LP11BCS2000 1X1 SFP+ Cage With Grounding Pin EMI Spring Finger

1. What is the LINK-PP LP11BCS2000?

The LP11BCS2000 is a 1×1 SFP+ cage designed to securely house SFP and SFP+ transceiver modules in networking and telecommunications equipment. It provides mechanical retention, EMI shielding, and grounding functions while supporting data rates up to 16 Gb/s.

2. What data rates does the LP11BCS2000 support?

The LP11BCS2000 supports data transmission rates up to 16 Gb/s, making it suitable for 10 Gigabit Ethernet, 16G Fibre Channel, storage networking, and other high-speed communication applications.

3. Does the LP11BCS2000 include EMI shielding features?

Yes. The cage incorporates both internal and external EMI springs along with EMI spring fingers to minimize electromagnetic interference and improve signal integrity in high-density networking environments.

4. What mounting method does the LP11BCS2000 use?

The LP11BCS2000 uses a Through-Hole Technology (THT) solder termination method with a right-angle PCB mounting design, providing strong mechanical retention and reliable grounding performance.

5. Does the LP11BCS2000 include a heatsink?

No. The LP11BCS2000 is supplied without an integrated heatsink. It is intended for applications where additional thermal management is either unnecessary or provided elsewhere in the system design.

6. Does the LP11BCS2000 include light pipes?

No. This model does not feature integrated light pipes for LED indication. Customers requiring light-pipe versions should contact LINK-PP for alternative SFP+ cage configurations.

7. What material is used to manufacture the LP11BCS2000?

The cage is manufactured from 0.25 mm copper alloy and features a nickel-plated surface finish. This construction provides excellent durability, corrosion resistance, conductivity, and EMI shielding performance.

8. What is the operating temperature range of the LP11BCS2000?

The LP11BCS2000 is designed to operate within a temperature range of -55°C to +85°C, making it suitable for industrial, enterprise, and telecommunications applications.

9. What grounding features are included in the LP11BCS2000?

The cage includes dedicated grounding pins and 11 chassis grounding points that help improve EMC performance, reduce noise, and provide a reliable ground connection between the cage and PCB.

10. Is the LP11BCS2000 RoHS compliant?

Yes. The LP11BCS2000 complies with RoHS Directive 2011/65/EU and is manufactured using environmentally compliant materials.

11. Which transceiver modules are compatible with the LP11BCS2000?

The LP11BCS2000 is designed for industry-standard SFP+ transceiver modules and can be used in applications requiring SFP, SFP+, and many 16G Fibre Channel optical modules that conform to standard SFP+ mechanical specifications.

12. What applications is the LP11BCS2000 commonly used in?

Typical applications include:

• 10G Ethernet switches
• Data center networking equipment
• Enterprise routers
• Storage area networks (SANs)
• Telecom transmission systems
• Industrial Ethernet devices
• Network interface cards (NICs)
• Optical communication equipment

13. Why choose the LINK-PP LP11BCS2000 SFP+ Cage?

Key advantages include:

• Up to 16 Gb/s performance
• Robust nickel-plated copper alloy construction
• Internal and external EMI spring protection
• Integrated grounding pin design
• Wide operating temperature range
• RoHS-compliant materials
• Industry-standard SFP+ compatibility
• Reliable THT mounting for demanding environments

14. Can LINK-PP provide custom SFP+ cage solutions?

Yes. LINK-PP offers customized SFP, SFP+, SFP28, QSFP+, and QSFP-DD cage solutions, including options with light pipes, heatsinks, EMI shielding variations, and customized mechanical configurations for OEM and ODM projects.