Shenzhen Hanast New Material co.,LTD
| Payment Terms | T/T、paypal |
| Supply Ability | 200ton/month |
| Delivery Time | 5-7days |
| Packaging Details | 25KG/bar |
| Wide Temperature Range | -50℃-200℃ |
| Keyword | Epoxy Potting Compound |
| Exterior | Liquid |
| Thermal Conductivity | 0.5 W/mK |
| Cure Time | 12 Hours(Customizable） |
| Mixing Ratio | 5:1 |
| Brand Name | Hanast |
| Model Number | HN-5508A/B |
| Certification | Rohs/Reach |
| Place of Origin | china |
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Product Specification
| Payment Terms | T/T、paypal | Supply Ability | 200ton/month |
| Delivery Time | 5-7days | Packaging Details | 25KG/bar |
| Wide Temperature Range | -50℃-200℃ | Keyword | Epoxy Potting Compound |
| Exterior | Liquid | Thermal Conductivity | 0.5 W/mK |
| Cure Time | 12 Hours(Customizable） | Mixing Ratio | 5:1 |
| Brand Name | Hanast | Model Number | HN-5508A/B |
| Certification | Rohs/Reach | Place of Origin | china |
| High Light | low shrinkage epoxy potting compound ，precision PCB encapsulation epoxy ，epoxy potting compound for PCB | ||
HN-5508 Epoxy Potting Compound cures at room or low temperature. Featuring low viscosity, long pot life and superior fluidity, it easily penetrates tiny gaps of products. The cured material is bubble-free with a smooth, glossy surface and high hardness. It also delivers great acid & alkali resistance, moisture resistance and anti-aging performance. Additionally, it boasts excellent electrical insulation, compression resistance and bonding strength. This product is widely applicable for potting, sealing, encapsulation, insulation and moisture protection of electronic devices and other related products.
1. Cures at room or low temperature, requiring no heating equipment for easy application.
2. Low viscosity and great fluidity allow full penetration into tiny gaps.
3. Cured material is bubble-free, smooth, glossy and high in hardness.
4. Excellent acid & alkali resistance, moisture proofness and anti-aging performance.
5. Superior insulation, compression resistance and bonding strength for component protection.
| Cure Time | 12 Hours (Customizable) |
| Mixing Ratio | 5:1 |
| Keyword | Epoxy Potting Compound |
| Hardness After Cure | 75±5 Shore A |
| Thermal Conductivity | 0.5 W/mK |
| Exterior | Liquid |
| Viscosity After Mixing | 1000 CPS |
| Temperture resistance | -40~120°C |
HN-5508 is widely used for transformers, resistors,filters,temperature sensors, temperature controllers, andpoint wires ring, high pressure package, aquariumequipment, anion generator, ultrasonic atomizer,electronic and electrical appliances and othercomponents requiring insulation, flame retardant andtemperature resistance. It has flame retardant insulation,sealing bonding, moisture-proof earthquake resistance,temperature resistance and other main functions.
The Product Technical Support and Services for the Silicone Potting Compound include:
- Comprehensive guidance on product usage and application
- Troubleshooting assistance for any issues that may arise during potting process
- Recommendations on potting techniques and best practices
- Information on product compatibility with various materials
- Assistance with selecting the right potting compound for specific applications
This product is 30 KG per group; including group A25 KG (barrel) and group B 5 KG (pot)
Company Details
Business Type:
Manufacturer,Agent,Trading Company
Year Established:
2010
Total Annual:
5000000-10000000
Employee Number:
50~100
Ecer Certification：
Verified Supplier
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