Surface mount ntc thermistor ste smdntc3225n4r504mk0 encapsulated for compact

Product Specification

Product Overview

The SMD-3225 Series is a series of encapsulated surface-mount thermistors designed for circuit protection and various electronic applications. Featuring advanced encapsulation technology meeting UL94-V0 standards, these thermistors offer a compact size, excellent high-temperature and high-humidity performance, and strong surge suppression capabilities. They are supplied in SMD tape reels for automated mounting via lead-free reflow/wave soldering.

Product Attributes

• Brand: Songtian ()
• Product Type: Encapsulated Surface Mount NTC Thermistor
• Series: SMD-3225
• Encapsulation Material: Meets UL94-V0 standard
• Packaging: SMD tape reel
• Soldering Compatibility: Lead-free reflow/wave soldering
• Origin: Shantou Free Trade Zone Songtian Electronic Technology Co., Ltd.

Technical Specifications

Part Number Coding Principle:

SMD NTC 3225 N 2R5 05 M 0

• NTC: Negative Temperature Coefficient Thermistor
• Model: SMD
• Size: 3225 (approx. 8.1*6.0mm)
• Lead Shape: N (Internal Fold), W (External Fold)
• Zero-Power Resistance @ 25C: e.g., 020: 2.0, 2R5: 2.5, 201: 200
• Max. Steady Current: e.g., S5: 1.5A, 05: 5.0A
• Resistance Tolerance: L: 15%, M: 20%

Product Markings (Example):

1. Songtian Logo
2. NTC Negative Temperature Coefficient Thermistor
3. 3225 (Size: approx. 8.1*6.0mm)
4. 050 (Zero-Power Resistance @ 25C: 5.0)
5. M (Capacity Tolerance: M (20%))

Dimensions (mm)

External Fold (W)

Internal Fold (N)

Electrical Performance

Reliability Experiments

Packaging Instructions

Taping Specifications (Unit: mm)

Component per Reel

15-inch Reel Dimensions (Unit: mm)

Soldering Instructions

Lead-Free Reflow Soldering Curve

When reflow soldering thermistors, it should be performed under the following conditions:

• Soldering Temperature: 230260
• Soldering Time: 1030s
• Preheating Temperature: 170 max.

Wave Soldering Curve

(Curve data not provided in the source text)

Soldering Iron Rework Conditions

Storage Environment

• Store products under the following conditions and use within 6 months after delivery.
• Temperature: 10~30, Relative Humidity: 60% max.
• Solder NTC within 168 hours after opening the moisture-proof packaging. After opening the moisture-proof packaging, store the NTC in the moisture-proof packaging with a desiccant and HIC card, and maintain the above state.
• If the storage period exceeds 6 months, or the indicator color of the accompanying HIC card changes after the package is opened, bake the product (60 * 168hr) before soldering.
• Reference data for baking when product humidity exceeds requirements before reflow soldering, or when exposure time exceeds shelf life (shelf life after baking starts from zero):
• Do not store products in corrosive substances such as sulfur, chlorine gas, or acid, as this will cause lead oxidation and reduce solderability.
• To avoid the influence of moisture, dust, etc., products should be stored on shelves.
• Products stored in warehouses should avoid thermal shock, vibration, and direct sunlight.

Usage Precautions

• The working environment temperature should be within the range specified by the technical conditions.
• Do not install near heat-generating or combustible components; maintain a clearance of more than 3 mm to avoid damaging the components.
• Wear gloves before touching the leads.
• This specification guarantees the quality of our products as individual units. When our products are installed in your products, please ensure that your products have been effectively evaluated and confirmed according to your company's specifications.
• If your company's trial use of our products exceeds the product functions defined in this test specification, we will not be responsible for any failures caused thereby.
• When the NTC is damaged, the failure may lead to a short circuit. To prevent dangerous situations such as ignition, smoking, or fire during a short circuit, please use components such as fuses in the circuit to set up an automatic failsafe function.

Applications

• Circuit Protection
• Industrial Equipment
• Communication Equipment
• Consumer Electronics
• Automotive Electronics

Features

• Advanced encapsulation process, encapsulation material meets UL94-V0.
• Compact structure, small size, space-saving.
• Superior high-temperature and high-humidity performance.
• Strong surge suppression capability.
• SMD tape reel packaging, suitable for lead-free reflow/wave soldering automatic mounting.