Full-process SMT (Surface Mount Technology) automated production line equipment

Product Specification

Full-process SMT (Surface Mount Technology) automated production line equipment

Equipment Composition and Functionality

Loading and Pre-processing Stage

PCB Loading and Unboxing Machine: Automates the unboxing and feeding of printed circuit boards (PCBs), supplying initial materials to the production line and initiating the manufacturing process.

AOI Pre-inspection Machine: Performs optical inspection of PCBs prior to placement, identifying defects such as board flaws and pad anomalies. This pre-emptively removes non-conforming items, safeguarding subsequent process quality.

0.6 Waste Paper Collection Station: Gathers waste paper or scrap tape generated during pre-processing to maintain production line tidiness.

Placement and Soldering Process

Multiple Placement Machines: Utilise high-precision vision systems to pick resistors, capacitors, chips and other components, placing them accurately onto PCB pads. Coordinated operation of multiple placement machines enables simultaneous handling of diverse placement tasks (small components, irregularly shaped components), enhancing production efficiency.

2.0 Placement Conveyor: Ensures stable PCB transfer between multiple placement machines, enabling continuous placement operations.

Dual-Track Reflow Oven: Utilises multi-zone heating (preheating, reflow, cooling) to melt and solidify solder paste, achieving permanent component-to-PCB bonding; the ‘dual-track’ design processes PCBs from two production lines simultaneously, significantly boosting output.

Inspection and Unloading Section

Post-AOI Inspection Machine: Performs optical inspection on PCBs post-soldering to identify defects such as cold solder joints, bridging, and component misalignment, ensuring stringent quality control.

1.2 Paper Feeder, Lift, and Conveyor Belt: Coordinates with inspection equipment to unload, sort (good/defective), and transport PCBs, enabling automated end-of-line collection.

Return Line: Facilitates reflow processing for defective or rework-required PCBs, enhancing material utilisation.

Production Line Features

End-to-End Automation: Fully automated operation from PCB loading, pre-inspection, placement, soldering to post-inspection and unloading. This substantially boosts production efficiency and product consistency while reducing labour costs.

High Precision and High Throughput: Placement machines feature micron-level positioning accuracy, accommodating 01005 ultra-micro component placement. Dual-track reflow ovens coordinate with multiple placement machines, adapting to large-scale production scenarios (e.g., batch manufacturing of mobile phone and tablet motherboards).

End-to-End Quality Control: A dual AOI inspection mechanism combining pre-inspection and post-inspection ensures product quality is monitored at both the source and final stages, minimising the risk of defective products entering circulation. The return line design facilitates rework processing for faulty items, enhancing production flexibility.

This production line is suitable for large-scale SMT manufacturing in consumer electronics, automotive electronics and other sectors. It efficiently completes the entire automated placement and soldering process for PCBs, serving as core equipment for achieving intelligent, large-scale production in the electronics manufacturing industry.