parameters and shorten the signal path.
♦ Technical Parameters
| Item | Specification |
| Laers | 1~32 |
| Board thickness | 0.1mm-7.0mm |
| Material | FR-4,CEM-1/CEM-3,PI,High Tg,Rogers |
| Max panel size | 32"×48"(800mm×1200mm) |
| Min hole size | 0.075mm |
| Min line width | 3mil(0.075mm) |
| Surface finish | OSP,HASL,Imm Gold/Nickel/Ag, Electric gold |
| Copper thickness | 0.5-7.0OZ |
| Soldermask | Green/Yellow/Black/White/Red/Blue |
| Silkscreen | Red/Yellow/Black/White |
| Min PAD | 5mil(0.13mm) |
| Inter package | Vacuum |
| Outer package | Carton |
| Outline tolerance | ±0.75mm |
| Hole tolerance | PTH:±0.05 NPTH:±0.025 |
| Certificate | UL,ISO 9001,ISO14001,IATF16949 |
| Special request | Blind hole+Gold finger + BGA |
| Material Suppilers | Shengyi, KB, Nanya, ITEQ,etc. |
Company Details
Business Type:
Manufacturer
Employee Number:
>800
Ecer Certification:
Verified Supplier
DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ... DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ...
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