Shenzhen Hanast New Material co.,LTD
| Viscosity Part B | 4500~5000 mPa·s at 25°C |
| Curing Time | 4-12 hr at 25°C / 0.2 hr at 80°C |
| Color | Grey、White、Black |
| Density | 1.50±0.05 g/cm³ |
| Flame Retardancy | UL 94 V-0 |
| Payment Terms | T/T,L/C,PayPal,WU |
| Mixing Ratio | 1:1 (Weight and Volume) |
| Viscosity Part A | 4500~5000 mPa·s at 25°C |
| Thermal Conductivity | ≥0.76 W/m·K |
| Packaging Details | 20kg/drum or 200kg/drum, export-grade moisture-proof packaging |
| Hardness After Curing | Shore A 50±5 (Flexible Elastomer) |
| Temperature Range | -50°C to +250°C |
| Target Application | IGBT Module, Charging Pile, Power Supply, High-Voltage Transformer, Battery Pack |
| Operating Time | 0.3-0.4 hr at 25°C |
| Dielectric Strength | 18-25 kV/mm |
| Product Type | Low Viscosity RTV Two Component Addition Cure Silicone |
| Delivery Time | 3-5 working days for sample, 7-15 days for bulk order |
| Volume Resistivity | ≥1.0×10¹⁶ Ω·cm |
| Supply Ability | 500 Kilograms per Month |
| Low Viscosity | 4500-5000 mPa·s — Excellent PCB Penetration |
| Model Number | HN-8806 |
| Certification | UL 94 V-0, RoHS, REACH |
| Brand Name | HANAST |
| Place of Origin | Guangdong, China |
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Product Specification
| Viscosity Part B | 4500~5000 mPa·s at 25°C | Curing Time | 4-12 hr at 25°C / 0.2 hr at 80°C |
| Color | Grey、White、Black | Density | 1.50±0.05 g/cm³ |
| Flame Retardancy | UL 94 V-0 | Payment Terms | T/T,L/C,PayPal,WU |
| Mixing Ratio | 1:1 (Weight and Volume) | Viscosity Part A | 4500~5000 mPa·s at 25°C |
| Thermal Conductivity | ≥0.76 W/m·K | Packaging Details | 20kg/drum or 200kg/drum, export-grade moisture-proof packaging |
| Hardness After Curing | Shore A 50±5 (Flexible Elastomer) | Temperature Range | -50°C to +250°C |
| Target Application | IGBT Module, Charging Pile, Power Supply, High-Voltage Transformer, Battery Pack | Operating Time | 0.3-0.4 hr at 25°C |
| Dielectric Strength | 18-25 kV/mm | Product Type | Low Viscosity RTV Two Component Addition Cure Silicone |
| Delivery Time | 3-5 working days for sample, 7-15 days for bulk order | Volume Resistivity | ≥1.0×10¹⁶ Ω·cm |
| Supply Ability | 500 Kilograms per Month | Low Viscosity | 4500-5000 mPa·s — Excellent PCB Penetration |
| Model Number | HN-8806 | Certification | UL 94 V-0, RoHS, REACH |
| Brand Name | HANAST | Place of Origin | Guangdong, China |
| High Light | Low viscosity RTV silicone potting compound ，Two component 1:1 silicone potting ，IGBT power module encapsulation silicone | ||
HN-8806 is a low-viscosity RTV two-component 1:1 addition cure silicone potting compound specifically developed for IGBT power module encapsulation and EV charging pile electronics protection. With its 4500-5000 mPa·s flowability, it penetrates densely packed PCB assemblies and under-fills tall components with ease — ideal for high-voltage power modules, fast-charging adapters, and battery pack sealing. Delivers 0.76 W/m·K thermal conductivity, UL 94 V-0 flame retardancy, and 18-25 kV/mm dielectric strength for demanding power electronics applications. RoHS and REACH compliant with factory-direct bulk supply available.
| Parameter | Part A | Part B |
|---|---|---|
| Appearance (Before Curing) | Grey Fluid | White Fluid |
| Viscosity at 25°C | 4500~5000 mPa·s | 4500~5000 mPa·s |
| Density at 25°C | 1.50±0.05 g/cm³ | 1.50±0.05 g/cm³ |
| Mixing Ratio (A:B) | 1:1 (Weight & Volume) | |
| Operating Time | 0.3-0.4 hr at 25°C | |
| Curing Condition | 4-12 hr at 25°C / 0.2 hr at 80°C | |
| Property (After Curing) | Value | Test Standard |
|---|---|---|
| Appearance | Grey Elastomer | Visual |
| Hardness | Shore A 50±5 | GB/T 531.1-2008 |
| Thermal Conductivity | ≥0.76 W/m·K | GB/T 10297-1998 |
| Volume Resistivity | ≥1.0*10¹⁶ Ω·cm | GB/T 1692-92 |
| Dielectric Strength | 18-25 kV/mm | GB/T 1693-2007 |
| Moisture Absorption (24h, 25°C) | 0.01-0.02% | GB/T 8810-2005 |
| Expansivity | 210 µm/(m·°C) | GB/T 20673-2006 |
| Temperature Resistance | -50 to +250°C | Measured |
| Flame Retardancy | UL 94 V-0 (3mm sample) | UL 94 |
Encapsulates IGBT modules in inverters, motor drives, and power converters. Low viscosity ensures complete under-fill beneath power semiconductor substrates.
Company Details
Business Type:
Manufacturer,Agent,Trading Company
Year Established:
2010
Total Annual:
5000000-10000000
Employee Number:
50~100
Ecer Certification：
Verified Supplier
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