Product Specification

Product Overview

TGV Glass, also known as Through Glass Via Glass Substrate, is an advanced glass-based interconnect material used for high-density packaging and vertical electrical connection. By forming precision micro-vias through glass and applying metallization or copper filling processes, TGV glass enables reliable electrical connection between the top and bottom surfaces of the substrate.

Compared with traditional silicon or organic substrates, TGV glass offers excellent electrical insulation, low dielectric loss, low parasitic capacitance, high dimensional stability, and good optical transparency. It is widely used in advanced semiconductor packaging, RF devices, MEMS sensors, optical communication, biochips, microfluidic devices, and high-frequency electronic applications.

Our TGV glass products can be customized according to customer drawings, including glass material, wafer size, substrate thickness, via diameter, via shape, via pitch, metallization structure, and surface treatment requirements.

Key Features

• High-precision micro-via processing
• Excellent electrical insulation performance
• Low dielectric loss and low signal transmission loss
• Good thermal and dimensional stability
• Suitable for high-frequency and high-density interconnection
• Available with through holes, blind holes, metallized vias, or copper-filled vias
• Customizable material, size, thickness, hole diameter, and pattern design
• Suitable for wafer-level and panel-level packaging applications

Available Materials

• Borosilicate Glass
• Alkali-free Glass
• Fused Silica / Quartz Glass
• Sapphire
• Other customized glass materials upon request

Customization Options

Applications

TGV glass is suitable for a wide range of advanced packaging and high-performance electronic applications, including:

• 2.5D / 3D semiconductor packaging
• Glass interposer for advanced packaging
• RF and microwave devices
• MEMS sensor packaging
• Optical communication devices
• Silicon photonics packaging
• Biochips and microfluidic chips
• Wafer-level packaging
• High-density interconnect substrates
• High-frequency communication modules

Product Advantages

TGV glass combines the excellent properties of glass materials with high-density vertical interconnect technology. Its low loss, high insulation, good transparency, and stable structure make it an ideal solution for next-generation semiconductor packaging, RF modules, optical devices, and MEMS applications.

We provide customized TGV glass processing services according to customer specifications. Customers are welcome to send drawings, material requirements, via design, and application information for technical evaluation and quotation.

FAQ

1. What is TGV glass?

TGV glass, also known as Through Glass Via glass, is a glass substrate with precision micro-vias formed through the glass. These vias can be metallized or copper-filled to achieve vertical electrical interconnection between the top and bottom surfaces of the substrate.

2. What are the main advantages of TGV glass?

TGV glass offers excellent electrical insulation, low dielectric loss, low parasitic capacitance, good optical transparency, high dimensional stability, and reliable performance for high-frequency and high-density interconnect applications.

3. What materials are available for TGV glass substrates?

We can provide different glass materials according to customer requirements, including borosilicate glass, alkali-free glass, fused silica, quartz glass, sapphire, and other customized glass materials.