| Payment Terms | T/T |
| Delivery Time | 5-7days |
| Packaging Details | 25KG/ Iron Drum |
| Name | Epoxy Resin Ab Glue For Electronic Potting |
| Mix ratio | 2:1 |
| Color | Clear |
| Features | High transparency, high hardness, and excellent insulation properties. |
| Application | LED Modules, Lighting Fixtures, High-Voltage Components, etc. |
| Shelf time | 6months |
| Type | Transparent Electronic Potting Ab Glue |
| Sample | 3kg |
| Customization | Support |
| Hardness | 70-75±3 shore D |
| Brand Name | Hanast |
| Model Number | HN-5506A/B |
| Certification | ROHS,SGS |
| Place of Origin | Guangdong, China |
View Detail Information
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Product Specification
| Payment Terms | T/T | Delivery Time | 5-7days |
| Packaging Details | 25KG/ Iron Drum | Name | Epoxy Resin Ab Glue For Electronic Potting |
| Mix ratio | 2:1 | Color | Clear |
| Features | High transparency, high hardness, and excellent insulation properties. | Application | LED Modules, Lighting Fixtures, High-Voltage Components, etc. |
| Shelf time | 6months | Type | Transparent Electronic Potting Ab Glue |
| Sample | 3kg | Customization | Support |
| Hardness | 70-75±3 shore D | Brand Name | Hanast |
| Model Number | HN-5506A/B | Certification | ROHS,SGS |
| Place of Origin | Guangdong, China |
High Transparency Epoxy Potting Compound For Electronics 2:1 Self-Leveling AB Glue, Ideal For LED Modules, Sensitive Components & High Voltage Insulation
Description of Epoxy Potting Compound
The 2:1 Transparent Epoxy Potting Compound is a two-component epoxy resin encapsulation material designed to be mixed at a weight ratio of 2:1 (Part A:Part B). Characterized by its complete transparency, high hardness upon curing, and excellent insulating properties, it is specifically engineered to provide moisture-proof, waterproof, sealing, and confidentiality protection for electronic components.
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technical parameter of epoxy potting compound:
Model: HN-5506A/B
Color:Transparent
Protective Performance: Upon curing, it forms a robust protective layer
that is moisture-proof, waterproof, shock-resistant, and resistant to chemical corrosion.
Curing time (25℃):12-24H
Hardness (shore D):70-75
Thermal conductivity
(w/m.k):0.2-0.3
Temperature resistance(℃):-40-120℃
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Product Features of epoxy potting compound:
Mixing Ratio: The recommended mixing ratio of the main agent to the curing agent is 2:1 (typically based on weight). Optical Clarity: Maintains high transparency and light transmittance after curing, making it ideal for applications with strict aesthetic requirements or those requiring light transmission. Electrical Insulation: Possesses excellent electrical insulation properties, effectively preventing current leakage and short circuits. Protective Performance: Forms a robust protective layer upon curing, offering resistance to moisture, water, vibration, and chemical corrosion.
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Application of epoxy resin potting:
Electronic Packaging: Used for the insulating casting and potting of transformers, capacitors, and LED modules. Decorative Crafts: Characterized by high transparency and excellent surface gloss, it is frequently utilized as a casting resin for crafting handmade items or as a protective surface coating for rigid decorative objects. Product Confidentiality: Due to its hard texture and resistance to disassembly once cured, it is commonly employed to provide security and tamper-proof protection for circuit boards requiring protection against reverse engineering or unauthorized access.
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Company Details
Business Type:
Manufacturer,Agent,Trading Company
Year Established:
2010
Total Annual:
5000000-10000000
Employee Number:
50~100
Ecer Certification:
Verified Supplier
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