| Model NO. | 1206 |
| Life | 50000h |
| LED Chips | CREE |
| Transport Package | Tape Reel |
| Specification | SMD |
| Trademark | JF |
| Origin | China |
| HS Code | 85411000 |
| Supply Ability | 10000000000piece/Year |
| Package Size | 20.00cm * 40.00cm * 15.00cm |
| Package Gross Weight | 8.000kg |
| Delivery Time | Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays |
| Payment Terms | LC, T/T, PayPal |
| Certification | ISO9001:2015, ISO14001:2015, IATF16949 |
| Place of Origin | China |
View Detail Information
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Product Specification
| Model NO. | 1206 | Life | 50000h |
| LED Chips | CREE | Transport Package | Tape Reel |
| Specification | SMD | Trademark | JF |
| Origin | China | HS Code | 85411000 |
| Supply Ability | 10000000000piece/Year | Package Size | 20.00cm * 40.00cm * 15.00cm |
| Package Gross Weight | 8.000kg | Delivery Time | Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays |
| Payment Terms | LC, T/T, PayPal | Certification | ISO9001:2015, ISO14001:2015, IATF16949 |
| Place of Origin | China |
LED Lamp Bead
Electronics Component
Major Parameter:
Luminous Flux: 40-60 lm
Forward Voltage: 2.8-3.4V
Color Rendering Index: 70-90
View Angle: 120 deg.
Color Temperature: 2500-10000K
Brand: JF
Package: 1206
Manufacturer: JINAN JINGHENG ELECTRONICS CO., LTD![]()
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Company Details
Business Type:
Manufacturer,Trading Company
Year Established:
1997
Total Annual:
100000000-500000000
Employee Number:
500~600
Ecer Certification:
Verified Supplier
Jinan Jingheng Electronics Co., Ltd. Was founded in 1958 with more than 60 years history, and is one of the largest semiconductor manufacturers in China. There is the most complete semiconductor industrial chain in Jingheng Electronics, including chip R&D, lead frame production, device packaging... Jinan Jingheng Electronics Co., Ltd. Was founded in 1958 with more than 60 years history, and is one of the largest semiconductor manufacturers in China. There is the most complete semiconductor industrial chain in Jingheng Electronics, including chip R&D, lead frame production, device packaging...
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