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Hefei Purple Horn E-Commerce Co., Ltd.

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China Resettable overvoltage protection device Littelfuse ZEN132V230A16LS polymer
China Resettable overvoltage protection device Littelfuse ZEN132V230A16LS polymer

  1. China Resettable overvoltage protection device Littelfuse ZEN132V230A16LS polymer

Resettable overvoltage protection device Littelfuse ZEN132V230A16LS polymer

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Pd - Power Dissipation -
Zener Voltage(Nom) 13.4V
Description 13.4V Single Zener Diodes RoHS
Mfr. Part # ZEN132V230A16LS
Model Number ZEN132V230A16LS

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  1. Product Details
  2. Company Details

Product Specification

Pd - Power Dissipation - Zener Voltage(Nom) 13.4V
Description 13.4V Single Zener Diodes RoHS Mfr. Part # ZEN132V230A16LS
Model Number ZEN132V230A16LS

PolyZen Polymer Enhanced Zener Diode Micro-Assemblies

Product Overview
The Littelfuse PolyZen devices are polymer enhanced, precision Zener diode micro-assemblies designed to offer resettable protection against multi-Watt fault events without the need for external heat sinks. They feature a Zener diode with a stable voltage vs. current response for improved output voltage clamping, even under high input voltage and large diode currents. An advanced polymer PTC layer is integrated and thermally coupled to the Zener diode. This PTC layer transitions to a high resistance state ('trips') in response to extended diode heating or overcurrent events, limiting current and generating voltage drop to protect the Zener diode and downstream electronics. PolyZen devices are particularly suitable for protecting sensitive portable electronics and other low-power DC devices from inductive voltage spikes, voltage transients, incorrect power supplies, and reverse bias.

Key Benefits

  • Stable Zener diode shields downstream electronics from overvoltage and reverse bias.
  • Trip events effectively shut out overvoltage and reverse bias sources.
  • Analog nature of trip events minimizes upstream inductive spikes.
  • Minimal power dissipation requirements.
  • Single component placement for ease of integration.

Features

  • Overvoltage transient suppression.
  • Stable VZ vs. fault current.
  • Time-delayed, overvoltage trip.
  • Time-delayed, reverse bias trip.
  • Multi-Watt power handling capability.
  • Integrated device construction.
  • RoHS Compliant.

Target Applications

  • DC power port protection in portable electronics.
  • DC power port protection for systems using barrel jacks for power input.
  • Internal overvoltage & transient suppression.
  • DC output voltage regulation.

Product Attributes

  • Brand: Littelfuse
  • Product Line: PolyZen
  • Certifications: RoHS Compliant, ELV Compliant, Pb-Free

Technical Specifications

Specification Value Notes
Product Model ZEN132V230A16LS
Operating Temperature -40 to +85C
Storage Temperature -40 to +85C
Zener Voltage (VZ) @ Izt 13.2V (Min), 13.4V (Typ), 13.6V (Max) Izt = 0.1A
Current at Zener Voltage (Izt) 0.1 A
Hold Current (IHOLD) @ 20C 2.3 A Max steady state current that will not generate a trip event.
Typical Resistance (R Typ) 0.04 Ohms Between VIN and VOUT pins during normal operation at room temperature.
Max Resistance (R1Max) 0.06 Ohms Between VIN and VOUT pins at room temperature, one hour after 1st trip or after reflow soldering.
Max Internal Voltage (VINT Max) +20V Survivability rating, not a performance rating.
Max Fault Current (IFLT Max) 5A Related to steady state current through the diode in a fault condition prior to trip. Survivability rating.
Tripped Power Dissipation Max 0.8 W Measured on Littelfuse test boards.
Max Internal Voltage (VINT Max) for Qualification -12V Survivability rating at specified voltage and current (IPTC).
Device Dimensions (L x W x H) 4.0 mm (L) x 4.0 mm (W) x 1.7 mm (H) Typical values. Length: 3.85-4.15 mm; Width: 3.85-4.15 mm; Height: 1.4-2.0 mm.
Packaging (Tape & Reel) 3,000 units
Packaging (Standard Box) 15,000 units

Configuration Information

Pin Configuration (Top View):

Pin Number Pin Name Pin Function
1 VIN Protected input to Zener diode.
2 GND Ground.
3 VOUT Zener regulated voltage output.

Definition of Terms

  • IPTC: Current flowing through the PTC portion of the circuit.
  • IFLT: RMS fault current flowing through the diode.
  • IOUT: Current flowing out the VOUT pin of the device.
  • Trip Event: A condition where the PTC transitions to a high resistance state, thereby significantly limiting IPTC and related currents.
  • Trip Endurance Time: The time the PTC portion of the device remains in a high resistance state.

Solder Reflow Recommendations (Pb-Free Assembly)

Profile Feature Specification
Average Ramp-Up Rate (Tsmax to Tp) 3 C/second max.
Preheat - Temperature Min (Tsmin) 150 C
Preheat - Temperature Max (Tsmax) 200 C
Preheat - Time (tsmin to tsmax) 60-180 seconds
Time maintained above TL 60-150 seconds (TL = 217 C)
Peak/Classification Temperature (Tp) 260 C
Time within 5 C of actual Peak Temperature (tp) 20-40 seconds
Ramp-Down Rate 6 C/second max.
Time 25 C to Peak Temperature 8 minutes max.

Materials Information

  • ROHS Compliant
  • ELV Compliant
  • Pb-Free

2411271927_Littelfuse-ZEN132V230A16LS_C58140.pdf

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Agent,Importer

  • Year Established:

    2009

  • Employee Number:

    300~500

  • Ecer Certification:

    Verified Supplier

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  • Hefei Purple Horn E-Commerce Co., Ltd.
  • Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
  • https://www.semiconductoric.com/

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