Product Specification

TGV (Through-Glass Via) Glass is an advanced substrate technology that enables vertical electrical interconnections through micro-holes drilled into glass substrates. This innovation leverages ​laser drilling, ​electroplating, and ​glass strengthening​ processes to create high-performance, ultra-thin, and transparent solutions for 3D integration.

Key Features​

• ​Material Versatility: Compatible with borosilicate, soda-lime, quartz, and aluminum-silicate glasses.
• ​High-Density Interconnectivity: Micro-vias with diameters from ​5μm to 500μm​ and aspect ratios exceeding ​10:1.
• ​Electrical Performance: Low signal loss (0.02 dB/cm @ 100 GHz) and high insulation resistance (>1×10¹⁵ Ω·cm).
• ​Mechanical Robustness: Chemically strengthened glass achieves strengths up to ​800 MPa​ (soda-lime) or ​700 MPa​ (borosilicate).
• ​Thermal Compatibility: Low thermal expansion coefficients (e.g., ​3.2×10⁻⁶/K​ for borosilicate) for seamless integration with silicon chips.

Company Introduction

Our company, ZMSH, has been a prominent player in the semiconductor industry for over a decade, boasting a professional team of factory experts and sales personnel. We specialize in providing customized sapphire wafer solutions, offering both tailored designs and OEM services to meet diverse client needs. At ZMSH, we are committed to delivering products that excel in both price and quality, ensuring customer satisfaction at every stage. We invite you to contact us for more information or to discuss your specific requirements.

Material Selection

Key Differences:

​Sapphire vs. Glass:

• ​Material Class: Sapphire is a crystalline ceramic (not glass), but it is often grouped with glass substrates for high-performance applications due to its exceptional durability.

• ​Advantages: Superior scratch resistance, higher thermal conductivity, and IR transmission (80–100% in mid-wave IR).

• ​Limitations: Higher cost, lower transparency in visible light (only ~92% vs. ~99% for quartz), and difficulty in laser drilling.

TGV Glass Applications

• 5G & Telecommunications: High-frequency signal routing in RF modules.
• ​Automotive: Curved displays, LiDAR sensors, and power modules.
• ​AR/VR: Ultra-thin, foldable displays with 200,000+ bending cycles.
• ​Chiplet Packaging: 3D stacking for heterogeneous integration.

Product Display - ZMSH

TGV Glass FAQ

Q: What industries benefit most from TGV Glass?​

A: TGV Glass is ideal for applications requiring high density, transparency, and reliability. Key sectors include:

• ​Consumer Electronics​ (foldable smartphones, AR/VR displays).
• ​Automotive​ (curved dashboards, LiDAR sensors).
• ​5G/Telecom​ (compact RF modules).
• ​Aerospace/Military​ (high-power sensors, extreme environments).

Q: How does TGV Glass improve device performance?​

A: By enabling ​3D circuitry​ in ultra-thin glass substrates, TGV Glass reduces size and weight while maintaining high-speed signal integrity. For example, it allows foldable screens to bend 200,000+ times without losing connectivity.

Q: Is TGV Glass compatible with flexible designs?​​
A: Yes! Chemically strengthened versions (e.g., soda-lime glass) can bend and curve, making TGV Glass suitable for foldable phones, rollable displays, and wearable devices.

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