Payment Terms | T/T |
Supply Ability | 200,000+ m² PCB per Month |
Layer | 10 layers |
Material | Fr4 |
Thickness | 2.0 mm |
Construction | 2+N+2 |
Min. Line Width/Space | 0.1/0.1mm |
Surface Treatment | Immersion Gold |
Type | Customizable |
Application | Medical Device |
Standard | UL&IPC Standard &ISO |
View Detail Information
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Product Specification
Payment Terms | T/T | Supply Ability | 200,000+ m² PCB per Month |
Layer | 10 layers | Material | Fr4 |
Thickness | 2.0 mm | Construction | 2+N+2 |
Min. Line Width/Space | 0.1/0.1mm | Surface Treatment | Immersion Gold |
Type | Customizable | Application | Medical Device |
Standard | UL&IPC Standard &ISO | ||
High Light | 2.0mm hdi pcb board ,hdi pcb board assembly ,Inverter hdi multilayer pcb |
HDI PCB Board for Inverter with Green Solder Mask
♦ What is Solder Mask?
Solder Mask (also called solder resist or solder stop mask) is a thin, protective layer of polymer applied to the copper traces of a printed circuit board (PCB) to prevent oxidation, short circuits, and unintended solder connections during assembly.
♦ Types of Solder Mask?
Type | Description | Common Uses |
---|---|---|
Liquid Photoimageable (LPI) | Applied as a liquid, exposed to UV light, and developed (most common). | Standard PCBs, high-precision designs. |
Dry Film Solder Mask | Pre-formed film laminated onto the PCB, then UV-exposed and etched. | High-density PCBs (HDI). |
Top & Bottom Side Masks | Applied only to specific sides (e.g., single-sided PCBs). | Simple boards with limited layers. |
Peelable Solder Mask | Temporary mask that can be removed after soldering. | Selective protection during assembly. |
♦ Types of Solder Mask?
Feature | Solder Mask Covered | Exposed Copper (No Mask) | Solder Mask Defined (SMD) Pads | Non-Solder Mask Defined (NSMD) Pads |
---|---|---|---|---|
Protection | Yes | No | Partial (mask covers edges) | No (pad extends beyond mask) |
Solderability | Prevents solder spreading | Solder adheres fully | Controlled solder flow | More solder volume |
Common Use | General traces | Test points, ground pads | Fine-pitch components (BGAs, QFNs) | High-reliability soldering |
♦ Technical Parameters
Item | Spec |
Layers | 1~64 |
Board Thickness | 0.1mm-10 mm |
Material | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
Max Panel Size | 800mm×1200mm |
Min Hole Size | 0.075mm |
Min Line Width/Space | Standard: 3mil(0.075mm) Advance: 2mil |
Board Outline Tolerance | 士0.10mm |
Insulation Layer Thickness | 0.075mm--5.00mm |
Out Layer Copper Thickness | 18um--350um |
Drilling Hole (Mechanical) | 17um--175um |
Finish Hole (Mechanical) | 17um--175um |
Diameter Tolerance (Mechanical) | 0.05mm |
Registration (Mechanical) | 0.075mm |
Aspect Ratio | 17:01 |
Solder Mask Type | LPI |
SMT Min. Solder Mask Width | 0.075mm |
Min. Solder Mask Clearance | 0.05mm |
Plug Hole Diameter | 0.25mm--0.60mm |
Company Details
Business Type:
Manufacturer
Employee Number:
>800
Ecer Certification:
Verified Supplier
DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ... DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ...
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