Beijing Guangtian Runze Technology Co., Ltd.
| Packaging Details | box |
| Payment Terms | L/C, D/A, D/P, T/T |
| Memory type | DDR4 3200 |
| Type | Rack |
| Supply Ability | 10000 Piece/Pieces per Month |
| Specification | 2U rack server |
| Delivery Time | 7 |
| Processor Type | Intel Xeon |
| Model Number | R750 |
| Place of Origin | china |
| Brand Name | dells |
View Detail Information
Explore similar products
EMC PowerEdge R860 Server with Intel Xeon Platinum 8444H 2U Rack
PowerEdge R860 2U Rack Server with Four Intel Xeon CPUs
PowerEdge R860 2U Rack Server with Four Intel Xeon Scalable Processors
Intel Xeon Platinum 8444H 2U Rack Server with 128GB DDR5 4800MT/s
Product Specification
| Packaging Details | box | Payment Terms | L/C, D/A, D/P, T/T |
| Memory type | DDR4 3200 | Type | Rack |
| Supply Ability | 10000 Piece/Pieces per Month | Specification | 2U rack server |
| Delivery Time | 7 | Processor Type | Intel Xeon |
| Model Number | R750 | Place of Origin | china |
| Brand Name | dells |
PowerEdge R750
The PowerEdge R750, is a full-featured enterprise server, delivering outstanding performance for the most demanding workloads.The
PowerEdge R750, powered by the 3rd Generation Intel® Xeon® Scalable processors is a rack server to address application performance
and acceleration. The PowerEdge R750, is a dual-socket/2U rack server that delivers outstanding performance for the most demanding
workloads. It supports 8 channels of memory per CPU, and up to 32 DDR4 DIMMs @ 3200 MT/s speeds. In addition, to address
substantial throughput improvements the PowerEdge R750 supports PCIe Gen 4 and up to 24 NVMe drives with improved air-cooling
features and optional Direct Liquid Cooling to support increasing power and thermal requirements. This makes the PowerEdge R750 an
ideal server for data center standardization on a wide range of workloads including; Database and Analytics, Highperformance
computing (HPC), Traditional corporate IT, Virtual Desktop Infrastructure, and AI/ML environments that require performance,
extensive storage and GPU support.
| Processor | Up to two 3rd Generation Intel Xeon Scalable processors, with up to 40 cores per processor |
| Memory | • 32 DDR4 DIMM slots, supports RDIMM 2 TB max or LRDIMM 8 TB max, speeds up to 3200 MT/s • Up to 16 Intel Persistent Memory 200 series (BPS) slots, 8 TB max • Supports registered ECC DDR4 DIMMs only |
| Storage controllers | • Internal controllers: PERC H745, HBA355I, S150, H345, H755, H755N • Boot Optimized Storage Subsystem (BOSS-S2): HW RAID 2 x M.2 SSDs 240 GB or 480 GB • Boot Optimized Storage Subsystem (BOSS-S1) HW RAID 2 x M.2 SSDs 240 GB or 480 GB • External PERC (RAID): PERC H840, HBA355E |
| Drive Bays | Front bays: • Up to 12 x 3.5-inch SAS/SATA (HDD/SSD) max 192 TB • Up to 8 x 2.5-inch NVMe (SSD) max 122.88 TB • Up to 16 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 245.76 TB • Up to 24 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 368.84 TB Rear bays: • Up to 2 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 30.72 TB • Up to 4 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 61.44 TB |
| Power Supplies | • 800 W Platinum AC/240 mixed mode • 1100 W Titanium AC/240 mixed mode • 1400 W Platinum AC/240 mixed mode • 2400 W Platinum AC/240 mixed mode |
| Cooling Options | Air cooling, optional processor liquid cooling |
| Fans | • Standard fan/High performance SLVR fan/High performance GOLD fan • Up to six hot plug fans |
| Dimensions | • Height – 86.8 mm (3.41 inches) • Width – 482 mm (18.97 inches) • Depth – 758.3 mm (29.85 inches) - without bezel 772.14 mm (30.39 inches) - with bezel |
| Form Factor | 2U rack server |
| Embedded Management | • iDRAC9 • iDRAC Service Module • iDRAC Direct • Quick Sync 2 wireless module |
| Bezel | Optional LCD bezel or security bezel |
| OpenManage Software | • OpenManage Enterprise • OpenManage Power Manager plugin • OpenManage SupportAssist plugin • OpenManage Update Manager plugin |
| Mobility | OpenManage Mobile |
| Security | • Cryptographically signed firmware • Secure Boot • Secure Erase • Silicon Root of Trust • System Lockdown (requires iDRAC9 Enterprise or Datacenter) • TPM 1.2/2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ |
| Embedded NIC | 2 x 1 GbE LOM |
| Network Options | 1 x OCP 3.0 (x8 PCIe lanes) |
| GPU Options | Up to two double-width 300 W, or four single-width 150 W, or six single-width 75 W accelerators |
| PCIe | Up to 8 x PCIe Gen4 slots (up to 6 x16) with support for SNAP I/O modules |
Company Details
Business Type:
Distributor/Wholesaler,Agent,Importer,Trading Company
Year Established:
2012
Total Annual:
1500-3000
Employee Number:
200~500
Ecer Certification：
Verified Supplier
Beijing Guangtian Runze Technology Co., Ltd. was established in March 2012, with a registered capital of 20 million yuan. Mainly engaged in the sale of the full range of DELL products and after-sales service, after years of continuous efforts the company has developed into, with more than 100 channe... Beijing Guangtian Runze Technology Co., Ltd. was established in March 2012, with a registered capital of 20 million yuan. Mainly engaged in the sale of the full range of DELL products and after-sales service, after years of continuous efforts the company has developed into, with more than 100 channe...
Get in touch with us
Leave a Message, we will call you back quickly!