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Manufacturer of a wide range of products which include Electromechanical Components 1GT101DC Hall Effect Gear Tooth Sensors GT Sries,Electromechanical Components DMM6500 DMM6500 Electromechanical products Measure,XC7Z045-L2FFG900I...
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Packaging Details | Standard package |
Delivery Time | The goods will be shipped within 3 days once received fund. |
Payment Terms | Paypal, Western Union, TT |
Supply Ability | 50000 Pieces per Day |
Place of Origin | Call |
Brand Name | Honeywell |
Certification | ROHS |
Model Number | 1GT101DC |
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Packaging Details | Standard package |
Delivery Time | The goods will be shipped within 3 days once received fund. |
Payment Terms | Paypal, Western Union, TT |
Supply Ability | 50000 Pieces per Day |
Place of Origin | Call |
Brand Name | Keithley Instruments, Inc. |
Certification | ROHS |
Model Number | DMM6500 |
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Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
Base Product Number | XC7Z045 |
Product Status | Active |
Peripherals | DMA |
Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
Series | Zynq®-7000 |
Package | Tray |
Mfr | AMD |
Supplier Device Package | 900-FCBGA (31x31) |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Operating Temperature | -40°C ~ 100°C (TJ) |
Architecture | MCU, FPGA |
Package / Case | 900-BBGA, FCBGA |
Number of I/O | 130 |
RAM Size | 256KB |
Speed | 800MHz |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size | - |
Description | IC SOC CORTEX-A9 800MHZ 900FCBGA |
Stock | In Stock |
Shipping Method | LCL, AIR, FCL, Express |
Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
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Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
Base Product Number | XCZU11 |
Product Status | Active |
Peripherals | DMA, WDT |
Primary Attributes | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
Series | Zynq® UltraScale+™ MPSoC EG |
Package | Tray |
Mfr | AMD |
Supplier Device Package | 1156-FCBGA (35x35) |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Operating Temperature | -40°C ~ 100°C (TJ) |
Architecture | MCU, FPGA |
Package / Case | 1156-BBGA, FCBGA |
Number of I/O | 360 |
RAM Size | 256KB |
Speed | 533MHz, 600MHz, 1.3GHz |
Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Flash Size | - |
Description | IC SOC CORTEX-A53 1156FCBGA |
Stock | In Stock |
Shipping Method | LCL, AIR, FCL, Express |
Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
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Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
Product Status | Active |
Peripherals | DDR, DMA, PCIe |
Primary Attributes | Versal™ Prime FPGA, 1.2M Logic Cells |
Series | Versal™ Prime |
Package | Tray |
Mfr | AMD |
Supplier Device Package | 1369-BGA (35x35) |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Operating Temperature | 0°C ~ 100°C (TJ) |
Architecture | MPU, FPGA |
Package / Case | 1369-BFBGA |
Number of I/O | 424 |
RAM Size | - |
Speed | 400MHz, 1GHz |
Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
Flash Size | - |
Description | IC VERSALPRIME ACAP FPGA 1369BGA |
Stock | In Stock |
Shipping Method | LCL, AIR, FCL, Express |
Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
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Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
Base Product Number | XC7Z007 |
Product Status | Active |
Peripherals | DMA |
Primary Attributes | Artix™-7 FPGA, 23K Logic Cells |
Series | Zynq®-7000 |
Package | Tray |
Mfr | AMD |
Supplier Device Package | 225-CSPBGA (13x13) |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Operating Temperature | -40°C ~ 100°C (TJ) |
Architecture | MCU, FPGA |
Package / Case | 225-LFBGA, CSPBGA |
Number of I/O | 54 |
RAM Size | 256KB |
Speed | 766MHz |
Core Processor | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size | - |
Description | IC SOC CORTEX-A9 766MHZ 225BGA |
Stock | In Stock |
Shipping Method | LCL, AIR, FCL, Express |
Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
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Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
Base Product Number | M2S060 |
Product Status | Active |
Peripherals | DDR, PCIe, SERDES |
Primary Attributes | FPGA - 60K Logic Modules |
Series | SmartFusion®2 |
Package | Tray |
Mfr | Microchip Technology |
Supplier Device Package | 325-FCBGA (11x11) |
Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Operating Temperature | -40°C ~ 100°C (TJ) |
Architecture | MCU, FPGA |
Package / Case | 325-TFBGA, FCBGA |
Number of I/O | 200 |
RAM Size | 64KB |
Speed | 166MHz |
Core Processor | ARM® Cortex®-M3 |
Flash Size | 256KB |
Description | IC SOC CORTEX-M3 166MHZ 325BGA |
Stock | In Stock |
Shipping Method | LCL, AIR, FCL, Express |
Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
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Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
Product Status | Active |
Peripherals | DMA, WDT |
Primary Attributes | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells |
Series | Zynq® UltraScale+™ RFSoC |
Package | Tray |
Mfr | AMD |
Supplier Device Package | 1156-FCBGA (35x35) |
Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Operating Temperature | -40°C ~ 100°C (TJ) |
Architecture | MCU, FPGA |
Package / Case | 1156-BBGA, FCBGA |
Number of I/O | 366 |
RAM Size | 256KB |
Speed | 533MHz, 1.333GHz |
Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Flash Size | - |
Description | IC ZUP RFSOC A53 FPGA 1156BGA |
Stock | In Stock |
Shipping Method | LCL, AIR, FCL, Express |
Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
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Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
Base Product Number | M2S090 |
Product Status | Active |
Peripherals | DDR, PCIe, SERDES |
Primary Attributes | FPGA - 90K Logic Modules |
Series | SmartFusion®2 |
Package | Tray |
Mfr | Microchip Technology |
Supplier Device Package | 325-FCBGA (11x13.5) |
Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
Operating Temperature | -40°C ~ 100°C (TJ) |
Architecture | MCU, FPGA |
Package / Case | 325-TFBGA, FCBGA |
Number of I/O | 180 |
RAM Size | 64KB |
Speed | 166MHz |
Core Processor | ARM® Cortex®-M3 |
Flash Size | 512KB |
Description | IC SOC CORTEX-M3 166MHZ 325BGA |
Stock | In Stock |
Shipping Method | LCL, AIR, FCL, Express |
Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
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Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
Product Status | Active |
Peripherals | DMA, POR, WDT |
Primary Attributes | FPGA - 160K Logic Elements |
Series | Arria 10 SX |
Package | Tray |
Mfr | Intel |
Supplier Device Package | 672-FBGA, FC (27x27) |
Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Operating Temperature | 0°C ~ 100°C (TJ) |
Architecture | MCU, FPGA |
Package / Case | 672-BBGA, FCBGA |
Number of I/O | 240 |
RAM Size | 256KB |
Speed | 1.5GHz |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Flash Size | - |
Description | IC SOC CORTEX-A9 1.5GHZ 672FBGA |
Stock | In Stock |
Shipping Method | LCL, AIR, FCL, Express |
Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
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