Surface mount thermistor STE SMDNTC2522N18001MK0 featuring UL94V0 encapsulation

Product Specification

Product Overview

The SMD-2522 Series is a series of encapsulated surface mount NTC thermistors designed for circuit protection and temperature sensing applications. These thermistors feature advanced encapsulation technology with UL94-V0 compliant materials, offering a compact and space-saving design. They exhibit excellent high-temperature and high-humidity performance, along with strong surge suppression capabilities. Packaged in SMD tape reels, they are suitable for lead-free reflow and wave soldering automatic mounting. Key applications include industrial equipment, communication devices, consumer electronics, and automotive electronics.

Product Attributes

• Brand: Songtian ()
• Series: SMD-2522
• Encapsulation Material: Meets UL94-V0
• Packaging: SMD Tape Reel
• Soldering Compatibility: Lead-free reflow/wave soldering
• Foot Shape: Inner fold (N)

Technical Specifications

Reliability Testing

Packaging Information

Tape Packaging (Unit: mm)

13-inch Reel Dimensions (Unit: mm)

Carton Packaging

Foot shape N: Inner fold

Curves

Resistance-Temperature Characteristic Curve

Maximum Current Derating Curve

Formula: ITa = [1-(Ta-25)/(Tu-25)]Imax

Where: TU: Upper limit of working temperature (), TL: Lower limit of working temperature (), Ta: Ambient temperature (), Imax: Maximum steady current (A)

Soldering Instructions

Lead-Free Reflow Soldering Curve

Conditions for reflow soldering:

• Soldering Temperature: 230260
• Soldering Time: 1030s
• Preheating Temperature: 170 max

Wave Soldering Curve

Iron Rework Soldering Conditions

Storage Environment

• Store products under the following conditions and use within 6 months of delivery.
• Temperature: 10~30, Relative Humidity: 60% max.
• Solder NTC within 168 hours after opening the moisture-proof packaging. After opening, store NTCs in the moisture-proof packaging with desiccant and HIC card, maintaining the above conditions.
• If the storage period exceeds 6 months, or the indicator color of the accompanying HIC card changes after opening, baking (60 * 168hr) is required before soldering.
• Reference data for baking when product humidity exceeds requirements before reflow soldering, after exposure time exceeds shelf life or when ambient temperature/humidity exceed requirements (shelf life restarts after baking).
• Do not store products in corrosive substances such as sulfur, chlorine gas, or acids, as this may cause pin oxidation and reduce solderability.
• To avoid the influence of moisture, dust, and other substances, products should be stored on shelves.
• Products stored in warehouses should avoid thermal shock, vibration, and direct sunlight.

Usage Precautions

• The operating ambient temperature should be within the specified technical range.
• Do not install close to heat-generating or flammable components; maintain a minimum spacing of 3mm to prevent damage.
• Wear gloves when handling the pins.
• This specification guarantees the quality of our products as individual components. When our products are installed in your products, please ensure that your products have been effectively evaluated and confirmed according to your company's specifications.
• We do not guarantee against failures caused by the use of our products beyond the scope defined in this test specification if your company's trial use exceeds the product's functions.
• In case of NTC damage, failure may result in a short circuit. To prevent hazardous situations such as ignition, smoking, or fire during a short circuit, implement an automatic fail-safe function using components like fuses in the circuit.