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ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication
Price: US 120-150 per square meter
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- Brand Name: Horexs
- Model Number: HRX
- Minimum Order Quantity: 1 square meter
- Delivery Time: 7-10 working days
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High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages
Price: Negotiate
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- Brand Name: Jiaqing Circuit
- Model Number: Negotiable
- Minimum Order Quantity: Negotiable
- Delivery Time: 15-30 Days
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Iphone IC Chip APL1096/343S00474 Power Management Circuit BGA Package IC Chip
Price: Contact for Sample
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- Brand Name: Original Factory
- Model Number: APL1096/343S00474
- Minimum Order Quantity: 10
- Delivery Time: 5-8 work days
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High Density PCB Micro BGA Package Assembly Service Integrated Solution
Price: Contact us
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- Brand Name: Negotiable
- Model Number: Negotiable
- Minimum Order Quantity: 1
- Delivery Time: Negotiable
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High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp
Price: Can negotiate
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- Brand Name: UNICOMP
- Model Number: AX9500
- Minimum Order Quantity: 1Set
- Delivery Time: 30 days
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Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
Price: Negotiate
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- Brand Name: NEWFILM
- Model Number: NF-019
- Minimum Order Quantity: 2 Ton
- Delivery Time: 7-15 working days after 30% deposit
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High Viscosity 3W/MK Thermally Conductive Putty For BGA Package
Price: 0.1-100USD/KG
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- Brand Name: Ziitek
- Model Number: TIF030-05
- Minimum Order Quantity: 1000tube
- Delivery Time: 3-8 WORK DAYS
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Dongguan Ziitek Electronical Material and Technology Co., Ltd
Dongguan ,Guangdong
- 8YRS
- Verified Supplier
0.1mm Stainless Steel Shim SMT Stencil PCB Assembly For BGA Package
Price: USD9.99-99.99
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- Brand Name: Bicheng
- Model Number: BIC-954.V1.0
- Minimum Order Quantity: 1PCS
- Delivery Time: 8-9 working days
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Black JEDEC Tray for BGA-Packaged Chip Complies With Standard Design Matrix 8x16=128PCS
Price: $1.5~$6(Prices are determined according to different incoterms and quantities）
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- Brand Name: Hiner-pack
- Model Number: HN23111
- Minimum Order Quantity: 500
- Delivery Time: Mold：About 25 Days / Product：7~10 Days
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LTM4622IY 4A 20V Synchronous Step-Down µModule Regulator with 95% Efficiency 3.1-20V Input ±1.5% Output Accuracy 2.5MHz Switching and 6.25mm × 6.25mm BGA Package
Price: Negotiable
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- Brand Name: Analog Devices
- Model Number: LTM4622IY
- Minimum Order Quantity: 1
- Delivery Time: 3-5 working days after received the payment
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ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B IC BGA Package
Price: Negotiated
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- Brand Name: Negotiable
- Model Number: ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B
- Minimum Order Quantity: 10pieces
- Delivery Time: 2-7working days
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1oz Copper Weight Package Substrate PCB IC PCB Board Rohs Approval BT board
Price: Negotiable
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- Brand Name: Negotiable
- Model Number: Negotiable
- Minimum Order Quantity: Negotiable
- Delivery Time: Negotiable
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ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B ADI IC BGA Package
Price: Negotiated
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- Brand Name: ADI
- Model Number: ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B
- Minimum Order Quantity: 10pieces
- Delivery Time: 2-7working days
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1oz Copper Weight Package Substrate PCB IC PCB Board Rohs Approval BT board
Price: Negotiable
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- Brand Name: Negotiable
- Model Number: Negotiable
- Minimum Order Quantity: Negotiable
- Delivery Time: Negotiable
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
Price: USD 1.99 ~ USD9.99/pcs
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- Brand Name: TECircuit
- Model Number: TEC0211
- Minimum Order Quantity: 1pcs for sample, 100pcs for bulk
- Delivery Time: 5-15 wotk days
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IPQ4019-0vv IPQ4019 IPQ4019-OVV BGA package network chip new original
Price: Negotiable
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- Brand Name: QUALCOMM
- Model Number: IPQ4019-0vv
- Minimum Order Quantity: 10
- Delivery Time: 2-3days
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THGBMTG5D1LBAIL E-MMC products integrate flash memory and e-MMC controller into a single BGA package to perform functions such as error correction, loss balancing,
Price: Price interview
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- Brand Name: KIOXIA
- Model Number: THGBMTG5D1LBAIL
- Minimum Order Quantity: 760
- Delivery Time: 5-8 working days
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SMT Stencil Laser Cut 0.1mm Stainless Steel Shim for BGA Package with aluminum frame 520 mm x 420 mm x 20mm dimension
Price: USD69~110
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- Brand Name: Bicheng Enterprise Limited
- Model Number: BIC-0330-V3.30
- Minimum Order Quantity: 1
- Delivery Time: 2-3 working days
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High Definition Touch Screen BGA Rework Station with ±0.01mm Mounting Accuracy and 2600W Total Power for Mobile Phone Repair
Price: Negotiable
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- Brand Name: HSTECH
- Model Number: HS-700
- Minimum Order Quantity: 1 set
- Delivery Time: 7~9 work days
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