Payment Terms | T/T |
Supply Ability | 1kkpcs/month |
Delivery Time | 25 work days |
Packaging Details | 400pcs/bag, 20bags/carton |
Blind Hole | L2-L3 0.2MM |
Buried Hole | L1-L2 0.1MM , L3-L4 0.1MM |
Layer Count | 4 Layer |
Material | FR4 |
Surface Treatment | OSP+Immersion Gold |
Solder Mask | Green |
Brand Name | WITGAIN PCB |
Model Number | S04E3698A0 |
Certification | UL Certificate |
Place of Origin | China |
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Product Specification
Payment Terms | T/T | Supply Ability | 1kkpcs/month |
Delivery Time | 25 work days | Packaging Details | 400pcs/bag, 20bags/carton |
Blind Hole | L2-L3 0.2MM | Buried Hole | L1-L2 0.1MM , L3-L4 0.1MM |
Layer Count | 4 Layer | Material | FR4 |
Surface Treatment | OSP+Immersion Gold | Solder Mask | Green |
Brand Name | WITGAIN PCB | Model Number | S04E3698A0 |
Certification | UL Certificate | Place of Origin | China |
High Light | electronic pcb board ,copper clad pcb board |
4 Layer Printed Circuit Board With Blind And Buried Holes , Half Hole PCB , OSP+ENIG
4 Layer Printed Circuit Board With Blind And Buried Holes
PCB Specifications:
Layer Count: 4Layer Half Plated Hole PCB
Board Thickness: 1.0MM
Material: FR4
Copper Thickness: 1/H/H/1OZ
Min Hole: 0.1MM
Min Line: 3/3 Mil
BGA Size: 8Mil
Unit Size: 82*109.6MM/20UP
Hole: L1-L4, L2-L3, L3-L4, L1-L2
Min Distance Between Inner Layer Line to Holes: 5Mil
Solder Mask: Green
Surface Treatment: ENIG+OSP(OSP for BGA Pads)
Special Treatment: Half Plated Holes
Application: GPS Module
Capabilities:
Item | Capability |
Layer Count | 1-24 Layers |
Board Thickness | 0.1mm-6.0mm |
Finished Board Max Size | 700mm* 800mm |
Finished Board Thickness Tolerance | +/-10% +/-0.1(<1.0mm) |
Warp | <0.7% |
Major CCL Brand | KB/NanYa/LTEQ/ShengYi/Rogers Etc |
Material Type | FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET |
Drill Hole Diameter | 0.1mm-6.5mm |
Out Layer Copper Thickness | 1/20Z-8OZ ; |
Inner Layer Copper Thickness | 1/3OZ-6OZ |
Aspect Ratio | 10:1 |
PTH Hole Tolerance | +/-3mil |
NPTH Hole Tolerance | +/-1mil |
Copper Thickness Of PTH Wall | >10mil(25um) |
Line Width And Space | 2/2mil |
Min Solder Mask Bridge | 2.5mil |
Solder Mask Alignment Tolerance | +/-2mil |
Dimension Tolerance | +/-4mil |
Max Gold Thickness | 200u'(0.2mil) |
Thermal Shock | 288C, 10s, 3 Times |
Impedance Contro | +/-10% |
LTest Capability | PAD Size Min 0.1mm |
Min BGA | 7mil |
Surface Treatment | OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable |
FAQ:
Question: What is the most common quality issue for this kinf of pcb?
Answer: 1) Copper burr in half holes
2) Oxidation in half holes
Question: Why use surface treatment ENIG+OSP?
Answer: OSP has good tin solder paste feature . The BGA size is only 8mil. If use immersion gold, it's not good for tin solder paste. So we suggest customer to use ENIG+OSP. It can protect other pads well and meanwhile, it makes sure that the BGA pads have good tin solder paste feature.
Question: Is the cost for ENIG+OSP higher than ENIG?
Answer: Yes it is. But it won't make a big difference.
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
20000000-25000000
Employee Number:
300~350
Ecer Certification:
Active Member
Witgain Technology Ltd was established in 2007 in ShenZhen City. After over 10 years development, the company now posses two factories. One factory located in HuiZhou City which is near to ShenZhen. The other one locates in JiangXi Province. Marketing dept still locates in ShenZhen City. ... Witgain Technology Ltd was established in 2007 in ShenZhen City. After over 10 years development, the company now posses two factories. One factory located in HuiZhou City which is near to ShenZhen. The other one locates in JiangXi Province. Marketing dept still locates in ShenZhen City. ...
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