2 5d sip bare dies integration

{"cid":"91225944","title":"2.5D SiP can integrate various bare dies to meet differentiated functional requirements","imgUrl":"https:\/\/img.chinax.com\/nimg\/80\/b8\/8a00dc0e08649c05e711df9dc79f-200x200-1.jpg","attrs":{"Brand Name":"Chippack","Model Number":"2.5D SiP","Intermediate layer":"Silicon \/ Glass Interposer","Number of stacked layers":"1-layer die array","Chip layout":"laid flat on the silicon interposer","Type":"2.5D SiP","Size":"Supports rapid sample customization","TSV":"Interposer TSV"}}