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{"title":"SiC Ingot Cutting Machine For 4 Inch 6 Inch 8 Inch 10 Inch SiC Cutting Speed 0.3","imgUrl":"https:\/\/img.chinax.com\/nimg\/29\/c6\/09583f16b982cceb2d4f2af43084-200x200-1\/sic_ingot_cutting_machine_for_4_inch_6_inch_8_inch_10_inch_sic_cutting_speed_0_3_mm_2fmin_average.jpg","attrs":{"Brand Name":"ZMSH","Model Number":"SiC Ingot Cutting Machine","Place of Origin":"China","Payment Terms":"T\/T"}}
This equipment is specifically designed for micro-hole machining of superhard materials, integrating high-precision mechanical systems, intelligent control software, and advanced laser technology. It overcomes the limitations of traditional processes in material adaptability, machining precision, and efficiency. The equipment is suitable for precision drilling, cutting, and micromachining of high-end materials such as diamond, sapphire, ceramics, and aerospace alloys. It assists enterprises in achieving production goals of micron-level aperture, no thermal damage, and high yield rates.
Technical Specifications
Category
Specifications
Mechanical Structure
• Three-axis precision ball screw + linear guide rails
• Repeatability: ≤±2μm
• Travel range: X/Y/Z: 50mm × 50mm × 50mm
Laser System
• Laser type: Fiber laser (optional CO₂/UV)
• Max power: 50W (continuous/pulsed)
• Wavelength: 1064nm (standard)
Control Software
• G-code/CAD bidirectional programming with auto-path optimization
• Real-time 3D visualization and process tracking
Environment/Power
• Temperature: 18–28°C, Humidity: 30–60%, Cleanroom class ISO 5 (optional)
Surface Finish: Ra≤0.8μm (mirror finish), no burrs or melt residue—critical for brittle materials like sapphire.
Stability: Temperature drift <±1μm after 8 hours of continuous operation; yield rate >99.5% (tested on typical materials).
Breakthrough Technologies
Ultrashort Pulse Mode (optional): Pulse width ≤10ps, heat-affected zone <1μm—ideal for sapphire and other thermally sensitive materials.
Dynamic Parameter Adjustment: Automatically optimizes laser frequency/power based on material hardness, improving sapphire drilling efficiency by 30%.
Typical Applications
Precision Mold & Bearing Manufacturing
Diamond Drawing Dies: Drilling holes <φ0.05mm to extend tool life by 30%.
Sapphire Bearings: • Micro-array drilling for spindle bearings with rotational accuracy ±1μm and enhanced wear resistance. • Sterile micro-drilling for medical implant bearings meeting biocompatibility standards.
Semiconductor & Electronics
Chip Packaging: BGA pad micro-via drilling with diameter consistency ±2μm.
Sensor Probes: Micro-hole formation in medical catheters with Ra≤0.1μm surface finish.
New Energy & Aerospace
Lithium-ion Battery Separators: Micro-porous arrays to increase energy density.
Titanium Alloy Blades: Cooling hole drilling without stress cracks associated with traditional methods.
ZMSH High-Precision Laser Drilling Machine
Common Issues & Solutions
Issue
Solution
No laser output upon startup
① Verify power supply stability;
② Check coolant circulation;
③ Reset system parameters.
Chipping during sapphire drilling
① Use ultrashort pulse mode (requires optional upgrade);
② Adjust feed speed to 0.1–0.5mm/s;
③ Employ vacuum clamping fixtures.
Software lag
① Upgrade to latest control software;
② Monitor computer memory usage;
③ Contact engineers for remote optimization.
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2013
Total Annual:
1000000-1500000
Ecer Certification:
Verified Supplier
SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014.
We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widely used in electronics, op... SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014.
We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components widely used in electronics, op...