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Sensor IC

Manufacturer of a wide range of products which include Electromechanical Components 1GT101DC Hall Effect Gear Tooth Sensors GT Sries,Electromechanical Components DMM6500 DMM6500 Electromechanical products Measure,XC7Z045-L2FFG900I...

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Electromechanical Components 1GT101DC Hall Effect Gear Tooth Sensors GT Sries

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Packaging Details Standard package
Delivery Time The goods will be shipped within 3 days once received fund.
Payment Terms Paypal, Western Union, TT
Supply Ability 50000 Pieces per Day
Place of Origin Call
Brand Name Honeywell
Certification ROHS
Model Number 1GT101DC

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Packaging Details Standard package
Delivery Time The goods will be shipped within 3 days once received fund.
Payment Terms Paypal, Western Union, TT
Supply Ability 50000 Pieces per Day
Place of Origin Call
Brand Name Keithley Instruments, Inc.
Certification ROHS
Model Number DMM6500

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Quality XC7Z045-L2FFG900I for sale

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number XC7Z045
Product Status Active
Peripherals DMA
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Series Zynq®-7000
Package Tray
Mfr AMD
Supplier Device Package 900-FCBGA (31x31)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 900-BBGA, FCBGA
Number of I/O 130
RAM Size 256KB
Speed 800MHz
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
Description IC SOC CORTEX-A9 800MHZ 900FCBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number XCZU11
Product Status Active
Peripherals DMA, WDT
Primary Attributes Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Series Zynq® UltraScale+™ MPSoC EG
Package Tray
Mfr AMD
Supplier Device Package 1156-FCBGA (35x35)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 1156-BBGA, FCBGA
Number of I/O 360
RAM Size 256KB
Speed 533MHz, 600MHz, 1.3GHz
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size -
Description IC SOC CORTEX-A53 1156FCBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DDR, DMA, PCIe
Primary Attributes Versal™ Prime FPGA, 1.2M Logic Cells
Series Versal™ Prime
Package Tray
Mfr AMD
Supplier Device Package 1369-BGA (35x35)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C (TJ)
Architecture MPU, FPGA
Package / Case 1369-BFBGA
Number of I/O 424
RAM Size -
Speed 400MHz, 1GHz
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
Description IC VERSALPRIME ACAP FPGA 1369BGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram

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Quality XC7Z007S-2CLG225I for sale

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number XC7Z007
Product Status Active
Peripherals DMA
Primary Attributes Artix™-7 FPGA, 23K Logic Cells
Series Zynq®-7000
Package Tray
Mfr AMD
Supplier Device Package 225-CSPBGA (13x13)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 225-LFBGA, CSPBGA
Number of I/O 54
RAM Size 256KB
Speed 766MHz
Core Processor Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
Description IC SOC CORTEX-A9 766MHZ 225BGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram

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Quality M2S060-1FCSG325I for sale

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number M2S060
Product Status Active
Peripherals DDR, PCIe, SERDES
Primary Attributes FPGA - 60K Logic Modules
Series SmartFusion®2
Package Tray
Mfr Microchip Technology
Supplier Device Package 325-FCBGA (11x11)
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 325-TFBGA, FCBGA
Number of I/O 200
RAM Size 64KB
Speed 166MHz
Core Processor ARM® Cortex®-M3
Flash Size 256KB
Description IC SOC CORTEX-M3 166MHZ 325BGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DMA, WDT
Primary Attributes Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Series Zynq® UltraScale+™ RFSoC
Package Tray
Mfr AMD
Supplier Device Package 1156-FCBGA (35x35)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 1156-BBGA, FCBGA
Number of I/O 366
RAM Size 256KB
Speed 533MHz, 1.333GHz
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size -
Description IC ZUP RFSOC A53 FPGA 1156BGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number M2S090
Product Status Active
Peripherals DDR, PCIe, SERDES
Primary Attributes FPGA - 90K Logic Modules
Series SmartFusion®2
Package Tray
Mfr Microchip Technology
Supplier Device Package 325-FCBGA (11x13.5)
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 325-TFBGA, FCBGA
Number of I/O 180
RAM Size 64KB
Speed 166MHz
Core Processor ARM® Cortex®-M3
Flash Size 512KB
Description IC SOC CORTEX-M3 166MHZ 325BGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DMA, POR, WDT
Primary Attributes FPGA - 160K Logic Elements
Series Arria 10 SX
Package Tray
Mfr Intel
Supplier Device Package 672-FBGA, FC (27x27)
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 672-BBGA, FCBGA
Number of I/O 240
RAM Size 256KB
Speed 1.5GHz
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
Description IC SOC CORTEX-A9 1.5GHZ 672FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram

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  • Shenzhen Jinsheng Weiye Electronics Co., Ltd
  • 5009B, 5009A, 50th floor saigeguangchang No. 1002 huaqiangbeilu fuqiangshequ huaqiangbeijiedao futianqu shenzhenshi
  • https://www.semiconductor-ics.com/

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