Rtv Potting Compound 1:1 Electronic Potting Silicone For Led Driver Power Supply

Product Specification

Rtv Potting Compound 1:1 Electronic Potting Silicone For Led Driver Power Supply Inverter Waterproof Potting Glue

Product Overview for RTV potting compound:

The core properties of silicone potting compounds are insulation, moisture resistance, good elasticity, and ease of handling. Typical applications include sealing general power modules, LED drivers, and general electronic components. Any electronic or electrical equipment that needs to operate stably for extended periods in complex and harsh environments represents a potential application scenario for silicone potting compounds.

From traditional power supply and lighting fields, its applications have expanded comprehensively to cutting-edge industries such as new energy, automotive electronics, and the Internet of Things, making it one of the cornerstone materials for modern high-reliability electronic product design.

Key Features for RTV potting compound:

Insulation Protection: Prevents short circuits and creepage.

Physical Protection: Shockproof, impact-resistant, and drop-proof.

Environmental Protection: Moisture-proof, waterproof, dustproof, corrosion-proof, and mildew-proof.

Thermal Management: (Special heat-resistant type) Helps dissipate heat.

Stress Buffering: Relieves internal stress caused by thermal expansion and contraction between different materials.

Technical Parameters for RTV potting compound:

Appearance (A/B): White Liquid / Grey Liquid

Curing Shrinkage: Very Low

Water Absorption (24h): 0.01~0.02%

Hardness (Shore A): 45±5

Dielectric Strength: 18-25 kV/mm

Volume Resistivity: 1.0×10¹⁶ Ω·cm

Operating Temperature Range: -50°C ~ +250°C

Compliance: RoHS

Product Applications for RTV potting compound:

Sealing of general power modules, LED drivers, and common electronic components; photovoltaic inverters, automotive electronic controls, power supplies, heat-generating components requiring heat dissipation; automotive electronics; charging piles; coils; transformers; complex PCBAs with precision components; batteries, etc.

Usage Instructions for RTV potting compound:

Proportion: A: B=10:1 (weight ratio)
Operating time: 100G mixing capacity at 25 ℃, operating time: 40 minutes
Curing time: surface drying for 2-8 hours, complete curing for 24 hours

1. Preparation:Ensure components and housings are clean and dry.

2. Mixing:Weigh and mix components A and B in a 1:1 ratio until uniform.

3. Potting:For deep cavities, pour slowly to allow natural filling; consider multiple pours if necessary.

4. Curing:Allow to cure fully at room temperature for 4-12 hours, or use heat to accelerate.

Important Notes for RTV potting compound:

For optimal deep cure, avoid operating in very high humidity environments.

When potting deep cavities, monitor flow to avoid air pockets.

Packaging & Storage for RTV potting compound:

Standard Packaging: Component A 25kg/drum, Component B 25kg/drum.

Store in a cool, dry place. Shelf life: 6 months.

FAQ for RTV potting compound:

Q: What does "excellent deep cure" mean? A: It means the compound cures evenly throughout thick layers or deep cavities, preventing a tacky, uncured center and ensuring consistent protection.

Q: What is the benefit of low shrinkage? A: It avoids introducing internal stress on precision components and solder joints, preventing damage or performance drift.

Q: Is a RoHS certificate available? A: Yes, a compliance test report can be provided upon request.

Q: Is it sensitive to moisture? A: It is slightly moisture-sensitive before cure. Reseal containers and store in a cool, dry place after use.

Q: Can it be used for sensors with plastic housings? A: Yes, its low stress and good elasticity make it ideal for protecting sensitive elements and providing a seal.