Shenzhen ECER Network Technology Co., Ltd.
| Stock | 1185 |
| Interface Form | M.2-M Key |
| Mounting Type | Surface Mount, Right Angle |
| Delivery Time | 1 working day |
| Description | 67P Surface Mount, Right Angle SMD,P=0.5mm,Surface Mount,Right Angle Centronics Connectors RoHS |
| Packaging Details | SMD,P=0.5mm,Surface Mount,Right Angle |
| Number of Pins | 67P |
| Connector Type | Female |
| Brand Name | 91302-32-067RDM |
| Model Number | 91302-32-067RDM |
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Product Specification
| Stock | 1185 | Interface Form | M.2-M Key |
| Mounting Type | Surface Mount, Right Angle | Delivery Time | 1 working day |
| Description | 67P Surface Mount, Right Angle SMD,P=0.5mm,Surface Mount,Right Angle Centronics Connectors RoHS | Packaging Details | SMD,P=0.5mm,Surface Mount,Right Angle |
| Number of Pins | 67P | Connector Type | Female |
| Brand Name | 91302-32-067RDM | Model Number | 91302-32-067RDM |
This specification covers the performance, tests, and quality requirements for the PCI Express M.2 connector. The product is designed to meet electrical, mechanical, and environmental performance requirements.
| Specification | Requirement | Procedure |
|---|---|---|
| Working Voltage (per pin) | < 36 VAC | - |
| Voltage (per pin) | 50 VAC | - |
| Current (per pin) | 0.5 Amperes | - |
| Operating Temperature | -40C to 80C | - |
| Low Level Contact Resistance (Initial) | 55 m max. | EIA-364-23 |
| Low Level Contact Resistance (Final) | 20 m max. change allowed | EIA-364-23 |
| Insulation Resistance | 500 M min. | EIA-364-21 |
| Dielectric Withstanding Voltage | No Breakdown (Current leakage: 1 mA max.) | EIA-364-20 (300V AC min. at sea level for 1 minute) |
| Mating Force | 2.55 Kgf Max. | EIA-364-13, Method A |
| Reseating | Appearance: No damage | Manually mated/unmated the connector or socket perform 3 cycles. |
| Durability (Au plating) | 60 mate/unmate cycles (15" & 30" Au plating) | EIA-364-09 |
| Durability (Gold flash plating) | 25 mate/unmate cycles | EIA-364-09 |
| Durability (precondition) | No evidence of physical damage | EIA-364-09 (5 mate/unmate cycles) |
| Temperature Rise | 0.5A / power contact with 30 C MAX. change allowed | EIA-364-70, Method 2 |
| Vibration | 1.0 microsecond max. | EIA-364-28, Condition VII, Condition letter D |
| Shock (Mechanical) | 1.0 microsecond max. | 250 G (Ultrabook) and 285 G (Tablet) at 2 milliseconds half sine on all six axis. |
| Cyclic Temperature & Humidity | See Product Qualification and Test Sequence Group 2 | EIA-364-31, Method III |
| Thermal Shock | See Product Qualification and Test Sequence Group 2 | EIA-364-32, method A test condition I |
| Temperature Life | See Product Qualification and Test Sequence Group 1 | EIA-364-17, method A (105C for 120 hours) |
| Temperature Life (precondition) | No physical damage | EIA-364-17, method A (105C for 72 hours) |
| MFG | No physical damage and functional failed | EIA-364-65 class IIA (7 days to simulate a 5 year field life) |
| Thermal Disturbance | See Product Qualification and Test Sequence Group 8 | 10 cycles (153C to 853C) |
| Solderability (Tin plating) | Min. of 95% solder coverage | EIA-364-52 (2455C, for 4-5 sec.) |
| Solderability (Gold plating) | Min. of 75% solder coverage | EIA-364-52 (2455C, for 4-5 sec.) |
| Hand Soldering Resistance | Appearance: No damage | T350C, 3 sec. at least. |
| Resistance to reflow soldering heat | See Product Qualification and Test Sequence Group 10 (Lead Free) | Pre Heat: 150~180C, 60~120 sec. Heat: 230C Min., 40 sec. Min. Peak Temp.: 260C Max., 10 sec. Max. (2 reflow cycles) |
| Test or Examination | Group 1 | Group 2 | Group 3 | Group 4 | Group 5 | Group 6 | Group 7 | Group 8 | Group 9 | Group 10 |
|---|---|---|---|---|---|---|---|---|---|---|
| Examination of product | 1, 6, 9 | 1, 6, 9, 12 | 1, 6, 9 | 1, 7 | 1, 4 | 1, 3 | 1, 7 | 1, 12 | 1, 3 | 1, 3 |
| Low level contact resistance | 2, 5, 8 | 2, 5, 8, 11 | 2, 5, 8 | 2, 6 | 2, 4, 6 | 2, 5, 7, 9, 11 | - | - | - | - |
| Insulation resistance | 2 | - | - | - | - | - | - | - | - | - |
| Dielectric withstanding voltage | 3 | - | - | - | - | - | - | - | - | - |
| Mating / Unmating Force | 3, 5 | - | - | - | - | - | - | - | - | - |
| Durability | 4 | - | - | - | - | - | - | - | - | - |
| Durability (precondition) | 3 | 3 | 3 | 3 | 3 | - | - | - | - | - |
| Temperature Rise | - | - | - | - | - | - | - | - | - | - |
| Vibration | - | - | - | - | - | - | - | - | - | - |
| Shock (Mechanical) | 5 | - | - | - | - | - | - | - | - | - |
| Reseating | - | - | - | - | - | - | - | - | - | - |
| Thermal Shock | - | 4 | - | - | - | - | - | - | - | - |
| Cyclic Temperature & Humidity | - | 7 | - | - | - | - | - | - | - | - |
| Temperature Life | - | 4 | - | 4 | - | - | - | - | - | - |
| Temperature Life (precondition) | - | 4 | - | 4 | - | - | - | - | - | - |
| MFG | - | - | - | - | - | 6 | - | - | - | - |
| Solderability | - | - | 2 | - | - | - | - | - | - | - |
| Thermal Disturbance | - | - | - | - | - | - | 8 | - | - | - |
| Resistance to reflow soldering heat | - | - | - | - | - | 2 | - | - | - | - |
Company Details
Business Type:
Manufacturer
Year Established:
2009
Total Annual:
100000000-20000000
Employee Number:
500~600
Ecer Certification：
Verified Supplier
Shenzhen ECER Network Technology Co., Ltd. is a professional supplier specializing in industrial and power connectors for industrial automation, power systems, electrical equipment, control systems, machinery, and other demanding applications. We focus on providing reliable connector solutions for... Shenzhen ECER Network Technology Co., Ltd. is a professional supplier specializing in industrial and power connectors for industrial automation, power systems, electrical equipment, control systems, machinery, and other demanding applications. We focus on providing reliable connector solutions for...
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