Shenzhen Betterliv Technology Co., Ltd.
Products
Manufacturer of a wide range of products which include 5.6mm Power Bank Pcb Circuit 1 Layer To 20 Layers 100 E Testing,5.6mm Power Bank Pcb Circuit 1 Layer To 20 Layers 100 E Testing,OEM ODM Rigid Printed Power PCBA For Power Supp...
MOQ:
Price:
| Payment Terms | T/T, Western Union, Credit Card |
| Supply Ability | |
| Delivery Time | |
| Packaging Details | |
| Product name | Power Supply Module Design PCBA |
| Silkscreen Color | Black.white.yellow.red.blue |
| SMT Efficiency | BGA.QFP.SOP.QFN.PLCC.CHIP |
| Board Thickness | 0.8-5.6mm |
| Min. Hole Size | 0.2mm |
| Surface Finishing | HALS/HALS OSP etc |
| Testing Service | 100% E-testing |
| Brand Name | Betterliv/OEM |
| Model Number | OEM |
| Certification | CE FCC ROHS |
| Place of Origin | Shenzhen,China |
MOQ:
Price:
| Payment Terms | T/T, Western Union, Credit Card |
| Supply Ability | |
| Delivery Time | |
| Packaging Details | |
| Product name | Power Supply Module Design PCBA |
| Silkscreen Color | Black.white.yellow.red.blue |
| SMT Efficiency | BGA.QFP.SOP.QFN.PLCC.CHIP |
| Board Thickness | 0.8-5.6mm |
| Min. Hole Size | 0.2mm |
| Surface Finishing | HALS/HALS OSP etc |
| Testing Service | 100% E-testing |
| Brand Name | Betterliv/OEM |
| Model Number | OEM |
| Certification | CE FCC ROHS |
| Place of Origin | Shenzhen,China |
MOQ:
Price:
| Payment Terms | T/T, Western Union, Credit Card |
| Board Thickness | 2.0mm |
| Min. Line Width | 0.08mm |
| Copper Thickness | 1/2 oz-4 oz |
| Max production size | 600*800mm |
| Base Material: | FR-4 |
| Board Thicknes | 0.2-4.0mm |
| SMT/DIP service: | 0.3mm IC,BGA,QFP,0201 components |
| Surface Finishing | Hassel |
| Brand Name | Betterliv/OEM |
| Model Number | OEM |
| Certification | CE FCC ROHS |
| Place of Origin | Shenzhen,China |
MOQ:
Price:
| Payment Terms | T/T, Western Union, Credit Card |
| Board Thickness | 2.0mm |
| Min. Line Width | 0.08mm |
| Copper Thickness | 1/2 oz-4 oz |
| Max production size | 600*800mm |
| Base Material: | FR-4 |
| Board Thicknes | 0.2-4.0mm |
| SMT/DIP service: | 0.3mm IC,BGA,QFP,0201 components |
| Surface Finishing | Hassel |
| Brand Name | Betterliv/OEM |
| Model Number | OEM |
| Certification | CE FCC ROHS |
| Place of Origin | Shenzhen,China |
MOQ:
Price:
| Payment Terms | T/T, Western Union, Credit Card |
| Board Thickness | 0.2mm-4.5mm |
| Min. Line Width | 0.08mm |
| Copper Thickness | 1/2 oz-4 oz |
| Finish Hole Size: | PTH ±0.003'' ,NPTH ±0.002" |
| Base Material: | FR4 CEM1 CEM3 Ceramic Aluminum |
| Board Thicknes | 0.2-4.0mm |
| SMT/DIP service: | 0.3mm IC,BGA,QFP,0201 components |
| Surface Finishing | HASL-LF/OSP/ENIG etc |
| Brand Name | Betterliv/OEM |
| Model Number | OEM |
| Certification | CE FCC ROHS |
| Place of Origin | Shenzhen,China |
MOQ:
Price:
| Payment Terms | T/T, Western Union, Credit Card |
| Board Thickness | 0.2mm-4.5mm |
| Min. Line Width | 0.08mm |
| Copper Thickness | 1/2 oz-4 oz |
| Finish Hole Size: | PTH ±0.003'' ,NPTH ±0.002" |
| Base Material: | FR4 CEM1 CEM3 Ceramic Aluminum |
| Board Thicknes | 0.2-4.0mm |
| SMT/DIP service: | 0.3mm IC,BGA,QFP,0201 components |
| Surface Finishing | HASL-LF/OSP/ENIG etc |
| Brand Name | Betterliv/OEM |
| Model Number | OEM |
| Certification | CE FCC ROHS |
| Place of Origin | Shenzhen,China |
MOQ:
Price:
| Payment Terms | T/T, Western Union, Credit Card |
| Board Thickness | 0.2mm-4.5mm |
| Min. Line Width | 0.08mm |
| Copper Thickness | 1/2 oz-4 oz |
| Finish Hole Size: | PTH ±0.003'' ,NPTH ±0.002" |
| Base Material: | FR4 CEM1 CEM3 Ceramic Aluminum |
| Board Thicknes | 0.2-4.0mm |
| SMT/DIP service: | 0.3mm IC,BGA,QFP,0201 components |
| Surface Finishing | HASL-LF/OSP/ENIG etc |
| Brand Name | Betterliv/OEM |
| Model Number | OEM |
| Certification | CE FCC ROHS |
| Place of Origin | Shenzhen,China |
MOQ:
Price:
| Payment Terms | T/T, Western Union, Credit Card |
| Board Thickness | 0.2mm-4.5mm |
| Min. Line Width | 0.08mm |
| Copper Thickness | 1/2 oz-4 oz |
| Finish Hole Size: | PTH ±0.003'' ,NPTH ±0.002" |
| Base Material: | FR4 CEM1 CEM3 Ceramic Aluminum |
| Board Thicknes | 0.2-4.0mm |
| SMT/DIP service: | 0.3mm IC,BGA,QFP,0201 components |
| Surface Finishing | HASL-LF/OSP/ENIG etc |
| Brand Name | Betterliv/OEM |
| Model Number | OEM |
| Certification | CE FCC ROHS |
| Place of Origin | Shenzhen,China |
MOQ:
Price:
| Payment Terms | T/T, Western Union, Credit Card |
| Board Thickness | 0.2mm-4.5mm |
| Min. Line Width | 0.08mm |
| Copper Thickness | 1/2 oz-4 oz |
| Finish Hole Size: | PTH ±0.003'' ,NPTH ±0.002" |
| Base Material: | FR4 CEM1 CEM3 Ceramic Aluminum |
| Board Thicknes | 0.2-4.0mm |
| SMT/DIP service: | 0.3mm IC,BGA,QFP,0201 components |
| Surface Finishing | HASL-LF/OSP/ENIG etc |
| Brand Name | Betterliv/OEM |
| Model Number | OEM |
| Certification | CE FCC ROHS |
| Place of Origin | Shenzhen,China |
MOQ:
Price:
| Payment Terms | T/T, Western Union, Credit Card |
| Board Thickness | 0.2mm-4.5mm |
| Min. Line Width | 0.08mm |
| Copper Thickness | 1/2 oz-4 oz |
| Finish Hole Size: | PTH ±0.003'' ,NPTH ±0.002" |
| Base Material: | FR4 CEM1 CEM3 Ceramic Aluminum |
| Board Thicknes | 0.2-4.0mm |
| SMT/DIP service: | 0.3mm IC,BGA,QFP,0201 components |
| Surface Finishing | HASL-LF/OSP/ENIG etc |
| Brand Name | Betterliv/OEM |
| Model Number | OEM |
| Certification | CE FCC ROHS |
| Place of Origin | Shenzhen,China |
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