Thermal Conductive Optically Clear Potting Compound Electrical Insulation UL94

High thermal conductivity and electrical insulation UL94-V0 Thermal potting compound                                          

Product Description

BZ-3900-G3.5 is a room-temperature/hot-curing addition-curing silicone material. This two-component elastic silicone is engineered for potting and protecting electronic components under harsh conditions, featuring: a thermal conductivity of 3.5W/m K (meeting most power electronics' thermal requirements), excellent high-frequency electrical performance, easy repairability, flame-retardant V0 rating, and reduced mechanical stress from thermal shocks and vibrations.

Key Product Features

1. It can be cured at room temperature or under heating without generating any by-products during the curing reaction.It can be applied to surfaces of materials such as PC (poly carbonate), ABS, PVC, and metal.
2. High thermal conductivity with a thermal conductivity of 3.5 W/m K, meeting the thermal requirements of power devices or modules.
3. The main problems are solved, such as heat dissipation, insulation protection, mechanical support and environmental sealing of high power density devices.
4. Enhance the waterproof, anti-shock and heat dissipation performance of electronic products, protect them from the erosion of natural environment, and prolong their service life;
5. Flame-retardant UL94-V0 certified, compliant with both RoHS and REACH regulations.

Technical Parameters 

Product Applications

1. Photovoltaic Inverter:

       As the primary heat-generating component in photovoltaic inverters, power devices such as IGBT/SiC modules and high-frequency transformers generate substantial heat during operation. The encapsulation material effectively reduces thermal resistance and balances temperature distribution. Additionally, the potting compound provides excellent shock resistance, absorbs mechanical vibrations, and prevents solder joint cracking. Its superior insulation properties also mitigate risks of high-voltage creepage or short circuits.

2. High-frequency transformers/inductors:

       The potting compound primarily addresses issues such as temperature rise caused by high-frequency losses, magneto-induced vibration noise, insulation aging, and environmental protection.

3. Energy Storage System:

       The thermal management of potting compound can balance the temperature difference of battery cells (target <5°C) and delay thermal diffusion; the fixed structure of potting compound suppresses cell expansion/vibration and prevents connector loosening; under extreme external conditions, potting compound ensures internal environmental sealing, moisture-proofing, and corrosion resistance, while also providing electrical isolation to block arc paths.

Directions for Use

1. Pre-potting Preparation: Calibrate scales, prepare potting tools, cleaning tools, check machine settings, check vacuum pump force, etc. 
2. Product Pre-treatment: Place product on a level surface or fixture. Remove dust, clean, degrease, and dry if necessary.
3. Accurate Proportioning: Manual operation requires precise mixing according to the specified ratio and recording. Machine potting requires calibrated ratios and first-article confirmation is recommended.
4. Mixing & Stirring: Manual operation requires thorough stirring or using electric stirrers to ensure homogeneous mixing. Machine potting requires sufficient stirring speed, adjust as needed.
5. Uniform Potting: Manual operation should be done in small, multiple batches to ensure uniformity. Machine potting should follow the programmed path for quantitative dispensing.
6. Inspection or Secondary Potting: After potting, visually inspect as needed. Perform touch-up, bubble removal, or secondary potting if required.
7. Curing: Allow the potted and inspected products to cure at room temperature or with heat assistance (recommended 60°C if needed), according to product and process requirements.
8. Final Product Confirmation: Perform visual inspection and performance testing as required by the customer.

    

    

   9. This series of products are room-temperature-curing, addition-cure two-component silicone. During the dispensing process, avoid contact with the following three types of materials to prevent reactions that may affect the curing effect:

       a. Organotin compounds and organotin-containing silicone rubber.

       b. Sulfur, sulfides, and sulfur-containing materials.

       c. Amine compounds and amine-containing materials.

    

     10. It should be noted that during manual operation, when vacuumizing the mixed A+B adhesive, the vacuum pressure must be controlled to ensure the adhesive is not completely sucked out of the container by the vacuum.

Packing & Shipping & Storage

1. Part A: Typically supplied in 25kg sealed plastic drums.
2. Part B: Typically supplied in 25kg sealed plastic drums.
3. Store and transport as a general chemical product.
4. Store sealed, protected from light at room temperature. Shelf life varies from 6 to 12 months depending on packaging; please refer to the expiry date on the shipping package.
5. When temperature drops to 15°C or lower, the hardener or resin should be stored in a warm place or heated before use for potting. Specific heating recommendations depend on the temperature drop; please communicate and consult with us.

FAQ:

Q1: What are Thermal Conductive Adhesive Compounds used for?

A1: Thermal Conductive Adhesive Compounds are used to bond components while efficiently transferring heat away from sensitive electronic parts, ensuring optimal thermal management in devices such as LEDs, CPUs, and power modules.

Q2: What materials can Thermal Conductive Adhesive Compounds bond?

A2: These compounds can bond a variety of materials including metals, ceramics, plastics, and electronic components, providing strong adhesion along with excellent thermal conductivity.

Q3: How do Thermal Conductive Adhesive Compounds improve device performance?

A3: By facilitating efficient heat dissipation from heat-generating components, these adhesives prevent overheating, improve reliability, and extend the lifespan of electronic devices.

Q4: Are Thermal Conductive Adhesive Compounds electrically conductive?

A4: Most Thermal Conductive Adhesive Compounds are electrically insulating to prevent short circuits, while still offering high thermal conductivity to manage heat effectively.

Q5: What is the typical curing process for Thermal Conductive Adhesive Compounds?

A5: The curing process varies by product, but generally involves room temperature curing or heat curing at elevated temperatures to achieve optimal adhesion and thermal performance.