Transparent 2 Part RTV Silicone Potting Compound HN-8808AB 10:1 Ratio Encapsulat

HN-8808AB is a premium two-part condensation cure RTV-2 silicone potting compound specifically developed for optoelectronic applications that require post-potting visual inspection. With a convenient 10:1 mixing ratio, exceptional clarity, and robust waterproof insulation performance, it is the ideal encapsulation solution for LED drivers, automotive electronic modules, and precision sensor assemblies.

• Optically Clear Formulation: Transparent light yellow appearance after curing enables on-board visual inspection of components, solder joints, and LED arrays without removing the encapsulation—a critical advantage for LED driver PCB assemblies and quality control workflows.
• Superior Waterproof Protection: Achieves IP67-equivalent moisture sealing with high volume resistivity (≥5.0×10¹⁴ Ω·cm) and dielectric strength (≥14 kV/mm), effectively protecting sensitive electronics from humidity, condensation, and water ingress in outdoor and harsh environment deployments.
• 10:1 Convenient Mixing Ratio: The industry-preferred 10:1 ratio simplifies metering and dispensing operations on automated production lines. Compatible with static mixer nozzles and pneumatic dispensing equipment for high-volume manufacturing of LED modules and automotive ECU assemblies.
• Wide Temperature Resilience: Maintains elastomeric properties across an extreme temperature range of -50°C to 200°C. Low thermal expansion stress prevents wire bond fatigue and component cracking, making it suitable for under-hood automotive electronics, outdoor LED lighting, and industrial power modules.
• Room Temperature Cure: Condensation-cure mechanism cures at ambient temperature (25°C) with 4-6 hours to full set and 40-60 minutes of working time. No oven or heat curing required—reducing energy costs and eliminating thermal stress on heat-sensitive components during the encapsulation process.
• Low Stress & Non-Corrosive: Neutral condensation cure releases no corrosive by-products. Shore A 30-40 softness combined with low shrinkage provides stress-relieving encapsulation for delicate wire bonds, SMD components, and flexible PCB assemblies—no cracking, no delamination over thermal cycling.

• Standard Packaging: 50kg/set (Component A 25kg + Component B 25kg) in sealed plastic drums
• Alternative Packaging: 40kg/set (Component A 20kg + Component B 20kg)
• Custom Packaging: Available upon request for OEM/ODM customers
• Shelf Life: 6 months (best used within 3 months) when stored in a cool, dry place
• Storage Conditions: Seal containers immediately after use. Avoid exposure to rain, direct sunlight, and moisture
• Transport: Non-dangerous goods. No special transport classification required

1. Ensure substrate surfaces are clean, dry, and free from oil or contaminants before application.
2. Mix Component A and Component B at a 10:1 ratio by weight. Stir thoroughly until uniform color is achieved.
3. Degas the mixture under vacuum (recommended 5-10 minutes at -0.1 MPa) to remove entrapped air bubbles for optimal optical clarity.
4. Pour or dispense the mixed compound into the mold or directly onto the PCB assembly. Allow the material to self-level.
5. Cure at room temperature (25°C) for 4-6 hours to achieve full mechanical and electrical properties.

Shenzhen Hanast New Material offers tailored silicone potting solutions with adjustable viscosity, hardness, thermal conductivity, and curing profiles. Our 5-step custom formulation process delivers sample batches within 3-5 working days.