Shenzhen Hanast New Material co.,LTD
| Payment Terms | T/T |
| Packaging Details | 25KG/barrel |
| Color | Grey(can be customized) |
| Application | power modules, circuit boards, and high-voltage transformers |
| Name | 1:1 potting glue |
| Keyword | Silicone Potting Compound |
| Temperature Resistance | -50~+250°c |
| Thermal conductivity | Can be customized |
| Mix ratio | 1:1 |
| Keywords | potting electronics with silicone |
| Type | rtv potting compound |
| Customization | Support |
| Brand Name | Hanast |
| Model Number | HN-8806AB |
| Certification | ROHS SGS |
| Place of Origin | Guangdong, China |
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Product Specification
| Payment Terms | T/T | Packaging Details | 25KG/barrel |
| Color | Grey(can be customized) | Application | power modules, circuit boards, and high-voltage transformers |
| Name | 1:1 potting glue | Keyword | Silicone Potting Compound |
| Temperature Resistance | -50~+250°c | Thermal conductivity | Can be customized |
| Mix ratio | 1:1 | Keywords | potting electronics with silicone |
| Type | rtv potting compound | Customization | Support |
| Brand Name | Hanast | Model Number | HN-8806AB |
| Certification | ROHS SGS | Place of Origin | Guangdong, China |
| High Light | Flame Retardant silicone potting gel ，Raw silicone potting gel ，Flame Retardant raw silicone rubber | ||
Factory White High Thermal Conductivity Silicone Potting Compound For Circuit Board Connector Potting 1:1 Flexible Potting Glue Flame Retardant For Electronic Components
Product Description Thermal Conductivity Silicone Potting Compound:
Two-component addition type silicone potting rubber for electronic components, which can be cured into high-performance elastomer by room temperature or heating.
HN-8806 A/B (1:1)
* Features of Thermal Conductivity Silicone Potting Compound :
Flexible Rubber – Protects components against thermal cycling stress and mechanical shock.
Low shrinkage rate, no corrosion of components after curing.
Flame retardant, high and low temperature resistance from -50ºC to 250ºC (58°F to 432°F).
Excellent electrical properties and Thermal conductivity.
* Color : Grey (can be customized)
Technical Parameters of Thermal Conductivity Silicone Potting Compound
| Test Items | Test Standard | Units | Product test results | |||
| Part A | Part B | |||||
| Before curing | 1 | Appearance | --- | --- | Grey, fluid | White, fluid |
| 2 | Viscosity | GB/T10247-2008 | 25ºC, mPa·S | 4500~5000 | 4500~5000 | |
| 3 | Density | GB/T 13354-92 | 25ºC, g/cm³ | 1.50±0.05 | 1.50±0.05 | |
| 4 | Mixing Ratio (A : B) | 1:01 | Weight ratio | 100 | 100 | |
| Volume ratio | 100 | 100 | ||||
| 5 | Operating time | Measured | hr | 0.3-0.4 | ||
| 6 | Curing condition | Measured | hr | 4^12 (25ºC,initial cure) | ||
| 0.20 (80ºC) | ||||||
| After Curing | 7 | Appearance | --- | --- | Grey elastomer | |
| 8 | Hardness | GB/T 531.1-2008 | Shore A | 50±5 | ||
| 9 | Thermal conductivity | GB/T10297-1998 | w/m·k | ≥0.76 | ||
| 10 | Expansivity | GB/T20673-2006 | μm/(m,ºC) | 210 | ||
| 11 | Moisture Absorption | GB/T 8810-2005 | 24h,25ºC, % | 0.01~0.02 | ||
| 12 | Volume resistivity | GB/T 1692-92 | (DC500V),Ω · cm | 1.0×10¹⁵ | ||
| 13 | Dielectric intensity | GB/T 1693-2007 | Kv/mm(25ºC) | 18^25 | ||
| 14 | Temperature Resistance | Measured | ºC | -50~+250°c | ||
1. When used, weigh A and B according to proportion and then mix them evenly.
Mix thoroughly and evenly with a clean stirring device in a clean container, and then potting can be done.
It can also be sealed under a vacuum after removing the bubbles.
2. The surface of the potting element needs to be cleaned.
If the potting product is too large, it is recommended to potting in stages and then cure at room temperature (4-12hr) or by heating (80ºC-0.5hr).
3. For the automatic potting production line, in order to ensure accurate mixing ratio of A and B, Part A and Part B should be vacuumed respectively to remove the bubbles (the foaming time is 5-10 minutes), and then A and B should be pumped to the static mixer in proportion with a metering pump, and then potting can be done after mixing evenly.
Product applications of Thermal Conductivity Silicone Potting Compound
Encapsulation protection for motor controllers (MCU), on-board chargers (OBC), and voltage converters (DC-DC) modules.
Encapsulation of battery management system (BMS) control boards, acquisition modules, and charging pile modules, providing moisture resistance, insulation, heat dissipation, and shock resistance.
Local encapsulation of drive motor stator ends, sensors, etc.
LED vehicle lighting power supplies, navigation systems, instrument panel control modules, etc.
Encapsulation of photovoltaic inverters, combiner boxes, and solar junction boxes, providing long-term outdoor UV resistance and aging protection.
Various switching power supplies, AC-DC/DC-DC power modules, UPS uninterruptible power supplies, etc.
About us
Company Details
Business Type:
Manufacturer,Agent,Trading Company
Year Established:
2010
Total Annual:
5000000-10000000
Employee Number:
50~100
Ecer Certification：
Verified Supplier
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