Product Specification

Multi-Wire Diamond Sawing Machine for SiC / Sapphire / Ultra-Hard Brittle Materials

Overview of  multi-wire diamond sawing machine

The multi-wire diamond sawing machine is an advanced precision slicing solution engineered for extremely hard and fragile materials. By utilizing multiple diamond-embedded wires arranged in parallel, the system is capable of cutting numerous wafers simultaneously, ensuring high efficiency and accuracy. It is widely adopted in the processing of silicon carbide (SiC), sapphire, gallium nitride (GaN), quartz, and technical ceramics, making it indispensable in semiconductor, photovoltaic, and LED industries for large-scale production.

Unlike single-wire cutting equipment, this multi-wire platform enables tens to hundreds of slices per cycle, boosting throughput while maintaining excellent surface integrity (Ra < 0.5 μm) and dimensional accuracy (±0.02 mm). Its modular structure incorporates automatic wire-tension control, workpiece handling, and real-time monitoring, making it well-suited for continuous industrial operations.

Technical Specifications of multi-wire diamond sawing machine

Working Principle of multi-wire diamond sawing machine

1. Multi-Wire Motion System
   Diamond wires run synchronously at speeds up to 1500 m/min, guided by precision pulleys. Closed-loop control maintains wire tension (15–130 N), minimizing risk of breakage and deviation.

2. Precision Feed & Positioning
   High-resolution servo motors ensure ±0.005 mm positioning accuracy. Optional laser or vision alignment provides superior results for complex geometries.

3. Cooling & Chip Removal
   High-pressure fluid (water/oil-based) cools the cutting zone and removes debris, preventing micro-cracks and extending coolant usability via multi-stage filtration.

4. Intelligent Control System
   B&R servo drivers (<1 ms response) adjust wire speed, feed rate, and tension dynamically. Recipe management and one-touch switching simplify production.

Key Advantages of multi-wire diamond sawing machine

1. High-Throughput Cutting
   Wire speeds up to 1500 m/min enable 50–200 slices per operation, increasing productivity 5–10× over single-wire systems. Kerf loss <100 μm boosts material utilization by up to 40%.

2. Intelligent Precision Control
   Tension control accuracy of ±0.5 N ensures stable cutting across various hard substrates. 10" HMI panel displays real-time process data with recipe storage and remote monitoring functions.

3. Flexible Modular Design
   Supports wire diameters from 0.12–0.45 mm for different cutting stages. Robotic loading/unloading is available for automated mass production.

4. Industrial Durability
   Rigid cast/forged machine frame limits deformation (<0.01 mm). Ceramic-coated or tungsten carbide guide wheels deliver >8000 hours of service life.

Application Areas of multi-wire diamond sawing machine

• Semiconductors: SiC wafers for EV power modules, GaN substrates for 5G RF chips.

• Photovoltaics: High-speed cutting of silicon ingots with thickness uniformity ±10 μm.

• LED & Optics: Sapphire substrates for LED epitaxy and optical components with edge chipping <20 μm.

• Advanced Ceramics: Alumina and AlN slicing for aerospace heat-management parts.

Q&A of Multi-Wire Diamond Saw Cutting Machine

Q1: What materials can this machine cut?

A1: It is designed for ultra-hard and brittle materials such as SiC, GaN, sapphire, quartz, ceramics, and mono/polycrystalline silicon. Applications cover semiconductors, photovoltaics, LEDs, and advanced ceramics.

Q2: What are the advantages compared to a single-wire saw?

A2:

• Cuts dozens to hundreds of wafers per cycle, 5–10× higher throughput;

• Kerf loss <100 μm, increasing material utilization by 30–40%;

• Maintains high precision (±0.02 mm) and excellent surface quality (Ra <0.5 μm).

Q3: How is cutting accuracy ensured?

A3:

• High-speed B&R servo drives with <1 ms response;

• Closed-loop wire tension control (15–130 N);

• Servo-driven worktable with ±0.005 mm positioning accuracy;

• Optional vision/laser alignment for complex geometries.

Q4: What is the maximum processing capacity?

A4:

• Square workpiece: 220 × 200 × 350 mm;

• Round workpiece: Φ205 × 350 mm;

• Wire speed up to 1500 m/min;

• 50–200 slices per run, depending on material and wire diameter.

Q5: How does cooling and debris removal work?

A5:

• High-pressure water- or oil-based coolant reduces thermal effects;

• Multi-stage filtration extends coolant life;

• Effectively minimizes edge chipping and micro-cracks.

Q6: What about wire wear and lifetime?

A6:

• Diamond wire diameter range: 0.12–0.45 mm, selectable per process;

• Guide wheels with ceramic or tungsten carbide coating, >8000 hours lifetime;

• Wire durability depends on material and process, but more stable than single-wire systems.