SMT standard surface mount soldering inspection production line (integrated

Product Specification

Product Description
This product is an SMT automated production line that covers the entire process of PCB board loading, printing, solder paste inspection, surface mount technology (SMT) placement, soldering, inspection, and unloading. It integrates core equipment such as a board loading machine, 1.0 docking station, printing machine, SPI, SMT placement machine, leveling machine, reflow soldering, AOI, and unloading machine. Through the intelligent control system, seamless linkage of each link is achieved, completing the fully automated operation of PCB boards from raw material loading to finished product unloading. It meets the requirements of conventional electronic component mounting and soldering, ensuring the mounting accuracy and soldering quality while realizing the efficient operation of the production process.

Product advantages
Full-process automation: From PCB board loading to finished product unloading, no human intervention is required, covering the entire process from loading, printing, solder paste inspection, surface mount technology (SMT) placement, soldering, inspection to unloading. Production efficiency is increased by more than 50%, reducing labor costs and quality risks.
Multi-device precise collaboration: The printing machine, SPI, surface mount technology (SMT) placement machine, reflow soldering machine, and AOI are efficiently connected through a 1.0 docking station. The production cycle is stable, and the placement accuracy is ≤±0.03mm, meeting the precision requirements of conventional SMT production.
Basic process control: The printing machine adopts closed-loop control technology. SPI is used for basic solder paste inspection. Reflow soldering is equipped with a zone-based temperature control system. AOI is used for full inspection of defects after soldering to ensure consistency in quality at all stages.
High cost-performance configuration: The equipment configuration meets the conventional SMT production requirements. Under the premise of ensuring basic performance, it reduces equipment investment costs and is suitable for the construction of SMT production lines in small and medium-sized enterprises.

Product features
The loading machine and the unloading machine achieve automatic loading and unloading of PCB boards, which is easy to operate.
The printing accuracy of the printing machine is ≤±0.03mm, and it is suitable for the printing of conventional 0201 and above components.
SPI detects basic parameters such as solder paste thickness and area, with a detection accuracy rate of ≥99%.
The surface mount technology (SMT) placement machine supports multi-nozzle operation and is compatible with conventional SMT component placement.
The temperature control accuracy of the reflow soldering zone is ±2℃, and the soldering yield is ≥98%.
AOI equipment can identify common defects such as false soldering, bridging, and missing components, with a detection accuracy rate of ≥99%.

Application scenarios
The conventional PCB board assembly and soldering production in the electronics manufacturing industry, such as small-batch production of consumer electronics, basic production of industrial control boards, and electronic component contract manufacturing, is particularly suitable for small and medium-sized enterprises with high requirements for cost control and basic production efficiency.