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1A1 Metal Bond Diamond Grinding Wheel 300mm D91 for Semiconductor Wafer Fine Grinding
Price: Negotiate
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- Brand Name: Shine Abrasives
- Model Number: 1A1
- Minimum Order Quantity: 2 PCS
- Delivery Time: 5 working days
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1V1/15° 100*8*31.75*6mm D91 C125 Wet-Grinding Resin Bond Diamond Grinding Wheel
Price: Negotiable
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- Brand Name: JC
- Model Number: 1V1
- Minimum Order Quantity: 5 pcs
- Delivery Time: 5-10 work days
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SiC Epitaxial Wafer Substrate Semiconductor Industrial Applications 4H-N
Price:
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- Brand Name: ZMSH
- Model Number: SiC substrate
- Minimum Order Quantity: Negotiable
- Delivery Time: 2-4 weeks
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