Alumina Ceramic Mounting Substrates: The Ideal Platform For High-Performance

Product Specification

Alumina Ceramic Mounting Substrates: The Ideal Platform For High-Performance Circuits

Introduction
Alumina ceramic mounting substrates are circuit carrier substrates made from high-purity aluminum oxide (Al₂O₃) through precision ceramic processes. They serve not only as mechanical supports for electronic components but also as critical elements for electrical connections, insulation, and heat dissipation. Due to their exceptional thermal conductivity, high insulation properties, excellent mechanical strength, and thermal stability, they have become the preferred material for high-power, high-frequency, and high-reliability electronic products.

Applications
Their applications span various high-end electronic fields:

• Power Modules: Heat dissipation and insulation substrates for IGBTs, power modules, laser diodes (LD), and light-emitting diodes (LEDs).

• Microelectronic Packaging: Used as chip-on-board (COB) substrates for RF modules, communication components, and automotive electronic control units (ECUs).

• Semiconductor Manufacturing: Applied in semiconductor process equipment, such as electrostatic chucks (ESCs) and heating plates.

• Aerospace and Military: Circuit systems with high reliability requirements, including radar, navigation, and communication equipment.

• Sensors: Base materials for pressure and temperature sensors in high-temperature and high-pressure environments.

Advantages

• Excellent Electrical Insulation: High dielectric strength ensures effective circuit isolation and device safety.

• High Thermal Conductivity: Rapidly dissipates heat generated by components, preventing overheating and enhancing product lifespan and stability.

• Low Thermal Expansion Coefficient (CTE): Matches the thermal expansion coefficient of silicon chips, reducing thermal stress and improving connection reliability.

• High Mechanical Strength: High hardness, wear resistance, and corrosion resistance provide robust mechanical support.

• Stable Chemical Performance: Resistant to acids, alkalis, and molten metal erosion, suitable for harsh environments.

Specification Parameters Table

Note: The above parameters are common ranges and can be customized according to customer requirements.

Process Flow
Ceramic powder preparation → Tape casting or dry pressing → High-temperature co-firing → Laser cutting → CNC precision grinding → Ultrasonic cleaning → Surface metallization (screen printing/coating/DPC, etc.) → Pattern etching → Electroplating thickening → Final inspection.

Usage Instructions

1. Soldering: Reflow soldering or vacuum sintering is recommended, with strict control of temperature profiles to avoid thermal shock.

2. Cleaning: Use isopropyl alcohol or deionized water for ultrasonic cleaning. Avoid strong acids and alkalis.

3. Handling: Wear gloves during handling to prevent oil contamination. Handle with care to avoid brittle fracture.

4. Storage: Store in a constant temperature, humidity-controlled, and dust-free environment to prevent oxidation of the metallization layer.

After-Sales Service
We offer a 12-month product quality warranty; free technical consultation and application support; free repair or replacement for non-human-related product quality issues; and lifelong technical tracking services through customer档案 management.

FAQ

1. Q: Can alumina substrates be drilled and processed into complex shapes?
   A: Yes. Advanced laser processing and CNC grinding technologies enable high-precision micro-holes, blind holes, and complex shapes.

2. Q: How to choose between alumina substrates and aluminum nitride (AlN) substrates?
   A: Alumina substrates offer cost-effectiveness and excellent overall performance, suitable for most applications. Aluminum nitride substrates provide higher thermal conductivity (approximately 170-200 W/(m·K)) but at a higher cost, making them ideal for extremely high-power-density scenarios.

3. Q: What is the bonding strength of the metallization layer?
   A: We use high-temperature co-firing or advanced thin-film processes (such as DPC) to ensure extremely high bonding strength between the metal layer and ceramic substrate, meeting requirements for brazing and wire bonding.

4.