Pico-precision Laser Drilling Machine for Sapphire bearing processing

Product Specification

Product Overview

The equipment combines ultra-fast picosecond laser technology with intelligent control systems, designed for high-value material precision processing. Key advantages include:

• ​Picosecond-level Ultra-fast Processing: 1064nm wavelength pulsed laser with energy levels adjustable from 0.1mJ to 5mJ (step size 0.1mJ), delivering pulse durations <10^-12 seconds. This minimizes thermal damage (<10μm heat-affected zone) and eliminates micro-cracking.
• ​Full Digital Closed-loop Control: Equipped with industrial-grade PCs and proprietary ​LaserMaster Pro​ software, supporting G-code programming, CAD auto-conversion, and real-time path optimization. Positioning accuracy reaches ±0.005mm.
• ​4-Axis Intelligent System: XYZ axes with ±0.002mm repeatability and optional C-axis rotation enable complex multi-tasking for irregular hole patterns.

Typical Applications:

• Semiconductor industry: Wafer drilling, micro-structure fabrication
• Ultra-hard materials: Diamond tooling,apphire optical component micro-drilling
• Biomedical field: Artificial joints, dental implants precision drilling
• New energy sector: Lithium-ion battery micro-porous array processing

​​​

​

Processing Performance & Quality Assurance 

 . Exceptional Processing Capabilities​

• ​Micro-drilling: Minimum aperture φ0.5μm, depth-to-diameter ratio up to 1:50 (no chipping in hard materials)
• ​Complex Structures: Supports conical holes (0.1°–5° adjustable), spiral grooves, and multi-stage holes in one process
• ​Non-destructive Cutting: Ideal for thin films (e.g., PI film, graphene) with sub-micron precision

​  . End-to-End Quality Management​

• ​Smart Compensation: Real-time monitoring of laser power fluctuations and thermal deformation with dynamic parameter adjustments
• ​Process Database: Pre-built parameters for over 200 materials (metals, ceramics, gemstones, composites)
• ​In-line Inspection: Automated generation of hole size distribution maps and surface roughness analysis reports (Ra ≤0.8μm)
   

 Material Compatibility Test Results​

ZMSH Pico-precision Laser Drilling Machine Result Processsing Ca'pability

This laser drilling machine, with its exceptional precision and high efficiency, is widely used for high-precision processing needs across various industries. Its core advantage lies in the micron-level hole drilling capability and versatile processing modes, allowing it to meet stringent quality requirements in multiple sectors.

1. Micro-hole Drilling Capability
   
   
   
   The machine is capable of drilling micro-holes as small as 0.005mm, ensuring precise drilling even in the most delicate areas of materials with virtually no heat-affected zone. Even when working with harder materials like polycrystalline diamond, the holes remain smooth with no burrs or cracking, and the depth-to-diameter ratio can reach 1:50, significantly enhancing processing efficiency and material utilization.
   
   
   
   
    

2. Complex Structure Processing
   
   
   
   The laser drilling machine supports the processing of complex geometries, such as conical holes (adjustable from 0.1°–5°), spiral grooves, and multi-stage holes in a single operation. This reduces the need for multiple processes, saving both time and cost. Additionally, the machine’s three-axis precision worktable and high-precision air-floating rotation system ensure accurate positioning and stable control during processing.
   
   
   
   
   
    

3. Non-destructive Cutting
   For ultra-thin materials such as PI film and graphene, the machine exhibits high precision and non-destructive cutting capabilities. The ultra-short pulse duration of the laser minimizes heat conduction, preventing damage to sensitive materials and ensuring the integrity and smoothness of the material surface.
   
   
   
   
   
   
    

4. Multi-material Compatibility
   
   
   
   The machine is compatible with various materials, including metals, ceramics, gemstones, and composites. During the processing of different materials, the machine’s intelligent energy adjustment system automatically adjusts the laser power according to the material's properties, ensuring optimal results for each material. Moreover, the real-time monitoring system effectively controls fluctuations in laser power and thermal deformation, guaranteeing stability and consistency throughout the processing.

ZMSH Pico-precision Laser Drilling Machine

FAQs

Q: Is the equipment commissioning time-consuming?

A: Pre-installed parameter packages enable 30-minute basic functional verification. Remote guidance by our team can further reduce setup time to ​2 hours.

​Q: How to handle multi-material sequential cutting?

A: Supports multi-layer processing modes with automatic tool change and parameter switching between materials like stainless steel and ceramics.