| Payment Terms | T/T |
| Delivery Time | 5-7days |
| Packaging Details | 25KG/ Iron Drum |
| Brand Name | Hanast |
| Model Number | HN-5508A/B |
| Certification | ROHS,SGS |
| Place of Origin | Guangdong, China |
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Product Specification
| Payment Terms | T/T | Delivery Time | 5-7days |
| Packaging Details | 25KG/ Iron Drum | Brand Name | Hanast |
| Model Number | HN-5508A/B | Certification | ROHS,SGS |
| Place of Origin | Guangdong, China | ||
| High Light | heavy-duty epoxy potting glue ,insulating moisture-proof resin ,epoxy potting compound for transformers | ||
Heavy-Duty Epoxy Potting Glue For Transformers, Sensors & PCB | Premium Insulating & Moisture-Proof Resin
Description of Epoxy Potting Compound
HN-5508 is a premium, low-viscosity epoxy resin designed for high-performance potting, encapsulation, and sealing applications. Engineered to cure reliably at room or low temperatures, it features an extended working time and exceptional flowability. This allows the liquid resin to easily penetrate tight gaps, intricate clearances, and complex component geometries without trapping air.
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technical parameter of epoxy potting compound:
| efore curing | builder | Epoxy resin 5508 | Curing agent 5508 |
| pigment | Black / White et al | Ruburn / transparent surface | |
| A sticky epoxy resin water | r liquid specific | ||
| c gravity, g / cm3 | 1.4-1.5 | 1.05 | |
| Viscosity of 25℃ | 4,500—6,000cp s | 150—250cp storage | |
| e Period (25℃) | Six months | x months | |
|
processabili
|
mixing ratio | A: B =5:1 (weight ratio) | |
| Available for a time of 25℃ | 2-3H (100g mix) | ||
| curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H | ||
| After curing | 2 Tensile strength of kg/cm | 16-18 | |
| 2 Compressive strength of kg/cm | 18-22 | ||
| Resistance to the voltage of kv/mm | 20-22 | ||
| Surface resistance ofΩ-cm |
14 1.2*10 |
||
| Volume resistance ofΩ-cm |
15 1.1*10 |
||
| contraction percentage% | 0.35-0.55 | ||
| Water absorption rate was 25℃ * 24H | <0.03% | ||
| The hardness of SHORE A | 85-95 |
|
distortion temperature ℃ |
130-150 |
| low temperature resistant ℃ | -30 |
Product Features of epoxy potting compound:
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Application of epoxy resin potting:
Physical Properties of epoxy potting compound:
| fore curing | builder | Epoxy resin 5508 | Curing agent 5508 |
| pigment | Black / White et al | Ruburn / transparent surface | |
| A sticky epoxy resin water | r liquid specific | ||
| c gravity, g / cm3 | 1.4-1.5 | 1.05 | |
| Viscosity of 25℃ | 4,500—6,000cp s | 150—250cp storage | |
| e Period (25℃) | Six months | x months | |
|
processabili
|
mixing ratio | A: B =5:1 (weight ratio) | |
| Available for a time of 25℃ | 2-3H (100g mix) | ||
| curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H | ||
| After curing | 2 Tensile strength of kg/cm | 16-18 | |
| 2 Compressive strength of kg/cm | 18-22 | ||
| Resistance to the voltage of kv/mm | 20-22 | ||
| Surface resistance ofΩ-cm |
14 1.2*10 |
||
| Volume resistance ofΩ-cm |
15 1.1*10 |
||
| contraction percentage% | 0.35-0.55 | ||
| Water absorption rate was 25℃ * 24H | <0.03% | ||
How to use epoxy potting compound:
- Surface Prep: Clean and dry the substrate thoroughly.
- Weigh & Mix: Combine Part A and Part B at a strict 5:1 weight ratio. Stir well for 2–3 minutes.
- Degas: Vacuum de-air for 3–5 minutes to remove bubbles.
- Apply & Cure: Pour slowly and allow to cure at room temperature or accelerate with heat.
25kg/barrel
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Company Details
Business Type:
Manufacturer,Agent,Trading Company
Year Established:
2010
Total Annual:
5000000-10000000
Employee Number:
50~100
Ecer Certification:
Verified Supplier
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