Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G) |
| Layer count | 12 layers |
| PCB thickness | 2.12mm |
| PCB size | 220mm x 60mm per unit (tolerance: ±0.15mm) |
| Silkscreen | White |
| Solder mask | Blue |
| Copper weight | Outer Layers (L1, L12): 1oz (1.4 mils / 35μm)Inner Layers: 0.5oz (0.7 mils / 17μm) or 1oz (35μm) (per stack-up) |
| Surface finish | Electroless Nickel Immersion Gold (ENIG) |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G) | Layer count | 12 layers |
| PCB thickness | 2.12mm | PCB size | 220mm x 60mm per unit (tolerance: ±0.15mm) |
| Silkscreen | White | Solder mask | Blue |
| Copper weight | Outer Layers (L1, L12): 1oz (1.4 mils / 35μm)Inner Layers: 0.5oz (0.7 mils / 17μm) or 1oz (35μm) (per stack-up) | Surface finish | Electroless Nickel Immersion Gold (ENIG) |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | 12-layer M6 PCB with ENIG ，impedance control multilayer circuit board ，high speed PCB with warranty | ||
This 12-layer rigid PCB is engineered with Panasonic Megtron6 (M6) R-5775—an advanced high-speed, low-loss copper-clad laminate (CCL)—to deliver exceptional signal integrity and reliability for demanding high-frequency applications.
PCB Details
| Parameter | Specification |
| Layer Count | 12-layer rigid PCB |
| Base Material | Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G) |
| Board Dimensions | 220mm x 60mm per unit (tolerance: ±0.15mm) |
| Finished Board Thickness | 2.12mm |
| Copper Weight | Outer Layers (L1, L12): 1oz (1.4 mils / 35μm)Inner Layers: 0.5oz (0.7 mils / 17μm) or 1oz (35μm) (per stack-up) |
| Via Plating Thickness | 25μm |
| Minimum Trace/Space | 3 mils / 3 mils |
| Minimum Hole Size | 0.2mm |
| Vias | 459 total (no blind vias); 0.2mm & 0.4mm vias filled with resin + capped plating |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Silkscreen | Top (L1): White; Bottom (L12): White |
| Solder Mask | Top (L1): Blue; Bottom (L12): Blue |
| Quality Assurance | 100% Electrical test prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Quality Standard | IPC-Class-3 |
Precise PCB Stack-up
| Layer Type | Specification | Thickness |
| Copper Layer (Outer Top - L1) | Copper_layer_1 | 35μm (1oz) |
| Prepreg | R-5670(G) 1080 (68%) × 1 | 81.4μm |
| Copper Layer (Inner - L2) | Copper_layer_2 | 35μm (1oz) |
| Megtron6 Core | M6 Core R5775G(HVLP) | 75μm |
| Copper Layer (Inner - L3) | Copper_layer_3 | 17μm (0.5oz) |
| Prepreg | R-5670(G) 3313 (59%) × 2 | 219.9μm |
| Copper Layer (Inner - L4) | Copper_layer_4 | 17μm (0.5oz) |
| Megtron6 Core | M6 Core R5775G(HVLP) | 75μm |
| Copper Layer (Inner - L5) | Copper_layer_5 | 17μm (0.5oz) |
| Prepreg | R-5670(G) 3313 (59%) × 2 | 216.5μm |
| Copper Layer (Inner - L6) | Copper_layer_6 | 35μm (1oz) |
| Megtron6 Core | M6 Core R5775G(HVLP) | 400μm (thick core for stability) |
| Copper Layer (Inner - L7) | Copper_layer_7 | 35μm (1oz) |
| Prepreg | R-5670(G) 3313 (59%) × 2 | 215.6μm |
| Copper Layer (Inner - L8) | Copper_layer_8 | 17μm (0.5oz) |
| Megtron6 Core | M6 Core R5775G(HVLP) | 75μm |
| Copper Layer (Inner - L9) | Copper_layer_9 | 17μm (0.5oz) |
| Prepreg | R-5670(G) 3313 (59%) × 2 | 219.8μm |
| Copper Layer (Inner - L10) | Copper_layer_10 | 17μm (0.5oz) |
| Megtron6 Core | M6 Core R5775G(HVLP) | 75μm |
| Copper Layer (Inner - L11) | Copper_layer_11 | 35μm (1oz) |
| Prepreg | R-5670(G) 1080 (68%) × 1 | 81.4μm |
| Copper Layer (Outer Bottom - L12) | Copper_layer_12 | 35μm (1oz) |
Critical Impedance Control (50 Ohm Single-Ended)
| Impedance ID | Configuration | Layer | Trace Width | Reference Layers | Target Impedance |
| Impedance-1 | Single-Ended | L1 (Top Outer) | 5.71 mils | Down: L2 | 50 Ohms |
| Impedance-2 | Single-Ended | L3 (Inner) | 4.31 mils | Upper: L2; Down: L4 | 50 Ohms |
| Impedance-3 | Single-Ended | L5 (Inner) | 4.71 mils | Upper: L4; Down: L7 | 50 Ohms |
| Impedance-4 | Single-Ended | L8 (Inner) | 4.51 mils | Upper: L7; Down: L9 | 50 Ohms |
| Impedance-5 | Single-Ended | L10 (Inner) | 4.31 mils | Upper: L9; Down: L11 | 50 Ohms |
Megtron6 (M6) R-5775 Material Overview
Panasonic Megtron6 (M6) R-5775 is a premium multilayer copper-clad laminate (CCL) engineered for high-frequency, high-speed, and high-reliability electronic systems. Designed to address the stringent demands of 5G, millimeter-wave, and high-performance computing (HPC) applications, it combines low dielectric loss (Df), stable dielectric constant (Dk), and exceptional thermal reliability—enabling seamless transmission of high-speed signals with minimal attenuation.
As a halogen-free, RoHS-compliant material, Megtron6 aligns with green manufacturing standards while supporting 4–30 layer PCB designs, making it versatile for complex circuit architectures. Its compatibility with traditional FR-4 processing technology eliminates the need for special equipment, reducing production costs without compromising performance.
Key Features of Megtron6 (M6) R-5775
| Property | Specification |
| Dielectric Constant (Dk) | 3.4 (1GHz/23°C); 3.34 (13GHz) |
| Dissipation Factor (Df) | 0.002 (1GHz/23°C); 0.0037 (13GHz) |
| Coefficient of Thermal Expansion (CTE) | X-axis: 16 ppm/°C; Y-axis: 16 ppm/°C; Z-axis: 45 ppm/°C |
| Glass Transition Temperature (Tg) | >185°C (DSC method); 210°C (DMA method) |
| Thermal Decomposition Temperature (Td) | 410°C (TGA method) |
| Layer Support | 4–30 layer multilayer PCB designs |
| Environmental Compliance | RoHS-compliant; Halogen-free |
| Manufacturing Compatibility | Traditional FR-4 processing (no special equipment required) |
| Flammability Rating | UL 94 V-0 |
Typical Applications
This 12-layer Megtron6 PCB is tailored for high-performance, high-frequency systems across industries:
-5G Communication: Millimeter-wave antennas, AAU (Active Antenna Unit) RF front-ends, and 5G base station hardware.
-Automotive Electronics: 77GHz millimeter-wave radar, ADAS (Advanced Driver-Assistance Systems), and autonomous driving sensors.
-Data Centers: High-speed server motherboards, 400G/800G optical module PCBs, and high-bandwidth interconnects.
-Aerospace & Defense: Satellite communication systems, high-frequency radar circuits, and avionics.
-Consumer Electronics: Wi-Fi 6E/7 routers, AR/VR devices, and high-performance computing peripherals.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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