Custom Designs PCB Manufacturing Solutions High Precision OEM / ODM

Product Specification

Versatile PCB Solutions: Custom Designs and High Precision

PCB Manufacturing Introduction:

Experience the pinnacle of PCB manufacturing with our extensive range of materials, from FR4 and aluminum to copper and ceramic substrates. We offer 1 to 12-layer boards with finished plate thickness starting at 0.07mm, ensuring high precision with a tolerance of +5%/-6%. Inner layer copper thickness spans from 18-70μm, while outer layers boast 20-140μm, ensuring optimal performance.

Choose from an array of vibrant solder-resist colors and letters for your design needs. Our advanced surface treatments, including anti-oxidation, immersion gold, and more, cater to diverse requirements. Explore specialized processes like impedance control and single-layer copper foil gold finger plates for unique applications.

With reinforcements like Pl, FR4, steel sheets, and electromagnetic shielding film, we ensure structural integrity. Our PCBs are crafted with meticulous attention to detail, maintaining minimum solder resist ring width, solder bridge width, solder mask window, and aperture specifications. Experience reliable performance with impedance tolerance of 10% and shape tolerance of +0.05mm G laser +0.005mm.

Our PCBs are manufactured using forming methods such as V-cut, CNC, and punching, catering to various fabrication needs. Revolutionize electronics with precision, reliability, and innovation.

PCB Manufacturing Parameters:

PCB Manufacturing Process:

1. Gold-plating process: the vertical HASL process is very difficult to flatten very thin pads, which brings difficulty to SMT placement. In addition, the shelf life of the HASL is very short, and gold-plating just solves the problem. these problems.

2. Immersion gold process: The purpose of the immersion gold process is to deposit a nickel-gold coating with stable color, good brightness, flat coating and good solderability on the surface of the printed circuit board. Basically, it can be divided into four stages: pre-treatment (oil extraction, micro-etching, activation, post-immersion), nickel immersion, gold immersion, and post-treatment (waste gold washing, DI washing, drying)

3. Leaded HASL: Leaded eutectic temperature is lower than lead-free, the specific amount depends on the composition of the lead-free alloy, such as the total gold of SNAGCU 217 degrees, the soldering temperature is the eutectic immersion plus 30 degrees or 50 degrees, It depends on the actual adjustment, the lead eutectic is 183 degrees, the mechanical strength, brightness, etc. are better than lead-free.

4. Lead-free HASL: lead will increase the activity of tin wire in the soldering process, lead-tin wire is better than lead-free tin wire, but lead is poisonous, long-term use is not good for human health, and lead-free tin will It is brighter than lead-tin melting, so the solder joint is much stronger.

5. SOP (anti-oxidation): It has anti-oxidation, thermal shock resistance, and corrosion resistance. It is used to protect the copper surface from rusting (oxidation or carbonization) in a normal environment: but in the subsequent welding high temperature, this protection The film must be easily removed quickly by the flux so that the exposed clean copper surface can be melted and soldered immediately in a short time to become a firm solder joint.

PCB Manufacturing Advantages:

1. From PCB proofing to SMT placement, one-stop solution, reducing R&D costs and accelerating product launch.

2. Quick quotation and quick response.

3. The delivery date is fast, and the on-time delivery rate is over 95%

4. Excellent materials, advanced equipment, and strict quality system 5. Exclusive customer service one-to-one service, seamless connection throughout the process