Thermally Conductive Potting Compound HN-8808B - Black, 0.5 W/M·K, EMI Shielding

Product Specification

Thermally Conductive Potting Compound HN-8808B - Black, 0.5 W/M·K, EMI Shielding

Product Overview for Silicone Potting Compound:

The HN-8808B Black Potting Compound is engineered for high-heat-density electronic devices. With a high thermal conductivity of 0.5 W/M·K, it effectively transfers heat away from hotspots, significantly lowering core component operating temperatures. The black fillers also provide a degree of Electromagnetic Interference (EMI) shielding, offering a dual solution for thermal management and EMC compliance, thereby extending device lifespan.

Key Performance Parameters for Silicone Potting Compound:

* Appearance (Mixed): Black elastomer

* Mix Ratio (A:B): 10 : 1 (by weight)

* Viscosity (A/B): Component A: 2000-2800 cP, Component B: 20-30 cP (GB/2794-1995)

* Density: 1.42±0.02 g/cm³ (GB/2794-1995)

* Pot Life (25°C): 40-60 minutes

* Cure Time (25°C): 4-6 hours (tack-free), 24 hours (full cure)

* Hardness (Shore A): 30-40 (GB/T531-1999)

* Volume Resistivity: ≥5.0×10¹⁴ Ω·cm (GB/T 31838.2-2019)

* Thermal Conductivity: 0.5±0.1 W/M·K (GB/T 38712-2020)

* Dielectric Strength: ≥14 kV/mm

* Dielectric Constant: ≤3.5

* Elongation at Break: ≤100%

Product Highlights for Silicone Potting Compound:

* Efficient Thermal Management: Excellent thermal conductivity helps reduce temperatures of power components (e.g., MOSFETs, IGBTs) by 10-30°C.

* EMI Shielding: Effectively attenuates electromagnetic radiation, improving product EMC performance.

* Strong Adhesion: Specially optimized for metal substrates like aluminum, preventing delamination under thermal cycling.

* Comprehensive Environmental Protection: Waterproof, moisture-proof, dust-proof, and resistant to chemical vapors, suitable for harsh conditions.

* Excellent Flame Retardancy: The silicone rubber base offers good flame retardancy, enhancing end-product safety.

Application Areas for Silicone Potting Compound:

* High-power LED drivers, automotive HID ballasts

* New energy vehicle onboard chargers (OBC), motor controllers

* Industrial power supplies, servo drives

* PV inverters, telecom base station power modules

Detailed Operating Guide for Silicone Potting Compound:

1. Surface Preparation: Thoroughly clean heat sink bases (e.g., aluminum shells), removing oxide layers and oils to ensure optimal thermal transfer and adhesion.

2. Accurate Weighing: Use a scale with 0.1g accuracy. Strictly follow the 10:1 weight ratio.

3. Thorough Mixing: Mix both components thoroughly for at least 3 minutes in a clean container. Pay special attention to scraping the bottom to incorporate settled fillers for uniformity.

4. Vacuum Degassing: Degas the mixed compound under a vacuum of -0.095 MPa for 3-5 minutes. This step is crucial for deep fills to avoid bubble entrapment causing localized overheating.

5. Potting and Curing: Pour the compound slowly into the device. Gentle vibration can assist in de-airing and leveling. Cure at 25°C. Handling can occur after initial cure; optimal thermal and mechanical properties are achieved after 7 days.

Key Precautions for Silicone Potting Compound:

* Filler Settling: Fillers in Component A will settle upon storage. Stir thoroughly before use! Otherwise, it will lead to incorrect mix ratio and performance loss.

* Do Not Heat Cure: Heating is strictly prohibited as it will cause violent foaming, destroying the structure.

* Thermally Conductive, Not Electrically Conductive: This is an electrically insulating thermal material, not for electrical conduction.

* Device Sealing: Curing produces minimal by-products. Do not hermetically seal the device enclosure for 3 days (summer) to 7 days (winter).

Packaging & Storage for Silicone Potting Compound:

* Standard Packaging: 22kg/set (20kg A + 2kg B); 11kg/set (10kg A + 1kg B).

* Storage Conditions: Store in a cool, dry place away from direct sunlight. Ideal storage temperature: 10-30°C.

* Shelf Life: 6 months in original, unopened containers from date of manufacture.

FAQ for Silicone Potting Compound:

1. Q: How does the thermal performance compare to competitors?

A: A thermal conductivity of 0.5 W/M·K is considered high for condensation-cure silicones, effectively addressing most high-heat applications. We can provide real application data for reference.

2. Q: Is it electrically conductive?

A: It is completely non-conductive. Its volume resistivity is on the order of 10¹⁴ Ω·cm, making it an excellent insulator.

3. Q: How is the adhesion to aluminum substrates? Can it pass thermal shock tests?

A: This is a core strength. Its elastomeric properties and optimized adhesion formula effectively absorb CTE mismatch between aluminum and components, passing -40°C to 125°C for 1000 cycles.

4. Q: Can this be used if my product's heat sink is plastic?

A: Yes, but confirm the plastic housing (e.g., PBT, Nylon) can withstand the long-term 200°C service temperature. We recommend compatibility and temperature testing first.

5. Q: Can you customize for higher thermal conductivity?

A: Yes. We have strong R&D capability and can offer customized formulas with thermal conductivity up to 1.0 W/M·K or higher. Please contact our engineers to discuss.