High Transparency Epoxy Potting Compound 2:1 Self-Leveling AB Glue 70D for LED

Product Specification

High Transparency Epoxy Potting Compound HN-5506A/B – 2:1 Self-Leveling AB Glue

Hanast HN-5506A/B is a high transparency two-component epoxy potting compound designed for electronic encapsulation applications where optical clarity and high voltage insulation are critical. With a 2:1 mix ratio by weight and self-leveling low-viscosity formulation, it flows effortlessly into narrow gaps and complex component structures before curing to a crystal-clear, hard protective layer at 70-75 Shore D.

Key Features

• High Optical Transparency – Maintains exceptional clarity and light transmittance after full cure, ideal for LED modules and applications where visual inspection or light emission is required
• Self-Leveling Low Viscosity – Naturally flows to fill complex geometries without air entrapment, minimizing manual intervention during dispensing
• Excellent High Voltage Insulation – Superior dielectric strength prevents current leakage and short circuits in high voltage electronic assemblies
• 2:1 Convenient Mix Ratio – Standard weight ratio (Part A 20Kg : Part B 10Kg per set), compatible with automatic dispensing equipment for mass production
• Moisture-Proof & Chemical Resistant – Forms a robust protective barrier against humidity, water ingress, vibration, and chemical corrosion
• Anti-Tamper Security – Cures to a hard, disassembly-resistant finish that provides confidentiality protection and reverse-engineering prevention for sensitive circuit boards
• RoHS & REACH Compliant – Meets international environmental standards for electronics manufacturing supply chains

Technical Specifications

Recommended Applications

• LED Module Encapsulation – Crystal-clear potting for LED display modules, LED strips, and lighting fixtures requiring uninterrupted light transmission and weatherproof protection
• High Voltage Insulation Potting – Reliable dielectric encapsulation for transformers, high voltage flyback transformers, ignition coils, and power supply modules
• Capacitor & Electronic Component Sealing – Moisture-proof and vibration-resistant encapsulation for sensitive electronic components and circuit boards
• Anti-Tamper PCB Protection – Hard, non-removable seal that prevents reverse engineering and unauthorized access to proprietary circuit designs
• Decorative Craft Casting – High-gloss transparent casting resin for handmade crafts, jewelry, and decorative objects requiring optical clarity

Wholesale Supply & China Factory Direct

As a bulk epoxy potting compound manufacturer in China, Hanast supplies HN-5506A/B in standard 30 kg sets with full MSDS and TDS documentation per batch. Sample orders shipped via FedEx/DHL express (3-5 working days), bulk orders dispatched by sea freight with 10-15 days production lead time. Custom packaging and private label options available for OEM partners.

Mixing & Application Guide

1. Weigh Part A and Part B at a precise 2:1 ratio by weight (use an electronic scale, not volume measurement)
2. Mix thoroughly for 2-3 minutes until uniformly blended
3. Vacuum degas for 3-5 minutes to eliminate entrapped bubbles
4. Pour slowly into the prepared mold or component cavity within 30-40 minute pot life
5. Allow to cure at room temperature (25°C) for 12-24 hours, or heat at 60°C for 2-3 hours for faster production turnaround

Contact us today to request a free sample, discuss custom formulations, or obtain wholesale pricing from our China factory.