DQS Electronic Co., Limited
| Payment Terms | T/T |
| Supply Ability | 200,000+ m² PCB per Month |
| Layer | 10 layers |
| Material | Fr4 |
| Thickness | 2.0 mm |
| Construction | 2+N+2 |
| Min. Line Width/Space | 0.1/0.1mm |
| Surface Treatment | Immersion Gold |
| Type | Customizable |
| Application | Electronic Product |
| Standard | UL&IPC Standard &ISO |
View Detail Information
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Product Specification
| Payment Terms | T/T | Supply Ability | 200,000+ m² PCB per Month |
| Layer | 10 layers | Material | Fr4 |
| Thickness | 2.0 mm | Construction | 2+N+2 |
| Min. Line Width/Space | 0.1/0.1mm | Surface Treatment | Immersion Gold |
| Type | Customizable | Application | Electronic Product |
| Standard | UL&IPC Standard &ISO | ||
| High Light | 3OZ hdi pcb fabrication ，Smartphones hdi pcb fabrication ，3OZ smartphone pcb | ||
12 Layer 3OZ High Density Interconnect HDI PCB
♦ What is High Density PCB (HDI PCB)?
A High Density Interconnect (HDI) PCB is an advanced printed circuit board designed to accommodate more components in a smaller space by using finer traces, smaller vias, and higher connection density than traditional PCBs. HDI technology enables miniaturization, improved signal integrity, and enhanced performance in modern electronics.
♦ Key Features of HDI PCBs:
✅ Finer Trace Width/Spacing (≤ 100µm, vs. standard 150µm+).
✅ Microvias (laser-drilled, < 150µm diameter) for high-density interconnects.
✅ Blind & Buried Vias (instead of through-hole vias) to save space.
✅ Thinner Dielectric Materials (for compact layer stacking).
✅ Higher Layer Count (often 8+ layers in a slim profile).
✅ Advanced Materials (low-loss dielectrics for high-speed signals).
♦ HDI PCB vs. Standard PCB: Key Differences?
| Feature | HDI PCB | Standard PCB |
|---|---|---|
| Trace Width | ≤ 100µm (can go down to 40µm) | ≥ 150µm |
| Via Size | Microvias (50–150µm) | Through-hole vias (≥ 300µm) |
| Via Types | Blind, buried, stacked | Mostly through-hole |
| Layer Count | 8+ (with thin dielectrics) | Typically 2–12 layers |
| Signal Speed | Optimized for high-speed signals | Limited high-speed performance |
| Applications | Smartphones, wearables, aerospace | Consumer electronics, power circuits |
♦ Types of HDI PCBs:
♦ Technical Parameters
| Item | Spec |
| Layers | 1~64 |
| Board Thickness | 0.1mm-10 mm |
| Material | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc |
| Max Panel Size | 800mm×1200mm |
| Min Hole Size | 0.075mm |
| Min Line Width/Space | Standard: 3mil(0.075mm) Advance: 2mil |
| Board Outline Tolerance | 士0.10mm |
| Insulation Layer Thickness | 0.075mm--5.00mm |
| Out Layer Copper Thickness | 18um--350um |
| Drilling Hole (Mechanical) | 17um--175um |
| Finish Hole (Mechanical) | 17um--175um |
| Diameter Tolerance (Mechanical) | 0.05mm |
| Registration (Mechanical) | 0.075mm |
| Aspect Ratio | 17:01 |
| Solder Mask Type | LPI |
| SMT Min. Solder Mask Width | 0.075mm |
| Min. Solder Mask Clearance | 0.05mm |
| Plug Hole Diameter | 0.25mm--0.60mm |
Company Details
Business Type:
Manufacturer
Employee Number:
>800
Ecer Certification：
Verified Supplier
DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ... DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ...
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