Shenzhen Hanast New Material co.,LTD
| Flame Retardant Rating | UL94 V-0 |
| Density | 2.65±0.05 g/cm³ |
| Temperature Range | -40°C to +150°C |
| Hardness | 45-50 Shore A |
| Thermal Conductivity | 3.0 W/m·K |
| Viscosity | 11000±2000 mPa·s |
| Curing Type | Two-Component Addition Cure (1:1 Mix Ratio) |
| Dielectric Strength | ≥18 kV/mm |
| Appearance | Grey Liquid (A+B Components) |
| Packaging Details | 20kg/barrel or 200kg/drum, export-grade packaging with moisture-proof seal and palletized shipping |
| Curing Time at 25°C | 4-6 hours (tack-free), 24 hours (full cure) |
| Delivery Time | 3-5 working days for sample, 7-15 days for bulk order |
| Payment Terms | T/T,L/C,PayPal,WU |
| Supply Ability | 50000 Kilograms per Month |
| Place of Origin | Guangdong, China |
| Certification | ROHS |
| Brand Name | HanasT |
| Model Number | HN-8830A/B |
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Product Specification
| Flame Retardant Rating | UL94 V-0 | Density | 2.65±0.05 g/cm³ |
| Temperature Range | -40°C to +150°C | Hardness | 45-50 Shore A |
| Thermal Conductivity | 3.0 W/m·K | Viscosity | 11000±2000 mPa·s |
| Curing Type | Two-Component Addition Cure (1:1 Mix Ratio) | Dielectric Strength | ≥18 kV/mm |
| Appearance | Grey Liquid (A+B Components) | Packaging Details | 20kg/barrel or 200kg/drum, export-grade packaging with moisture-proof seal and palletized shipping |
| Curing Time at 25°C | 4-6 hours (tack-free), 24 hours (full cure) | Delivery Time | 3-5 working days for sample, 7-15 days for bulk order |
| Payment Terms | T/T,L/C,PayPal,WU | Supply Ability | 50000 Kilograms per Month |
| Place of Origin | Guangdong, China | Certification | ROHS |
| Brand Name | HanasT | Model Number | HN-8830A/B |
| High Light | 3.0 W/mK thermally conductive potting compound ，silicone potting compound for IGBT power module ，UL94 V-0 PCB encapsulation compound | ||
The HN-8830A/B is a high-performance, two-component addition-cure silicone potting compound engineered for demanding power electronics applications. With an industry-leading 3.0 W/m·K thermal conductivity, it efficiently dissipates heat from IGBT modules, power semiconductors, BMS circuits, and PCB assemblies, ensuring long-term reliability under extreme thermal cycling conditions.
| Application Field | Specific Uses |
|---|---|
| New Energy Vehicles (EV) | On-Board Charger (OBC), Battery Management System (BMS), DC-DC Converter, Traction Inverter, Motor Controller, PTC Heater Controller |
| Power Electronics | IGBT Module Encapsulation, Power MOSFET Packaging, SiC/GaN Power Device Potting, High-Voltage Transformer, Power Factor Correction (PFC) Module |
| Industrial Electronics | Variable Frequency Drive (VFD), Servo Drive, Industrial UPS, Welding Machine Controller, High-Power LED Driver |
| Energy Storage Systems | Battery Pack Module Sealing, Energy Storage Converter (PCS), Grid-Tie Inverter, Solar Junction Box |
| 5G & Telecom | 5G Base Station Power Supply, RRU/AAU Encapsulation, Telecom Rectifier Module |
| Parameter | Value |
|---|---|
| Appearance (Part A/B) | Grey Liquid / Transparent to Slightly Yellow Liquid |
| Mix Ratio (A:B by Weight) | 1:1 |
| Mixed Viscosity | 11,000 ± 2,000 mPa·s @ 25°C |
| Pot Life @ 25°C | 60-90 minutes |
| Curing Time @ 25°C | 4-6 hours (tack-free), 24 hours (full cure) |
| Hardness | 45-50 Shore A |
| Thermal Conductivity | 3.0 W/m·K (ASTM D5470) |
| Dielectric Strength | ≥18 kV/mm |
| Volume Resistivity | ≥1.0 * 10¹⁴ Ω·cm |
| Flame Retardant Rating | UL94 V-0 (Equivalent) |
| Temperature Range | -40°C to +150°C |
| Density (Cured) | 2.65 ± 0.05 g/cm³ |
| Linear Shrinkage | <0.1% |
| Water Absorption (24h) | <0.2% |
As a leading silicone potting compound manufacturer in China, Shenzhen Hanast New Material Co., Ltd. provides full OEM/ODM customization services. Our 40,000-square-meter facility with advanced thermal conductivity testers, laser particle size analyzers, and high-voltage dielectric strength testers ensures consistent batch-to-batch quality. We offer free samples for customer evaluation, custom formulation adjustments for specific viscosity, hardness, or thermal conductivity requirements, and comprehensive MSDS/TDS documentation with every shipment. Contact our engineering team today to discuss your IGBT potting, BMS encapsulation, or PCB potting project requirements.
Company Details
Business Type:
Manufacturer,Agent,Trading Company
Year Established:
2010
Total Annual:
5000000-10000000
Employee Number:
50~100
Ecer Certification：
Verified Supplier
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