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Transparent Fast Curing Silicone Potting Compound HN-8808 25A ODM for IGBT Module LED Encapsulation Protection
Transparent Fast Curing Silicone Potting Compound HN-8808
HN-8808 is a transparent fast-curing two-component silicone potting compound optimized for IGBT power module encapsulation and high-voltage LED array protection. Achieves full cure in 8-12 hours at room temperature with a 1-2 hour pot life—balancing production speed with ample working time. The combination of 18-25 kV/mm dielectric strength, low 2.5-3.0 dielectric constant, and Shorre A 25 flexible stress relief makes it ideal for power semiconductor assemblies. Full ODM customization from our 40,000 m² Shenzhen facility.
Key Features
⚡ IGBT Module Optimized Insulation
Purpose-engineered for IGBT power module encapsulation where high dielectric withstand (18-25 kV/mm) and low dielectric loss (≤4×10⁻³ at 1 MHz) are critical. The low 2.5-3.0 dielectric constant minimizes parasitic capacitance and switching losses in high-frequency power conversion circuits, motor drives, and traction inverters.
⏱️ 8-12 Hour Fast Room Temp Cure
Full encapsulation cure in just 8-12 hours at ambient 25 °C—significantly faster than many competing 24+ hour formulations. This reduces work-in-progress inventory and accelerates production throughput. 1-2 hour pot life allows single-batch mixing for large or multiple IGBT module assemblies without rushing.