Smart Card Milling / Linear Filling / IC Chip Embedding Machine

Product Specification

1500kg Weight Contact Card Production Line Smart Card Milling / Linear Filling Machine / IC Chip Embedding Machine

Feature:

This machine is used to mill the slot on standard card which use to embed different kinds of modules. And at the same time, test, glue and punch different modules and implant them into milled cavities for IC embedding. Only need one operator, stable and easy to adjust.In the machine structure, the machine is easy to operate and maintain, which enhances the service life of machine and the productivity. The appearance and style of the machine is concise and easy, rationalization and hommization, and the user-friendly operator interface protect the safety of operators. We can also design the different style appearance according to different requirement. We offer the perfect after-sale service and technical follow-up, and provide paid lifelong maintenance.

Main function:

1. Integration of cavities milling, vacuum cleaning, depth detection, spot welding, module punching, embedding and testing.

2. Specialized fixture design to ensure the accuracy of milling depth without any influences from card thickness and size.

3. Pre-set with four standard module milling programs which may be called according to actual requirements, with parameters to be modified at ease.

4. Two groups of X,Y,Z axis, it can be choose the first layer and second layer milling separately, which has improved manufacturing efficiency and get rid of the difficulty of modifying the center position while milling.

5. Z-Axis moving is realized through guide rail and the screw driven by high precision servomotor to provide accurate milling depth, eliminating complicated process of tool changing.

6. Testing the slot position before embedding, it embeds when the card have been milled while don not embeds when the card haven’t been milled no card.

7. Module Tape stepping is monitored by accurate sensor to identify good and faulty modules automatically.

8. Unique plane structure and several heating heads for hot pressing, solving the problem that hot melt adhesive is hard to apply. No plane adjustment is required to change hot pressing head.

9. Modules are conveyed by the servo driven high-precision guide rail and screw, with position to be changed through direct modification of parameters.

10. Unique plane structure of hot pressing head ensures no delaminating, and the hot welding head with X and Y directions fine-tuning function. When changing a soldering head, no needs to adjust the plane again. Groups of hot pressing head ensure quality of the embedding.

11. Modules are conveyed by the servo driven belt, ensuring safety and stability.

12. Tailored software design makes the operation easy and simple.

13. Module ATR detection device ensures acceptable embedding rate.

14. Unique card feeding design avoids feeding of double cards which would happen due to static electricity.

15. Identify good and faulty modules automatically, reject and collect the faulty modules automatically.

16. Testing the basal card before hot welding, It won’t be welded without chip.

17. With the double card testing function.

Technical Parameters: