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Pingxiang Lianjin Cheng Technology Co., Ltd

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China Customizable High Density Interconnect HDI PCB FR-4 Material Circuit Boards With
China Customizable High Density Interconnect HDI PCB FR-4 Material Circuit Boards With

  1. China Customizable High Density Interconnect HDI PCB FR-4 Material Circuit Boards With

Customizable High Density Interconnect HDI PCB FR-4 Material Circuit Boards With

  1. MOQ: 10pcs
  2. Price: Negotiable
  3. Get Latest Price
Material FR-4
Layout 1-22 layer
Surface Finish OSP
VIPPO Via-In-Pad Plated Over
Packaging Details Carton
Delivery Time 7-10 days
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Place of Origin China
Brand Name LJC
Certification UL ISO IATF1

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  1. Product Details
  2. Company Details

Product Specification

Material FR-4 Layout 1-22 layer
Surface Finish OSP VIPPO Via-In-Pad Plated Over
Packaging Details Carton Delivery Time 7-10 days
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram Place of Origin China
Brand Name LJC Certification UL ISO IATF1
High Light Customizable FR-4 Material HDI PCBFR-4 High Density Interconnect HDI PCBHdi Circuit Boards With VIPPO
High-Density Interconnect (HDI) Technology
Characterized by microvias with a diameter ≤0.15mm, High-Density Interconnect (HDI) employs advanced fine-line patterning and microvia formation technologies to enable component interconnection within ultra-compact form factors. The architectural design—featuring minimized conductor geometries and optimized layer stacking—facilitates a wiring density an order of magnitude higher than conventional printed circuit boards (PCBs), critical for high-performance miniaturized systems.

 

Electrical performance is substantially enhanced through precise control of parasitic effects: reduction of residual stub inductance, elimination of discrete decoupling capacitors via integrated power/ground planes, and mitigation of crosstalk through controlled impedance routing. Furthermore, the strategic placement of adjacent ground planes—enabled by HDI’s thin dielectric layers—reduces radiated electromagnetic interference (RFI/EMI) by minimizing loop inductance and ensuring uniform distributed capacitance, thereby optimizing signal integrity across high-frequency transmission paths.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2010

  • Total Annual:

    140,000,000-168,000,000

  • Employee Number:

    1200~2000

  • Ecer Certification:

    Verified Supplier

Pingxiang Lianjin Cheng Technology Co., Ltd(LJC), established in 2010, is a professional Printed  Circuit Board(PCB) manufacturer in China. It specializes in manufacturing double-sided, multi-layer and high-density interconnect (HDI) boards. The floor area of LJC is more than 150,000m², an... Pingxiang Lianjin Cheng Technology Co., Ltd(LJC), established in 2010, is a professional Printed  Circuit Board(PCB) manufacturer in China. It specializes in manufacturing double-sided, multi-layer and high-density interconnect (HDI) boards. The floor area of LJC is more than 150,000m², an...

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  • Pingxiang Lianjin Cheng Technology Co., Ltd
  • Lianjincheng 5G Industrial Park, Ganxiang Cooperative Park, Jinshan Town Shangli County, Pingxiang City 337009, China
  • https://www.pcbsboard.com/

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